XCVU9P-1FLGA2577E Allicdata Electronics
Allicdata Part #:

XCVU9P-1FLGA2577E-ND

Manufacturer Part#:

XCVU9P-1FLGA2577E

Price: $ 22.18
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: IC FPGA VIRTEX-UP 2577FCBGA
More Detail: N/A
DataSheet: XCVU9P-1FLGA2577E datasheetXCVU9P-1FLGA2577E Datasheet/PDF
Quantity: 1000
1 +: $ 20.16000
Stock 1000Can Ship Immediately
$ 22.18
Specifications
Series: Virtex® UltraScale+™
Part Status: Active
Number of LABs/CLBs: 147780
Number of Logic Elements/Cells: 2586150
Total RAM Bits: 391168000
Number of I/O: 448
Voltage - Supply: 0.825 V ~ 0.876 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Description

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Introduction to XCVU9P-1FLGA2577E

XCVU9P-1FLGA2577E is an embedded field programmable gate array (FPGAs) designed to provide high-performance processing. It offers a high-performance, cost-effective platform for embedded applications requiring sustained data transfer and low latency computations. This embedded FPGA provides efficient data processing, allowing for fast data transmission and low latency. XCVU9P-1FLGA2577E features an optimized architecture for low-power operation, compact form factor, and reduced power consumption. Additionally, the chip delivers enhanced data transfer capabilities with its highly integrated cores, allowing it to be an excellent choice for embedded applications.

XCVU9P-1FLGA2577E Application Field and Working Principle

XCVU9P-1FLGA2577E is suitable for applications within a variety of embedded fields. Its robust feature set makes it a perfect fit for industries ranging from aerospace and automotive to medical and industrial automation. This FPGA delivers a high throughput, low latency solution for applications such as real-time control, image processing, and embedded computing. With its low power consumption and small form factor, XCVU9P-1FLGA2577E is a great choice for applications that require a small footprint.

The working principle of XCVU9P-1FLGA2577E is based on its programmable logic, memory, and I/O components. With its high-density logic blocks, the embedded FPGA allows users to quickly implement a range of applications with a single device. Through the distributed arithmetic units on the device\'s I/O peripherals, the FPGA can achieve instruction level parallelism and have tasks executed concurrently. With its dual-core architecture, XCVU9P-1FLGA2577E is able to execute multi-IQ (Multiple Instruction Words per Clock Cycle) data-processing instructions. This allows for simultaneous execution on multiple instructions, enabling more efficient, higher performance operations.

The FPGA’s internal memory is also optimized for embedded applications. Its direct-mapped cache architecture allows for fast data transfer and low latency access. This makes XCVU9P-1FLGA2577E ideal for utilization in high-throughput applications such as image processing and industrial automation. Its dual-bus architecture further enables higher concurrency by allowing data to be processed while accessing the main memory.

XCVU9P-1FLGA2577E also supports a wide range of peripheral I/O and communication components. Its onboard controller enables high-speed, low-latency communication with devices such as sensors and actuators. With its low-bandwidth memory devices, XCVU9P-1FLGA2577E provides asynchronous and synchronous communications with embedded devices. This can greatly improve the efficiency of real-time control and image processing applications.

With its extended feature list and optimized architecture, XCVU9P-1FLGA2577E is an excellent choice for embedded applications. It offers a high-performance, low-power solution for applications requiring sustained data transfer and low latency computations. Its optimized architecture is further complemented by wide range of I/O and communication components, allowing it to be applied within a variety of embedded fields.

The specific data is subject to PDF, and the above content is for reference

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