XCZU2CG-1SFVC784E Allicdata Electronics
Allicdata Part #:

XCZU2CG-1SFVC784E-ND

Manufacturer Part#:

XCZU2CG-1SFVC784E

Price: $ 161.26
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: IC FPGA 252 I/O 784FCBGA
More Detail: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dua...
DataSheet: XCZU2CG-1SFVC784E datasheetXCZU2CG-1SFVC784E Datasheet/PDF
Quantity: 1000
2 +: $ 146.60100
Stock 1000Can Ship Immediately
$ 161.26
Specifications
Series: Zynq® UltraScale+™ MPSoC CG
Packaging: Tray 
Part Status: Active
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size: --
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)
Number of I/O: 252
Description

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System On Chip (SoC) is a type of technology in electronics engineering, wherein all components of any given system are placed on a single integrated circuit (or chip). The XCZU2CG-1SFVC784E is an example of such a System On Chip and is widely used today in various embedded applications. This article will discuss the application field and working principle of the XCZU2CG-1SFVC784E.

The XCZU2CG-1SFVC784E is mainly used for applications in the embedded field, particularly for applications in which low power, high-density performance and high-bandwidth computing are required. Applications include portable GPS devices, wearables, and medical devices. The XCZU2CG-1SFVC784E is also used in smart home and industrial automation products, allowing for compact and high-performance solutions in those areas.

The working principle of the XCZU2CG-1SFVC784E is based on the concept of a System On Chip, where all components are placed on the same integrated circuit. In this configuration, the XCZU2CG-1SFVC784E combines an extremely efficient processor with a wide range of other components such as peripherals and memories, enabling users to create solutions in a very compact and cost-effective package. It also features features such as high-speed communications, real-time processing, low latency, and scalability. The integrated circuit also features a configurable fabric and can be configured in a variety of ways, allowing users to create an optimal solution for their requirement.

The XCZU2CG-1SFVC784E is powered by the Xilinx Ultrascale+ architecture, a highly scalable and low power architecture that provides up to 33% more transistors and more than 50% more clock cycles per from its predecessor. This results in increased performance and a reduction in power consumption. In addition, the ultra-scale+ architecture also supports the latest peripherals and architectures, greatly expanding the flexibility and scalability of the overall solution.

The XCZU2CG-1SFVC784E also features a variety of memory and connectivity options. It offers support for DDR3 and DDR4 SDRAM, LPDDR3 and LPDDR4 and also offers support for both FPGA and ASICs. It also features a range of various interfaces and communication options including USB 2.0, PCIe, Ethernet and RS-232/422.

The XCZU2CG-1SFVC784E is also designed to provide support for a variety of applications. It is a highly versatile and advanced SoC, providing solutions that support a wide range of devices and requirements. As such, the XCZU2CG-1SFVC784E is an excellent choice for various embedded applications, including portable GPS devices, wearables, and medical devices. In addition, its versatile and advanced architecture also makes it an ideal choice for industrial automation and smart home solutions.

In conclusion, the XCZU2CG-1SFVC784E is an excellent System On Chip solution for embedded applications due to its low power consumption, high-density performance, and versatile architecture. It is also a great choice for applications requiring scalability and high-speed communications. This System On Chip is designed to provide powerful, high-performance solutions in a cost-effect package.

The specific data is subject to PDF, and the above content is for reference

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