Allicdata Part #: | AE10796-ND |
Manufacturer Part#: |
V5237BP-T |
Price: | $ 0.36 |
Product Category: | Fans, Thermal Management |
Manufacturer: | ASSMANN WSW Components |
Short Description: | HEATSINK ALUM ANOD SOT-32/TO-220 |
More Detail: | Heat Sink SOT-32, TO-220 Aluminum Board Level, Ve... |
DataSheet: | V5237BP-T Datasheet/PDF |
Quantity: | 1000 |
1 +: | $ 0.33390 |
10 +: | $ 0.31878 |
25 +: | $ 0.30290 |
50 +: | $ 0.29484 |
100 +: | $ 0.29087 |
250 +: | $ 0.27098 |
500 +: | $ 0.25502 |
1000 +: | $ 0.23112 |
5000 +: | $ 0.22315 |
Series: | -- |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | SOT-32, TO-220 |
Attachment Method: | Bolt On and Board Mounts |
Shape: | Rectangular, Fins |
Length: | 1.189" (30.20mm) |
Width: | 1.000" (25.40mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.500" (12.70mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | 15.00°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is becoming an increasingly important aspect of modern electronics. Heat is generated in electronic components due to powering the devices, and needs to be dissipated in order to maintain optimal working temperatures. Poor thermal management can lead to malfunctions, decreased life expectancy, and other undesirable effects. There are a variety of solutions available, but one of the most popular and efficient is the V5237BP-T heat sink. This device is capable of providing effective and reliable cooling in virtually any environment, and is well suited for applications that require high performance cooling.
The V5237BP-T heat sink is a passive cooling device that utilizes a simple design to dissipate and transfer heat away from the components it is installed on. It consists of a base plate made of aluminum which acts as a heat spreader, and a full-body finned aluminum heat sink. The overall structure is designed to maximize surface area, which increases the device’s ability to transfer heat away from the components. The base plate is designed to fit onto a standard TO-220 style integrated circuit, and the heat sink can be mounted using either screws or adhesive.
The working principle of the V5237BP-T is based on convection. As the component generates heat, it is transferred to the base plate and then dissipated into the air via the fins of the heat sink. The base plate is thermally conductive, meaning that it is able to effectively and quickly transfer the heat away from the component and spread it evenly over its surface. As the air flows over the fins of the heat sink, it picks up the heat and carries it away from the device. This creates a constant airflow of cooling air which keeps the component from overheating.
The V5237BP-T is an effective and reliable solution for applications where high performance cooling is required. Its simple design is easy to assemble and it is compatible with a variety of components. It is ideal for use in a variety of environmental conditions as it is resistant to moisture and corrosion. Additionally, its design is highly efficient, allowing it to cool components with a relatively small surface area while still maintaining optimal temperatures.
The V5237BP-T is a great option for cooling components in virtually any application. Its simple design and efficient operation make it an ideal choice for any environment where reliable cooling is necessary. It is cost-effective, easy to install, and highly efficient in transferring and dissipating heat away from components, making it a reliable, long-lasting solution for thermal management.
The specific data is subject to PDF, and the above content is for reference
Part Number | Manufacturer | Price | Quantity | Description |
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