XC2S100-6FGG256C

Series:	Spartan®-II
Part Status:	Active
Number of LABs/CLBs:	600
Number of Logic Elements/Cells:	2700
Total RAM Bits:	40960
Number of I/O:	176
Number of Gates:	100000
Voltage - Supply:	2.375 V ~ 2.625 V
Mounting Type:	Surface Mount
Operating Temperature:	0°C ~ 85°C (TJ)
Package / Case:	256-BGA
Supplier Device Package:	256-FBGA (17x17)

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Introduction to Embedded - FPGAs (Field Programmable Gate Array)Field Programmable Gate Arrays (FPGAs) are integrated circuits with configurable logic blocks that can operate as embedded processing systems. This embedded processing can take the form of logic-manipulation operations, digital signal processing, or general-purpose computing. FPGAs offer a great deal of versatility and configuration control compared to other ASICs (Application Specific Integrated Circuits) and give embedded system designers a much greater range of options for the implementation of their hardware.The XC2S100-6FGG256C is a FPGA from Xilinx, a leader in FPGA technology. This particular part comes packaged in a 256-pin plastic quad flat package, with a core voltage of 1.2 volts and a power dissipation of 5W. This is a mid-range FPGA designed with a XC2S architecture, featuring up to 6 million system gates, up to 4,800 user logic elements, and up to 3,200 logic blocks. It also features up to 4 GB of DDR3 SDRAM, up to 8 clock regions and up to 8 phase-locked loop cores.ArchitectureThe XC2S100-6FGG256C is based on the Xilinx XC2S architecture, which is designed to provide a higher number of programmable elements and more configurability than previous generations of FPGAs. This architecture features up to 6 million system gates and up to 4,800 user logic elements, as well as up to 3,200 logic blocks. Each logic block consists of a two-input LUTs, RAM, and digital multiplexers, allowing for a wide range of configurable logic functions.The FPGA also features up to 4GB of DDR3 SDRAM, which makes it suitable for high-performance applications. This memory can be used for buffering memory-intensive operations, such as image processing, that would otherwise require a dedicated ASIC.I/OThe XC2S100-6FGG256C has 256-pins for I/O operations. These are divided into two banks; an upper bank of 192 pins which support up to 16 user I/O banks, and a lower bank of 64 pins which are dedicated to dedicated on-board I/O functions. Each of these two banks can be driven by different I/O voltages and signalling standards.The dedicated I/O bank includes 28 dedicated I/O pins, 4 clock inputs, and 32 general purpose I/O pins. There is also an on-board analog-to-digital converter (ADC) module, and a separate power supply for powering the I/O banks. This allows the FPGA to be used in a wide range of different embedded applications.Design SoftwareTo program the XC2S100-6FGG256C, the user must first purchase a software development kit (SDK). Xilinx provides a wide range of SDKs and tools, including the popular Xilinx Software Development Kit (XSDK), the Vivado Design Suite, the ISE Design Suite, and the EDK (Embedded Development Kit).These tools provide a comprehensive suite of development tools, including design synthesis and analysis, logic optimization, and verification. They also provide GUI-based design entry, allowing for the generation of HDL (Hardware Description Language), which is used to configure the XC2S100-6FGG256C for the particular application.ConclusionThe XC2S100-6FGG256C is a mid-range FPGA from Xilinx, featuring up to 6 million system gates, up to 4,800 user logic elements, and up to 3,200 logic blocks. It also features up to 4GB of DDR3 SDRAM and an on-board analog-to-digital converter (ADC) module. This FPGA is designed to offer a high degree of configurability and flexibility, allowing for design optimization and cost savings. With the right design tools, such as the XSDK, Vivado Design Suite, or EDK, the XC2S100-6FGG256C can be used in a wide range of embedded applications.

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