V5618A Allicdata Electronics
Allicdata Part #:

AE10819-ND

Manufacturer Part#:

V5618A

Price: $ 0.28
Product Category:

Fans, Thermal Management

Manufacturer: ASSMANN WSW Components
Short Description: HEATSINK ALUM ANOD
More Detail: Heat Sink 6-Dip and 8-Dip Aluminum Top Mount
DataSheet: V5618A datasheetV5618A Datasheet/PDF
Quantity: 10124
1 +: $ 0.25200
10 +: $ 0.23940
25 +: $ 0.22756
50 +: $ 0.22151
100 +: $ 0.21848
250 +: $ 0.20349
500 +: $ 0.19152
1000 +: $ 0.17357
5000 +: $ 0.16758
Stock 10124Can Ship Immediately
$ 0.28
Specifications
Series: --
Part Status: Active
Type: Top Mount
Package Cooled: 6-Dip and 8-Dip
Attachment Method: Press Fit
Shape: Rectangular, Fins
Length: 0.334" (8.50mm)
Width: 0.250" (6.35mm)
Diameter: --
Height Off Base (Height of Fin): 0.189" (4.80mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: 80.00°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

The thermal management of electrical components, including power supplies, processors, and other components used in the industry, is critical to both performance and the longevity of the components. The V5618A is a type of thermal management device, commonly known as a “heat sink”. Heat sinks are used to reduce temperatures of components, in most cases electrical components, by dissipating heat from them into the surrounding environment.

Heat sinks are manufactured using materials that can absorb and dissipate heat relatively easily, such as METAL, or other materials with large thermal conductivity. V5618A heat sinks are designed for use in high-power applications such as home and office computers, enterprise servers, and industrial applications like robotics, medical, and automotive where heat dissipation is critical.

A V5618A Heat sinks work by utilizing a standard design principle: heat is conducted through metal in the form of heat conduction, and the metal layer(s) on the heat sink functions as a conductor to forcibly transfer heat from inside the component to the surrounding environment through the use of metal fins and/or thermal paste/grease. Thermal interface materials may be used to fill any gaps between the heat sink and the component to improve the connection between the two surfaces, thus further improving performance of the heat sink.

V5618A heat sinks are used in a wide variety of applications where heat dissipation needs to be managed in a safe and effective manner. These applications range from large-scale industrial applications such as transportation and robotics, to commercial and home computing applications. V5618A heat sinks are designed for use with components such as CPUs, GPUs, CPUs and GPUs with integrated memory, and other components that generate a significant amount of heat. The metal fin configurations of V5618A heat sinks are designed for maximum heat dissipation, allowing an increased cooling efficiency.

V5618A heat sinks are designed to last longer than other heat sink designs due to their "low-inertia" design. The design features a low mass and uses fewer contact points between the heat sink and the component which helps to maintain its structural integrity and performance efficiency over time. The design also minimizes the transfer of vibrations and external forces to the heat sink, ensuring maximum stability and cooling performance during operation.

V5618A heat sinks are designed with an easy-to-install method. They can be mounted using screws or double-sided tape and are compatible with a variety of brackets and mounts. They are suitable for both horizontal and vertical orientation use in cases where space is limited.

In summary, V5618A heat sinks are designed to offer excellent heat dissipation for components in high performance applications. They are built to last longer than other heat sink designs due to their low-inertia design and are easy to install and configure. This makes them an ideal choice for a wide variety of applications from home and office computers to industrial applications requiring effective and reliable thermal management.

The specific data is subject to PDF, and the above content is for reference

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