XC7Z045-2FFG900I Allicdata Electronics
Allicdata Part #:

122-1897-ND

Manufacturer Part#:

XC7Z045-2FFG900I

Price: $ 213.43
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: IC SOC CORTEX-A9 KINTEX7 900FBGADual ARM® Cortex®-...
More Detail: N/A
DataSheet: XC7Z045-2FFG900I datasheetXC7Z045-2FFG900I Datasheet/PDF
Quantity: 18
1 +: $ 213.43000
Stock 18Can Ship Immediately
$ 213.43
Specifications
Series: Zynq®-7000
Packaging: Tray 
Part Status: Active
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: --
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)
Number of I/O: 130
Base Part Number: XC7Z045
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Embedded - System On Chip (SoC) is a new generation of integrated circuit technology specially designed for integration of components, complexes and communications powers. XC7Z045-2FFG900I is a very popular SoC due to its flexibility, small size and its highly efficient power density. The main application fields of XC7Z045-2FFG900I SoC are: networking, communication, navigation, detection and control, imaging, embedded system, industrial automation, automotive and entertainment.

The XC7Z045-2FFG900I SoC adopts the advanced 28nm lowpower technology, with twice the performance of the previous 40nm process. By combining complex multi-core processors, Ethernet connectivity, high speed on-chip memories and advanced feature-rich I/O peripherals, XC7Z045-2FFG900I SoC meets the requirements of multiple system environments safely and securely. The XC7Z045-2FFG900I SoC often integrates security acceleration, hardware-based encryption engines, cryptographic accelerators, embedded processors, 3D graphics cores and other embedded IPs into a single product.

The working principle of XC7Z045-2FFG900I SoC is based on the resource distribution, combining multiple functions into a single chip is reasonable and more efficient. It combines the traditional components into a single chip, greatly reducing the area and cost, but greatly increasing the performance, reducing the working voltage, reducing power consumption and improving the reliability of electronic devices.

XC7Z045-2FFG900I SoC\'s multi-core processor architecture enables dedicated processors for each separate application, allowing for efficient usage and improved performance. The on-chip Ethernet connectivity allows networking functions to be embedded in its design, allowing for distributed data processing, network robustness and scalability. XC7Z045-2FFG900I SoC provides high speed serial ports, I2C, GPIO, system memory and flash memory, which are all oriented to the needs of networking and distributed system environment.

In addition, XC7Z045-2FFG900I SoC support a variety of operating system, including Android, Linux, Windows, FreeRTOS and many other Embedded Real-time Operating Systems used in embedded systems. XC7Z045-2FFG900I SoC has a built-in 3D graphics accelerator, accelerates graphics processing, and the expansion of the graphics functionalities is also very strong.

The advantages of XC7Z045-2FFG900I SoC are obvious. It integrates complex components, multi-core processors, communication functions, 3D graphics acceleration, secure data encryption and secure resource partitioning onto one chip, thus achieving higher system performance, greater reliability and flexibility, and greater cost efficiency in real-time distributed system applications.

XC7Z045-2FFG900I SoC\'s cost efficiency and performance advantages make it very suitable for many areas such as networking, communication, navigation, detection and control, embedded system, industrial automation, automotive, imaging and entertainment. It can dramatically improve the design efficiency, reduce design costs and improve the degree of automation.

The specific data is subject to PDF, and the above content is for reference

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