XR2C-1611-N Allicdata Electronics
Allicdata Part #:

XR2C-1611-N-ND

Manufacturer Part#:

XR2C-1611-N

Price: $ 1.17
Product Category:

Connectors, Interconnects

Manufacturer: Omron Electronics Inc-EMC Div
Short Description: CONN SOCKET SIP 16POS GOLD
More Detail: N/A
DataSheet: XR2C-1611-N datasheetXR2C-1611-N Datasheet/PDF
Quantity: 1000
200 +: $ 1.06246
Stock 1000Can Ship Immediately
$ 1.17
Specifications
Termination: Solder
Contact Resistance: 20 mOhm
Current Rating: 1A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.126" (3.20mm)
Operating Temperature: -55°C ~ 125°C
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Series: XR2
Features: Closed Frame
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 16 (1 x 16)
Type: SIP
Part Status: Active
Packaging: Bulk 
Description

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Sockets for ICs, transistors, and other semiconductor devices are a type of electrical connector. They provide an electrical connection between the socket and the component it is designed to hold. The XR2C-1611-N socket is a special type of socket specifically designed to hold integrated circuit chips (ICs) or transistors. It can be used in many different applications, including communications equipment, industrial automation systems, medical equipment, and consumer electronics.

The XR2C-1611-N socket uses a two-part design. It consists of a base plate that is installed at the site of the desired penetration and a cover plate that is secured over the base plate. The base plate and cover plate are connected together with two screws that keep the two parts tight and secure. The socket consists of two rows of three pins, each pin having a diameter of 0.02 inches and a length of 0.25 inches. The pins are arranged in a “U” shape and each row is slightly offset from the other. This arrangement is what allows the socket to be used in a variety of different applications.

The XR2C-1611-N socket is designed to hold a wide variety of ICs and transistors. It can be used with 16-pin dual-in-line packages (DIPs) and single-in-line packages (SIPs). It is also capable of holding surface-mount ICs and transistors. The socket has been designed to be used in environments ranging from below -25 °C to above +80 °C. Other design features of the XR2C-1611-N socket include gold-plated contacts, corrosion protection, high current handling capability, thermoplastic insulation, and EMI/RFI shielding.

The working principle of the XR2C-1611-N socket is quite simple. The pins of the socket are inserted into the holes of the IC or transistor and are held in place by two screws. The IC or transistor can then be soldered onto the board by pushing the pins of the socket into the board and applying heat to the tip of the pins. This heat melts the solder, creating a secure connection between the socket and the board.

The XR2C-1611-N socket is a versatile device that can be used in a wide variety of applications. It is capable of securely holding both ICs and transistors and is designed to protect them from the environmental conditions of the application. It has a simple working principle and is easy to install. As such, the XR2C-1611-N socket is a great choice for any application requiring a reliable electrical connection.

The specific data is subject to PDF, and the above content is for reference

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