V5731 Allicdata Electronics
Allicdata Part #:

AE10911-ND

Manufacturer Part#:

V5731

Price: $ 0.07
Product Category:

Fans, Thermal Management

Manufacturer: ASSMANN WSW Components
Short Description: HEATSINK ALUM ANOD
More Detail: Heat Sink Aluminum Top Mount
DataSheet: V5731 datasheetV5731 Datasheet/PDF
Quantity: 349
1 +: $ 0.06300
10 +: $ 0.03276
25 +: $ 0.03125
50 +: $ 0.03037
100 +: $ 0.02993
250 +: $ 0.02785
500 +: $ 0.02621
1000 +: $ 0.02375
5000 +: $ 0.02293
Stock 349Can Ship Immediately
$ 0.07
Specifications
Series: --
Part Status: Active
Type: Top Mount
Package Cooled: --
Attachment Method: Press Fit
Shape: Cylindrical
Length: --
Width: --
Diameter: 0.122" (3.10mm) ID, 0.252" (6.40mm) OD
Height Off Base (Height of Fin): 0.090" (2.30mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Tin
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a growing necessity for modern technology. A heat sink is generally defined as a device that dissipates thermal energy from a higher temperature source to a lower temperature environment. The V5731 model of heat sink is a new type of device designed to improve the efficiency of cooling in computer and other electronic components.

The V5731 heat sink is composed of two main components: a base plate and a heat sink frame. The base plate is typically made from aluminum, and it serves as a platform for various components. It provides a flat surface for the heat sink frame to rest upon. The base plate also provides additional thermal insulation, and it can also be used to correct an item’s thermal profile. The heat sink frame on the V5731 is made from copper, and it is designed to both dissipate heat and to reduce the chances of thermal bridging.

The V5731 has an application field of desktop computer components and laptops. Its highly efficient heat transfer dissipates heat from sensitive areas while maintaining minimal obstruction. It is also useful in other areas such as telecommunications equipment and gaming consoles. It is designed to be used in situations where there is limited space for larger components.

The working principle of the V5731 heat sink is based on a combination of convection and conduction. Its dual-layer design directs air over critical components, creating a convective airflow that helps transfer heat away from the components. The copper heat sink frame also conducts heat away from the device, and dissipates it into the surrounding environment. The V5731 is designed to be used in coordination with a fan, either internal or external, in order to maximize cooling efficiency.

The V5731 model heat sink offers numerous advantages for electronic designers. It is lightweight and compact in design, and it can easily fit into confined spaces. It also has superior thermal performance and a higher degree of thermal insulation than other heat sinks. Additionally, it is easy to install and can be used with most types of fans. Its high-efficiency and superior cooling capabilities make it an ideal choice for many applications.

The V5731 model heat sink provides a reliable solution for cooling issues in modern electronic components. It is lightweight, compact and effective, and its efficient heat transfer makes it an ideal choice for a wide range of applications. Its ability to dissipate heat efficiently while maintaining minimal obstruction ensures that it will remain a popular choice in the market for many years to come.

The specific data is subject to PDF, and the above content is for reference

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