16-bit dual codec ic - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
MC9S08QG8MPBE-N D	MC9S08QG8MPBE	NXP USA Inc	View more Series: S08 Packaging: Tube Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: IC, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP Base Part Number: MC9S08QG8	82 Order	1+: $2.2176 10+: $1.994 100+: $1.6339 500+: $1.3909 1000+: $1.1731
MC9RS08KA8CPG-N D	MC9RS08KA8CPG	NXP USA Inc	View more Series: RS08 Packaging: Tube Part Status: Active Core Processor: RS08 Core Size: 8-Bit Speed: 20MHz Connectivity: IC Peripherals: LVD, POR, PWM, WDT Number of I/O: 14 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 254 x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP Base Part Number: MC9RS08KA8	1000 Order	25+: $0.9765
MC9S08QE8CPG-ND	MC9S08QE8CPG	NXP USA Inc	View more Series: S08 Packaging: Tube Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: IC, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP Base Part Number: MC9S08QE8	652 Order	1+: $2.2365 10+: $2.0091 100+: $1.6462 500+: $1.4014 1000+: $1.1819
568-14478-ND	MC56F82313VLC	NXP USA Inc	View more Series: 56F8xxx Packaging: Tray Part Status: Active Core Processor: 56800EX Core Size: 32-Bit Speed: 50MHz Connectivity: IC, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 16KB (8K x 16) Program Memory Type: FLASH RAM Size: 2K x 16 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V Data Converters: A/D 6x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7) Base Part Number: MC56F82313	250 Order	1+: $3.1059 10+: $2.789 100+: $2.285 500+: $1.9452 1000+: $1.6405
MC9RS08KA4CPG-N D	MC9RS08KA4CPG	NXP USA Inc	View more Series: RS08 Packaging: Tube Part Status: Active Core Processor: RS08 Core Size: 8-Bit Speed: 20MHz Connectivity: IC Peripherals: LVD, POR, PWM, WDT Number of I/O: 14 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH RAM Size: 126 x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP Base Part Number: MC9RS08KA4	984 Order	1+: $1.0962 10+: $0.9853 100+: $0.7917 500+: $0.6505 1000+: $0.539
PLCF28335PGFA-N D	PLCF28335PGFA	Texas Instruments	View more Series: C2000 C28x Delfino Part Status: Active Core Processor: C28x Core Size: 32-Bit Speed: 150MHz Connectivity: CANbus, EBI/EMI, IC, McBSP, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Number of I/O: 88 Program Memory Size: 512KB (256K x 16) Program Memory Type: FLASH RAM Size: 34K x 16 Voltage - Supply (Vcc/Vdd): 1.805 V ~ 1.995 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA)	1000 Order	40+: $14.4199
MC9S08QG8CPBE-N D	MC9S08QG8CPBE	NXP USA Inc	View more Series: S08 Packaging: Tube Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: IC, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP Base Part Number: MC9S08QG8	3200 Order	--
568-14545-ND	S9S08SG8E2WTG	NXP USA Inc	View more Series: S08 Packaging: Tube Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: IC, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 150C (TA) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	1000 Order	1+: $2.3373 10+: $2.0992 100+: $1.7199 500+: $1.4641 1000+: $1.2348
MC56F82733VLC-N D	MC56F82733VLC	NXP USA Inc	View more Series: 56F8xxx Packaging: Tray Part Status: Active Core Processor: 56800EX Core Size: 32-Bit Speed: 100MHz Connectivity: IC, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 48KB (24K x 16) Program Memory Type: FLASH RAM Size: 4K x 16 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V Data Converters: A/D 6x12b; D/A 2x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7) Base Part Number: MC56F82733	1000 Order	250+: $2.6923
296-48430-ND	MSP430G2252TDA2	Texas Instruments	View more Series: MSP430G2xx Packaging: Tray Part Status: Active Core Processor: MSP430 Core Size: 16-Bit Speed: 16MHz Connectivity: IC, SPI, USI Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Number of I/O: 16 Program Memory Size: 2KB (2K x 8) Program Memory Type: FLASH RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: Die Supplier Device Package: Die Base Part Number: MSP430G2252	1000 Order	10+: $6.9974 100+: $5.9098 500+: $5.2572 1000+: $4.8221
ATXMEGA192D3-AU -ND	ATXMEGA192D3-AU	Microchip Technology	View more Series: AVR XMEGA D3 Packaging: Tray Part Status: Active Core Processor: AVR Core Size: 8/16-Bit Speed: 32MHz Connectivity: IC, IrDA, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Interface: IC, SPI Number of I/O: 50 Program Memory Size: 192KB (96K x 16) Voltage - Supply: 1.6 V ~ 3.6 V Program Memory Type: FLASH EEPROM Size: 2K x 8 Mounting Type: Surface Mount RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.6 V ~ 3.6 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 64-TQFP Supplier Device Package: 64-TQFP (14x14) Base Part Number: ATXMEGA192	19400 Order	--
C161JCLFCABXQMA 1-ND	C161JCLFCABXQMA 1	Infineon Technologies	View more Series: C16xx Packaging: Tray Part Status: Obsolete Core Processor: C166 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, EBI/EMI, IC, SLDM, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 93 Program Memory Type: ROMless RAM Size: 10K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: 0C ~ 70C (TA) Package / Case: 128-LQFP Supplier Device Package: 128-TQFP (20x20) Base Part Number: SA*C161JC	1000 Order	1+: $0
568-4013-ND	LPC2290FBD144/0 1,5	NXP USA Inc	View more Series: LPC2200 Packaging: Tray Part Status: Active Core Processor: ARM7 Core Size: 16/32-Bit Speed: 60MHz Connectivity: CANbus, EBI/EMI, IC, Microwire, SPI, SSI, SSP, UART/USART Peripherals: PWM, WDT Number of I/O: 76 Program Memory Type: ROMless RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20) Base Part Number: LPC2290	56 Order	1+: $6.3945 10+: $5.774 100+: $4.7805 500+: $4.1628 1000+: $3.6257
568-1897-ND	LPC2290FBD144,5 51	NXP USA Inc	View more Series: LPC2200 Packaging: Tray Part Status: Obsolete Core Processor: ARM7 Core Size: 16/32-Bit Speed: 60MHz Connectivity: CANbus, EBI/EMI, IC, Microwire, SPI, SSI, SSP, UART/USART Peripherals: PWM, WDT Number of I/O: 76 Program Memory Type: ROMless RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20) Base Part Number: LPC2290	1000 Order	1+: $0
S1C17M01F00C100 -ND	S1C17M01F00C100	Epson Electronics America Inc-Semiconductor Div	View more Packaging: Tray Part Status: Obsolete Core Processor: S1C17 Core Size: 16-Bit Speed: 16.3MHz Connectivity: IC, IrDA, SPI, UART/USART Peripherals: AMRC, LCD, PWM, RFC, WDT Number of I/O: 19 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 64-TQFP	1000 Order	1+: $0
AT80251G2D-SLSU L-ND	AT80251G2D-SLSU L	Microchip Technology	View more Series: 8x251 Packaging: Tube Part Status: Obsolete Core Processor: C251 Core Size: 8/16-Bit Speed: 16MHz Connectivity: EBI/EMI, IC, Microwire, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 32 Program Memory Type: ROMless RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59) Base Part Number: AT80251G2D	1000 Order	--
568-1896-ND	LPC2220FBD144,5 51	NXP USA Inc	View more Series: LPC2200 Packaging: Tray Part Status: Active Core Processor: ARM7 Core Size: 16/32-Bit Speed: 75MHz Connectivity: EBI/EMI, IC, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 76 Program Memory Type: ROMless RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20) Base Part Number: LPC2220	240 Order	1+: $5.8401 10+: $5.2769 100+: $4.369 500+: $3.8044 1000+: $3.3136
TSC80251G2D-L16 CE-ND	TSC80251G2D-L16 CE	Microchip Technology	View more Series: 8x251 Packaging: Tray Part Status: Obsolete Core Processor: C251 Core Size: 8/16-Bit Speed: 16MHz Connectivity: EBI/EMI, IC, Microwire, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 32 Program Memory Type: ROMless RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: 0C ~ 70C (TA) Package / Case: 44-LQFP Supplier Device Package: 44-VQFP (10x10) Base Part Number: TSC80251G2D	1000 Order	1+: $0
S1C17W22D00B000 -ND	S1C17W22D00B000	Epson Electronics America Inc-Semiconductor Div	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Core Processor: S1C17 Core Size: 16-Bit Speed: 4.2MHz Connectivity: IC, IrDA, SPI, UART/USART Peripherals: LCD, PWM, RFC, WDT Number of I/O: 41 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.2 V ~ 3.6 V Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: Die	1000 Order	1+: $0
TSC80251G2D-24C B-ND	TSC80251G2D-24C B	Microchip Technology	View more Series: 8x251 Packaging: Tube Part Status: Obsolete Core Processor: C251 Core Size: 8/16-Bit Speed: 24MHz Connectivity: EBI/EMI, IC, Microwire, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 32 Program Memory Type: ROMless RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: 0C ~ 70C (TA) Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59) Base Part Number: TSC80251G2D	1000 Order	--
568-4012-ND	LPC2210FBD144/0 1,5	NXP USA Inc	View more Series: LPC2200 Packaging: Tray Part Status: Active Core Processor: ARM7 Core Size: 16/32-Bit Speed: 60MHz Connectivity: EBI/EMI, IC, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 76 Program Memory Type: ROMless RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20) Base Part Number: LPC2210	2 Order	1+: $5.4243 10+: $4.9008 100+: $4.0572 500+: $3.533 1000+: $3.0771
TSC80251G2D-24I A-ND	TSC80251G2D-24I A	Microchip Technology	View more Series: 8x251 Packaging: Tube Part Status: Obsolete Core Processor: C251 Core Size: 8/16-Bit Speed: 24MHz Connectivity: EBI/EMI, IC, Microwire, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 32 Program Memory Type: ROMless RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 40-DIP (0.600", 15.24mm) Supplier Device Package: 40-PDIL Base Part Number: TSC80251G2D	1000 Order	1+: $0
S1C17F57D402000 -ND	S1C17F57D402000	Epson Electronics America Inc-Semiconductor Div	View more Packaging: Tape & Reel (TR) Part Status: Active Core Processor: S1C17 Core Size: 16-Bit Speed: 4.2MHz Connectivity: IC, IrDA, SPI, UART/USART Peripherals: PWM, WDT Number of I/O: 29 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: Die	1000 Order	500+: $2.3426
S1C17702F101100 -ND	S1C17702F101100	Epson Electronics America Inc-Semiconductor Div	View more Packaging: Tray Part Status: Active Core Processor: S1C17 Core Size: 16-Bit Speed: 8.2MHz Connectivity: IC, IrDA, SPI, UART/USART Peripherals: LCD, PWM, WDT Number of I/O: 28 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Oscillator Type: Internal Operating Temperature: -20C ~ 70C (TA) Package / Case: 176-LQFP	1000 Order	800+: $5.2164
KX161CJ16F40FBB NT-ND	KX161CJ16F40FBB NT	Infineon Technologies	View more Series: XC16x Part Status: Obsolete Core Processor: C166SV2 Core Size: 16-Bit Speed: 40MHz Connectivity: CANbus, EBI/EMI, IC, SLDM, SPI, UART/USART Peripherals: PWM, WDT Number of I/O: 99 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 2.7 V Data Converters: A/D 12x8/10b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA)	1000 Order	1+: $0
S1C17564F111100 -ND	S1C17564F111100	Epson Electronics America Inc-Semiconductor Div	View more Packaging: Tray Part Status: Active Core Processor: S1C17 Core Size: 16-Bit Speed: 24MHz Connectivity: IC, IrDA, SPI, UART/USART Peripherals: PWM, WDT Number of I/O: 40 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.65 V ~ 1.95 V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 64-TQFP	1000 Order	800+: $2.4324
568-2020-ND	LPC2220FET144/G ,55	NXP USA Inc	View more Series: LPC2200 Packaging: Tray Part Status: Active Core Processor: ARM7 Core Size: 16/32-Bit Speed: 75MHz Connectivity: EBI/EMI, IC, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 76 Program Memory Type: ROMless RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 144-TFBGA Supplier Device Package: 144-TFBGA (12x12) Base Part Number: LPC2220	1000 Order	189+: $4.9173
SAF-C161JC-LFCA -ND	SAF-C161JC-LF C A	Infineon Technologies	View more Series: C16xx Packaging: Tray Part Status: Obsolete Core Processor: C166 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, EBI/EMI, IC, SLDM, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 93 Program Memory Type: ROMless RAM Size: 10K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 128-LQFP Supplier Device Package: 128-TQFP (20x20) Base Part Number: SA*C161JC	1000 Order	1+: $0
S1C17704B103100 -ND	S1C17704B103100	Epson Electronics America Inc-Semiconductor Div	View more Packaging: Tray Part Status: Active Core Processor: S1C17 Core Size: 16-Bit Speed: 8.2MHz Connectivity: IC, IrDA, SPI, UART/USART Peripherals: LCD, PWM, WDT Number of I/O: 28 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Oscillator Type: Internal Operating Temperature: -20C ~ 70C (TA) Package / Case: 144-VFBGA	1000 Order	960+: $3.2883
S1C17W22F00B100 -ND	S1C17W22F00B100	Epson Electronics America Inc-Semiconductor Div	View more Packaging: Tray Part Status: Obsolete Core Processor: S1C17 Core Size: 16-Bit Speed: 4.2MHz Connectivity: IC, IrDA, SPI, UART/USART Peripherals: LCD, PWM, RFC, WDT Number of I/O: 41 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.2 V ~ 3.6 V Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 128-TQFP	1000 Order	1+: $0
MAXQ612X-2552+- ND	MAXQ612X-2552+	Maxim Integrated	View more Series: MAXQ Part Status: Obsolete Core Size: 16-Bit Speed: 12MHz Connectivity: IC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT Number of I/O: 56 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH RAM Size: 6K x 8 Voltage - Supply (Vcc/Vdd): 1.7 V ~ 3.6 V Oscillator Type: Internal Operating Temperature: 0C ~ 70C (TA)	1000 Order	1+: $0
TSC80251G2D-24C E-ND	TSC80251G2D-24C E	Microchip Technology	View more Series: 8x251 Packaging: Tray Part Status: Obsolete Core Processor: C251 Core Size: 8/16-Bit Speed: 24MHz Connectivity: EBI/EMI, IC, Microwire, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 32 Program Memory Type: ROMless RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: 0C ~ 70C (TA) Package / Case: 44-LQFP Supplier Device Package: 44-VQFP (10x10) Base Part Number: TSC80251G2D	1000 Order	1+: $0
TSC80251G2D-L16 CB-ND	TSC80251G2D-L16 CB	Microchip Technology	View more Series: 8x251 Packaging: Tube Part Status: Obsolete Core Processor: C251 Core Size: 8/16-Bit Speed: 16MHz Connectivity: EBI/EMI, IC, Microwire, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 32 Program Memory Type: ROMless RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: 0C ~ 70C (TA) Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59) Base Part Number: TSC80251G2D	1000 Order	--
AT80251G2D-RLTU M-ND	AT80251G2D-RLTU M	Microchip Technology	View more Series: 8x251 Packaging: Tray Part Status: Obsolete Core Processor: C251 Core Size: 8/16-Bit Speed: 24MHz Connectivity: EBI/EMI, IC, Microwire, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 32 Program Memory Type: ROMless RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 44-LQFP Supplier Device Package: 44-VQFP (10x10) Base Part Number: AT80251G2D	1000 Order	1+: $0
S1C17602F101100 -ND	S1C17602F101100	Epson Electronics America Inc-Semiconductor Div	View more Packaging: Tray Part Status: Active Core Processor: S1C17 Core Size: 16-Bit Speed: 8.2MHz Connectivity: IC, IrDA, SPI, UART/USART Peripherals: LCD, PWM, WDT Number of I/O: 36 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -25C ~ 70C (TA) Package / Case: 100-TQFP	1000 Order	--
S1C17564D111000 -ND	S1C17564D111000	Epson Electronics America Inc-Semiconductor Div	View more Packaging: Tray Part Status: Active Core Processor: S1C17 Core Size: 16-Bit Speed: 24MHz Connectivity: IC, IrDA, SPI, UART/USART Peripherals: PWM, WDT Number of I/O: 40 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.65 V ~ 1.95 V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 64-TQFP	1000 Order	630+: $1.8302
C161CSLFCAFXUMA 1-ND	C161CSLFCAFXUMA 1	Infineon Technologies	View more Series: C16xx Packaging: Tape & Reel (TR) Part Status: Obsolete Core Processor: C166 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, EBI/EMI, IC, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 93 Program Memory Type: ROMless RAM Size: 10K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 128-LQFP Supplier Device Package: P-TQFP-128-2	1000 Order	1+: $0
TSC80251G2D-24I B-ND	TSC80251G2D-24I B	Microchip Technology	View more Series: 8x251 Packaging: Tube Part Status: Obsolete Core Processor: C251 Core Size: 8/16-Bit Speed: 24MHz Connectivity: EBI/EMI, IC, Microwire, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 32 Program Memory Type: ROMless RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59) Base Part Number: TSC80251G2D	1000 Order	--
S1C17704F401100 -ND	S1C17704F401100	Epson Electronics America Inc-Semiconductor Div	View more Packaging: Tray Part Status: Active Core Processor: S1C17 Core Size: 16-Bit Speed: 8.2MHz Connectivity: IC, IrDA, SPI, UART/USART Peripherals: LCD, PWM, WDT Number of I/O: 28 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Oscillator Type: Internal Operating Temperature: -20C ~ 70C (TA) Package / Case: 144-TQFP	1000 Order	900+: $3.6306
568-3535-5-ND	PXAS30KFA,512	NXP USA Inc	View more Series: XA Packaging: Tube Part Status: Obsolete Core Processor: XA Core Size: 16-Bit Speed: 30MHz Connectivity: EBI/EMI, IC, UART/USART Peripherals: PWM, WDT Number of I/O: 32 Program Memory Type: ROMless RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: External Operating Temperature: -40C ~ 85C (TA) Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (24.23x24.23) Base Part Number: PXAS3	1000 Order	1+: $0

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