W83667HG-B TR

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Introduction

The W83667HG-B TR (Temperature Reduction) is a hardware monitoring chip designed and manufactured by Winbond Electronics Corporation – one of the leading manufacturers of memory ICs. It is a multi-function integrated circuit, combining features such as temperature monitoring, voltage monitoring, fan control, and SMBus communication into a single package. This integrated circuit is used by several major PC and server manufacturers and embedded in their motherboards. It is designed to provide system engineering features that reduce thermal output in demanding applications and provide modular features for system/motherboard designers.

Application Field

The most common application field of the W83667HG-B TR is for server and workstation motherboards. The chip is designed to be able to detect the temperature levels within the system, while allowing changes in the critical settings such as thermal alarm setting, thermal hysteresis, thermal slope adjustability and thermal limit setting. Moreover, the chip offers a set of highly customizeable, non-volatile memory settings allowing users to define their own temperature threshold levels. This extremely useful feature is of major importance for applications where thermal requirements must be precisely controlled for maximum system performance. The W83667HG-B TR is also commonly used in embedded systems, such as medical and industrial equipment, as its temperature sensing abilities allow users to configure the system for specific temperature requirements.

In addition to temperature reduction based applications, the W83667HG-B TR is also used for extended functionality implementations such as fan speed control, voltage monitoring and timer control. This makes the chip an excellent choice for those seeking maximum performance from their PC/server systems, as the features it provides are designed to maximize system responsiveness and performance.

Working Principle

The W83667HG-B TR is a highly integrated device consisting of a temperature measurement IC, voltage and temperature sensor electrodes, and a temperature monitoring unit. The measurement IC’s internal calibration settings allow for accurate temperature readings, while the external sensors allow for temperature reading accuracy of up to ±2°C.

The temperature monitoring unit is responsible for setting the temperature alarm and hysteresis levels, as well as the thermal limit. The alarm and hysteresis levels can be set via the SMBus interface, while the thermal limit can be adjusted by using the small adjustments present on the chip itself. When the preset temperature thresholds are reached, the unit will trigger the necessary events, such as sending an interrupt signal to the system or shutting down the system if the temperature rises above a certain level.

In addition to temperature monitoring, the chip also features fan speed detection and control circuitry. This allows users to measure the current fan speed and adjust the fan control settings accordingly, ensuring effective cooling for the entire system. Finally, the chip includes voltage detection circuitry, enabling it to detect any voltage fluctuations and take appropriate action.

Conclusion

The W83667HG-B TR is an excellent hardware monitoring chip designed and manufactured by Winbond Electronics Corporation specifically for use in system engineering applications which require sophisticated temperature reduction and control mechanisms. Its multi-function capabilities, such as temperature sensing, fan control, and voltage detection, make it an ideal choice for those seeking maximum performance from their PC/server systems. With its highly customizable memory settings and easy setup, the W83667HG-B TR is the perfect choice for those looking for reliable, high performance hardware monitoring solutions.

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