Allicdata Part #: | XC4010XL-3BG256I-ND |
Manufacturer Part#: |
XC4010XL-3BG256I |
Price: | $ 0.00 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Xilinx Inc. |
Short Description: | IC FPGA 160 I/O 256BGA |
More Detail: | N/A |
DataSheet: | XC4010XL-3BG256I Datasheet/PDF |
Quantity: | 1000 |
1 +: | 0.00000 |
Specifications
Series: | XC4000E/X |
Part Status: | Obsolete |
Number of LABs/CLBs: | 400 |
Number of Logic Elements/Cells: | 950 |
Total RAM Bits: | 12800 |
Number of I/O: | 160 |
Number of Gates: | 10000 |
Voltage - Supply: | 3 V ~ 3.6 V |
Mounting Type: | Surface Mount |
Operating Temperature: | -40°C ~ 100°C (TJ) |
Package / Case: | 256-BBGA |
Supplier Device Package: | 256-PBGA (27x27) |
Base Part Number: | XC4010XL |
Description
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IntroductionEmbedded Field Programmable Gate Array (FPGA) is an integrated circuit that provides configurable and expandable logic, as well as function-oriented custom digital and mixed-signal circuits. It is designed to be programmable in the field, and can be reconfigured on the fly without the need of a computer. This makes FPGAs an attractive solution for embedded systems.The XC4010XL-3BG256I is such an embedded FPGA. This part is part of the Xilinx “XL Series” family and is intended for a wide range of applications from complex digital signal processing to high-speed communication and system integration. It integrates multiple embedded block RAM and Fig. 1 provides an overview of the architecture.Application FieldThe XC4010XL-3BG256I is particularly suited to applications that require high-speed, low-latency, and high-density logic. This can include anything from ASIC prototyping, to medical imaging, automotive control systems, industrial automation, and telecoms infrastructure.The particular advantages of the XC4010XL-3BG256I are its integrated block RAM, distributed dual-port RAM, and FIFO structures. This makes it particularly suitable for applications that require buffering, memory or data transfer.One such example could be a system that requires high-speed signal processing and signal buffering. The integrated block RAM of the XC4010XL-3BG256I can be used for buffering large blocks of signal data to enable large signal processing windows, while the dual-port RAM can be used for data transfer between multiple signal processing cores. The FIFO structures can then be used to ensure that the signals are properly synchronized between the cores.Working PrincipleThe XC4010XL-3BG256I is an embedded FPGA and is thus programmed by means of a configuration chip that has the desired design programmed into it. The configuration chip is then connected to the target device and the configuration is loaded onto the XC4010XL-3BG256I which then acts as the target device’s central processor.The XC4010XL-3BG256I is programmed using a hardware description language such as Verilog or VHDL. In this language, the programmer describes the desired logic and the XC4010XL-3BG256I then uses this information to create the desired circuit.The hardware can then be further optimized using hardware-specific tools such as the Xilinx Vivado Design Suite, which allows for optimization of the hardware for specific applications. This includes clock optimization, logic optimization, timing optimization and more.ConclusionThe XC4010XL-3BG256I is an embedded FPGA that is particularly suited to high-speed and high-density applications. It features integrated block RAM, distributed dual-port RAM and FIFO structures which make it well suited to data buffering and signal processing applications. The XC4010XL-3BG256I is programmed using Verilog or VHDL and can be further optimized with hardware-specific tools.The specific data is subject to PDF, and the above content is for reference
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