Allicdata Part #: | XR2C-3200-HSG-ND |
Manufacturer Part#: |
XR2C-3200-HSG |
Price: | $ 0.16 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Omron Electronics Inc-EMC Div |
Short Description: | CONN IC SOCKET 32POS |
More Detail: | N/A |
DataSheet: | XR2C-3200-HSG Datasheet/PDF |
Quantity: | 1000 |
1000 +: | $ 0.14735 |
Termination: | Wire Wrap |
Contact Resistance: | 20 mOhm |
Current Rating: | 1A |
Material Flammability Rating: | UL94 V-0 |
Termination Post Length: | 0.510" (12.95mm) |
Operating Temperature: | -55°C ~ 125°C |
Housing Material: | Polybutylene Terephthalate (PBT), Glass Filled |
Contact Material - Post: | Beryllium Copper |
Contact Finish Thickness - Post: | -- |
Contact Finish - Post: | -- |
Pitch - Post: | 0.100" (2.54mm) |
Series: | XR2 |
Features: | Closed Frame |
Mounting Type: | Through Hole |
Contact Material - Mating: | Beryllium Copper |
Contact Finish Thickness - Mating: | -- |
Contact Finish - Mating: | -- |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions or Pins (Grid): | 32 (1 x 32) |
Type: | Housing |
Part Status: | Active |
Packaging: | Bulk |
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Sockets for ICs, Transistors
The XR2C-3200-HSG is an integrated IC socket solution that is specially designed to provide an integrated signal interface for ICs, transistors and other mobile components that are being used in complex and mission-critical applications. The XR2C-3200-HSG is an essential component in the development of high-performance electronic devices and is often used for the design of high-density, high-frequency electronics. Additionally, it can serve as a platform for the integration of multiple signaling devices into a single platform for better system performance.
The XR2C-3200-HSG can be used in a variety of application fields, such as aerospace, automotive, industrial, consumer electronics, medical, data processing, military, and communications. In aerospace applications, ICs, transistors, and other electronic components can be connected to a single platform for improved performance, and the XR2C-3200-HSG can be used in applications requiring high-density interconnects, sophisticated routing, and improved electrical signal integrity. In automotive applications, the XR2C-3200-HSG can be used to increase the lifecycle of the system, ensure efficient integration of multiple components, provide high-speed signal routing, and increase the overall flexibility of the system. In industrial applications, the XR2C-3200-HSG can be used to reduce size and weight, increase robustness and reliability, and reduce power consumption. In consumer electronic applications, the XR2C-3200-HSG can be used to reduce the size and complexity of the IC, reduce power consumption, and enable better signal routing and management.
The XR2C-3200-HSG has several key features that make it highly versatile for a wide range of applications. It features a low contact resistance of 1.3mΩ and a maximum operating current of 2A. The socket has an operating temperature range between −40°C and +105°C and is available in a variety of pin configurations, enabling it to work with a wide range of ICs, transistors and other components. Additionally, the XR2C-3200-HSG is compatible with devices such as the SMARCEDGE, BMEDGE Series, and the BMEDGE XA, and is RoHS compliant.
The XR2C-3200-HSG is designed to provide a superior signal interface for ICs, transistors, and other mobile components, and is manufactured using gold-plated contacts and an anti-ESD coating. This socket features integrated temperature-control protection and is fully insulated to reduce crosstalk. Additionally, the XR2C-3200-HSG has a low profile of 0.45mm, which allows it to be used in tight spaces. Additionally, it features a universal pin allocation system that allows it to accommodate up to 20 pins. This socket has a wide range of applications, including mobile phones, automotive electronics, personal computers, televisions, set top boxes, digital cameras, and video game consoles.
The working principle of the XR2C-3200-HSG is fairly simple. This socket is designed to offer a secure and reliable connection between a printed circuit board (PCB) and the components it needs to support. The XR2C-3200-HSG provides a reliable signal interface between the components and the printed circuit boards, allowing for better system performance. Additionally, this socket provides temperature-control protection and is fully insulated to reduce crosstalk. Finally, it helps to reduce the size of the IC, reduce power consumption, and enable better signal routing and management.
The XR2C-3200-HSG is a versatile solution for integrating ICs, transistors, and other mobile components into complex and mission-critical applications. It is designed to provide a reliable and secure signal interface for ICs, transistors, and other mobile components and offers a number of advantages, including a low contact resistance, low profile design, and a wide operating temperature range. The XR2C-3200-HSG is compatible with several devices and is RoHS compliant. Additionally, it is manufactured using gold-plated contacts and an anti-ESD coating, ensuring maximum system performance and reliability.
The specific data is subject to PDF, and the above content is for reference
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