V8511W Fans, Thermal Management |
|
Allicdata Part #: | AE10879-ND |
Manufacturer Part#: |
V8511W |
Price: | $ 0.54 |
Product Category: | Fans, Thermal Management |
Manufacturer: | ASSMANN WSW Components |
Short Description: | HEATSINK ALUM ANOD |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | V8511W Datasheet/PDF |
Quantity: | 779 |
1 +: | $ 0.49140 |
10 +: | $ 0.46998 |
25 +: | $ 0.44654 |
50 +: | $ 0.43470 |
100 +: | $ 0.42884 |
250 +: | $ 0.39950 |
500 +: | $ 0.37598 |
1000 +: | $ 0.34074 |
5000 +: | $ 0.32899 |
Specifications
Series: | -- |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Bolt On and PC Pin |
Shape: | Square, Fins |
Length: | 1.181" (30.00mm) |
Width: | 1.181" (30.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | 6.50°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
Description
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks
The V8511W is a highly efficient product designed for applications where thermal management is critical. It works by absorbing and dissipating heat from components within its range, regardless of whether or not the environment is particularly hot. The products advantageous design allows for a significantly increased heat-dissipating area, thereby reducing the thermal resistance of the heat source.It is extensively used in the thermal management of individual components such as chips, power supplies, and other sensitive components, as well as entire systems. In order to increase the efficiency of its thermal management solution, it is also often used in conjunction with heat sinks and cooling fans.The V8511W utilizes a unique two-ply system consisting of a large aluminum alloy base and an extra-thick copper wafer. This combination provides a better heat dissipation performance than single-ply cooling solutions, resulting in superior thermal control and greater reliability. Concerns about overheating of components or systems are thus significantly reduced, resulting in improved system performance and reliability.The aluminum alloy base also serves to provide increased stability and reliability by providing structural support for the components within the range of its thermal management system. The copper wafer, on the other hand, offers excellent thermal conductivity to effectively transfer the generated heat away from the source.Moreover, the V8511W\'s thermal design utilizes a vacuum-forming technology to further reduce its thermal resistance. The products innovative design also allows for the easy installation of fans, allowing for improved cooling efficiency and further decreasing the thermal resistance. The V8511W is highly efficient for most applications, and is designed to work in an ambient temperature range from -20°C to 70°C. It is resilient against shock and vibration, and is a dependable choice for applications where thermals are critical. Its combination of excellent heat-dissipating capabilities and structural support make it a superior choice in thermal management.The specific data is subject to PDF, and the above content is for reference
Related Products
Search Part number : "V851" Included word is 6
Part Number | Manufacturer | Price | Quantity | Description |
---|
V8510B-T | ASSMANN WSW ... | 0.64 $ | 1000 | HEATSINK ALUM ANODHeat Si... |
V8511W | ASSMANN WSW ... | 0.54 $ | 779 | HEATSINK ALUM ANODHeat Si... |
V8510SN-T | ASSMANN WSW ... | 0.64 $ | 959 | HEATSINK ALUM ANODHeat Si... |
V8511Y | ASSMANN WSW ... | 0.8 $ | 105 | HEATSINK ALUM ANODHeat Si... |
V8511Z | ASSMANN WSW ... | 0.92 $ | 584 | HEATSINK ALUM ANODHeat Si... |
V8511X | ASSMANN WSW ... | 0.71 $ | 3053 | HEATSINK ALUM ANODHeat Si... |
Latest Products