V5630-T

Series:	--
Part Status:	Active
Type:	Board Level
Package Cooled:	TO-220
Attachment Method:	Bolt On
Shape:	Rectangular, Fins
Length:	1.378" (35.00mm)
Width:	0.728" (18.50mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	--
Thermal Resistance @ Natural:	15.00°C/W
Material:	Aluminum
Material Finish:	Black Anodized

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Thermal - Heat SinksV5630-T is an advanced thermal heat sink specifically designed to support applications requiring uniform thermal management. It works by accelerating the heat flow from the source or heat generating device to the thermal transfer area, usually an open-air environment. In doing so, it prevents heat build-up, reduces system stress and ultimately increases performance. The heat sink is constructed from thermal aluminum with a die-cast surface. This process, called thermal transfer, increases the conductivity of the thermal material, thus allowing transfer of heat directly to the environment rather than holding it localized within the device.The surface of the V5630-T is composed of many air-spaced fins that provide greater surface area and expand the heat transfer from the heat source to the environment. Its design also makes it possible to utilize the ambient temperature to dissipate the heat. The air-spaced fins are oriented so that the fin-to-air contact thermal conductivity is maximized. The V5630-T is designed to provide an overall uniform rate of heat transfer over a much larger surface area. This helps to lower temperatures and minimize thermal stress to the system.The air-spaced fin arrangement also helps increase the absorption and dissipate heat more efficiently. This is done by dissipating heat directly to the environment and providing more air-movement through the enlarged fin area. Heat can be dissipated much more effectively as the air-spaced fins allow for heat exchange to happen over a much larger surface area. This greatly increases the thermal performance of the device.The V5630-T has proven to be a reliable and dependable choice for thermal management within many industries. It has been successfully used in the automotive, aerospace, telecommunications and power engineering industries. Its superior thermal performance and low resistance to operating temperatures provide a robust solution for thermal applications with a wide range of temperatures. These include hard-to-cool microprocessor and power management systems as well as automotive and aerospace applications.The V5630-T operates at optimal temperatures from -75°C to 175°C. Its design makes it capable of handling short-term temperature spikes. The design of the thermal pad is engineered to ensure that the V5630-T provides uniform and controlled thermal performance. The use of an aluminum frame and advanced thermal design structure improves the thermal conductivity of the thermal pad, resulting in better thermal transfer performance.The V5630-T is a reliable heat sink solution for applications that require uniform and reliable thermal management. Its thermal engineering has proven to be reliable and dependable in numerous applications. Its high level of thermal management and optimal temperature range make the V5630-T a highly efficient thermal management device. Its ability to dissipate heat over a wide area and implement uniform thermal transfer makes it a superior choice for a wide range of industrial and commercial applications.

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