Allicdata Part #: | AE10913-ND |
Manufacturer Part#: |
V5357 |
Price: | $ 0.07 |
Product Category: | Fans, Thermal Management |
Manufacturer: | ASSMANN WSW Components |
Short Description: | HEATSINK ALUM ANOD |
More Detail: | Heat Sink Aluminum Top Mount |
DataSheet: | V5357 Datasheet/PDF |
Quantity: | 1383 |
1 +: | $ 0.06300 |
10 +: | $ 0.03528 |
25 +: | $ 0.03352 |
50 +: | $ 0.03263 |
100 +: | $ 0.03219 |
250 +: | $ 0.02999 |
500 +: | $ 0.02822 |
1000 +: | $ 0.02558 |
5000 +: | $ 0.02470 |
Series: | -- |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | -- |
Attachment Method: | Press Fit |
Shape: | Cylindrical |
Length: | -- |
Width: | -- |
Diameter: | 0.122" (3.10mm) ID, 0.280" (7.11mm) OD |
Height Off Base (Height of Fin): | 0.138" (3.50mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are essential for the proper functioning of modern electronic components. The usage of heat sinks helps dissipate unwanted heat generated by electrical components such as microprocessors, power transistors, ICs, and other high-power devices. V5357 application field and working principle is one of the most widely used types of heat sinks in today’s electronic applications.
The V5357 design provides several benefits, including a higher level of heat dissipation, easy installation, and flexibility. V5357 heat sinks are designed for both cooling and protecting delicate electronic components such as integrated circuits and transistors. The main function of V5357 heat sinks is to spread out heat generated by the electronic components and dissipate it into the environment. It also works as a buffer to absorb thermal waves from the system and protect components from damage due to excessive heat.
The V5357 application field and working principle utilizes a direct contact heat sink type, where the heat spreader is in contact with the electronic component directly. The heat spreader is usually made up of a very thin material such as copper, aluminum, steel, ceramic, or plastic. The material used for the heat spreader will vary depending on the temperature requirements, and the performance of the component, as well as the thermodynamic efficiency of the material.
The V5357 application field and working principle also utilizes a fan to improve the cooling capability of the heat sink. The fan helps move air around the components and disperse heat away from the components. The fan can be mounted directly onto the heat spreader or onto a separate mounting block. Depending on the situation, the fan speed may be adjusted to better match the requirements of the heat sink.
The V5357 application field and working principle is usually used with power amplifiers, CPU sockets, and other components that are expected to generate a lot of heat. Its low profile design ensures that the components fit into tight spaces easily and does not interfere with other components. The V5357 heat sinks are also relatively easy to install, thanks to their compatibility with a wide range of components.
The major advantage of V5357 application field and working principle compared to other heat sink types is its ability to dissipate heat quickly. It also has better noise efficiency when used in conjunction with a fan, which makes it suitable for reducing noise levels in an electronic system. The fan also helps circulate air and keep the components cool. These features make the V5357 application field and working principle very attractive for use in a wide variety of applications.
In conclusion, V5357 application field and working principle is a great choice for cooling electronic components, and it offers several advantages in performance as well as installation ease. This type of heat sink is relatively inexpensive, and it offers excellent thermodynamic efficiency and noise reduction. It is also compatible with a wide variety of components and easily fits in tight spaces.
The specific data is subject to PDF, and the above content is for reference