V6560N

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The V6560N is a type of thermal-heat sink and is used in a wide variety of applications. The thermal-heat sink is designed to dissipate heat away from parts and components of various electronic assemblies. It helps maintain optimal thermal design in environments where temperature can be a major factor in the life of a system.

The V6560N uses a unique design to effectively transfer heat away from heat-sensitive components. It features an extruded aluminum base combined with a thermally efficient solid metal fin array, and an effective air stream incorporated into the fin design. This combination of materials and configuration allows for up to 30% more thermal capacity than conventional finned heat sinks.

This thermal-heat sink also utilizes an innovative process called solder plate bonding. This process utilizes a special non-conductive bonding agent to provide an extremely strong bond between the heat sink and the components. This process also eliminates the need to drill and route through components, further improving the thermal design.

The V6560N’s design and construction also allow for maximum compatibility with many different device packages. Its design and configuration allows for almost any standard 3.5 inch, 2.5 inch, or 1GHz processor to be utilized with the heatsink. Additionally, the base of the V6560N is specifically designed to take full advantage of any cooling system, whether it is a fan, forced air blower, or a liquid cooling system.

In terms of working principle, the V6560N utilizes a combination of conduction and convection as its primary cooling mechanism. Heat generated by the electronic components is transferred through the base of the heatsink, and then radiates out into the surrounding air through the fins. Additionally, the air stream created by the fans helps to improve efficiency by providing increased air flow around the fin array.

Overall, the V6560N provides an optimal thermal design for a wide variety of applications. Its combination of design features and construction techniques help to ensure not only maximum cooling performance, but also provide an effective solution for heat sensitive components. In addition, the variety of device packages that it is compatible with make it a great choice for a variety of projects.

The specific data is subject to PDF, and the above content is for reference