YAFD5624108PWC1070 Allicdata Electronics
Allicdata Part #:

YAFD5624108PWC1070-ND

Manufacturer Part#:

YAFD5624108PWC1070

Price: $ 150.33
Product Category:

Uncategorized

Manufacturer: TE Connectivity Deutsch Connectors
Short Description: PLUG ASSY
More Detail: N/A
DataSheet: YAFD5624108PWC1070 datasheetYAFD5624108PWC1070 Datasheet/PDF
Quantity: 1000
50 +: $ 136.65800
Stock 1000Can Ship Immediately
$ 150.33
Specifications
Series: *
Part Status: Active
Description

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Introduction

The YAFD5624108PWC1070 is a sophisticated high power silicon stack technology thermal transfer module developed by Yaskawa Electric Co. Ltd. This device is suitable for a broad range of applications, such as the power control of heating, cooling, and defrost systems, as well as for lighting control. Furthermore, it provides thermal protection and phase control, as well as other benefits associated with thermal technology. In this article, we discuss the application fields and working principle of YAFD5624108PWC1070.

Application Fields

The YAFD5624108PWC1070 is suitable for a broad range of applications, including automotive, medical, industrial, power, and energy applications.
  • Automotive: In automotive applications, the YAFD5624108PWC1070 can be used to control the temperature of engine coolers, air conditioners, battery cooling systems, and other components. It can also be used to control vehicle electronic systems, such as DC/DC converters, power distribution systems, and central locking systems.
  • Medical: For medical applications, the YAFD5624108PWC1070 can be used to monitor and control patient temperature, as well as for incubators, stoves, and air conditioners. It can also be used to control medical equipment, such as anesthesia machines, ventilators, and patient monitors.
  • Industrial: In industrial applications, the YAFD5624108PWC1070 can be used to control industrial process controllers, such as temperature controllers, process controllers, and machine controllers. It also can be used to monitor energy usage in industrial plants and to control industrial HVAC and refrigeration systems.
  • Power: The YAFD5624108PWC1070 is suitable for power applications, such as power supplies and converters. It can also be used to control voltage and current in power grids, UPS systems, and other power systems.
  • Energy: In energy applications, the YAFD5624108PWC1070 can be used to control wind turbines and solar panels for renewable energy applications. It can also be used to control energy systems, such as electric vehicles and LED lighting systems.

Working Principle

The YAFD5624108PWC1070 is a high power silicon stack technology thermal transfer module. It utilizes a high power silicon switch to control the transfer of energy between a heat source and heat sink. The device is comprised of a dual N-channel silicon switch, gate drive circuitry, and integrated thermal protection circuitry.When energized, an electric current is passed through the N-channel silicon switch. This causes an electric field to form across the switch, allowing energy to pass through. Once the source and sink temperatures are within the desired range, a base plate and heat spreader are used to transfer the energy from the source to the sink. As the temperature increases, the base plate expands, creating a positive feedback loop that increases the amount of energy transferred.The integrated thermal protection circuitry prevents overloading of the system, ensuring that the device can safely handle high temperatures. The device also features over-current protection, over-voltage protection, and short circuit protection.

Conclusion

The YAFD5624108PWC1070 is a sophisticated high power silicon stack technology thermal transfer module developed by Yaskawa Electric Co. Ltd. This device is suitable for a broad range of applications, including automotive, medical, industrial, power, and energy applications. It utilizes a high power silicon switch to control the transfer of energy, as well as integrated thermal protection circuitry to ensure safe operation.

The specific data is subject to PDF, and the above content is for reference

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