XCZU11EG-1FFVC1156I Allicdata Electronics
Allicdata Part #:

XCZU11EG-1FFVC1156I-ND

Manufacturer Part#:

XCZU11EG-1FFVC1156I

Price: $ 2.08
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: IC FPGA 360 I/O 1156FCBGA
More Detail: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dua...
DataSheet: XCZU11EG-1FFVC1156I datasheetXCZU11EG-1FFVC1156I Datasheet/PDF
Quantity: 4
1 +: $ 1.89000
Stock 4Can Ship Immediately
$ 2.08
Specifications
Series: Zynq® UltraScale+™ MPSoC EG
Packaging: Tray 
Part Status: Active
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: --
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 600MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)
Number of I/O: 360
Description

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XCZU11EG-1FFVC1156I is a new system-on-chip (SoC) technology developed by Xilinx. It has a wide application in embedded systems, providing high performance and an integrated design that makes product design simpler and faster. This SoC technology is based on ARM Cortex-A9 cores and the Zynq UltraScale+ FPGA.

The XCZU11EG-1FFVC1156I provides a wide range of applications in embedded systems. It is a powerful platform for applications such as Internet of Things (IoT), industrial, and aerospace systems. It can also be used as a control system for automation and robotics, or for medical imaging and other medical applications. The XCZU11EG-1FFVC1156I is also suitable for both consumer and automotive applications.

The XCZU11EG-1FFVC1156I provides a single platform for both the ARM Cortex-A9 cores and the Zynq UltraScale+ FPGA. This enables powerful high-level features such as on-chip memory and high-speed transceivers, which help to reduce system complexity and cost. With its internal Memory interface, the XCZU11EG-1FFVC1156I allows the application of various high-speed protocols such as USB 3.0 and USB 2.0, PCIe, and Serial ATA, making it a great choice for embedded systems.

The XCZU11EG-1FFVC1156I also supports advanced design flows that use software-defined radio (SDR) and field-programmable gate array (FPGA) accelerators. These accelerators enable high-speed computation in the embedded system. They can also be used to reduce system complexity and reduce development time.

The XCZU11EG-1FFVC1156I SoC also supports an integrated development environment. This allows developers to use the same tools to develop both their embedded and FPGA designs. This reduces the need for separate design cycles and allows for simpler and quicker product development.

The XCZU11EG-1FFVC1156I SoC working principle is based on the ARM Cortex-A9 processor and the Zynq UltraScale+ FPGA. The ARM Cortex-A9 processor is a dual-core microprocessor that consists of two execution pipelines. The two pipelines can run in parallel and provide improved performance. The Zynq UltraScale+ FPGA provides a large programmable fabric that can be used to implement custom logic and offload tasks from the ARM processor. The built-in memory controller of the XCZU11EG-1FFVC1156I SoC can be used to interface with memory modules and other peripherals.

The XCZU11EG-1FFVC1156I also supports peripherals such as Ethernet and USB controllers, camera interface, high-speed transceivers and secure IP cores that enable secure communication. All these components can be accessed through the integrated development environment that simplifies the process of designing and developing embedded systems.

In conclusion, the XCZU11EG-1FFVC1156I is a powerful and versatile system-on-chip (SoC) technology, ideal for embedded systems. It is based on the ARM Cortex-A9 processor and the Zynq UltraScale+ FPGA, providing a wide range of features and capabilities. The integrated development environment simplifies the process of design and development of embedded systems, streamlining the process and reducing development time.

The specific data is subject to PDF, and the above content is for reference

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