256 bytes uart interface - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
70T3589S166BC-N D	70T3589S166BC	IDT, Integrated Device Technology Inc	View more Packaging: Tray Part Status: Active Memory Type: Volatile Memory Format: SRAM Technology: SRAM - Dual Port, Synchronous Memory Size: 2Mb (64K x 36) Clock Frequency: 166MHz Access Time: 3.6ns Memory Interface: Parallel Voltage - Supply: 2.4 V ~ 2.6 V Operating Temperature: 0C ~ 70C (TA) Mounting Type: Surface Mount Package / Case: 256-LBGA Supplier Device Package: 256-CABGA (17x17) Base Part Number: IDT70T3589	1000 Order	12+: $57.2061
70V7339S200BC8- ND	70V7339S200BC8	IDT, Integrated Device Technology Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Memory Type: Volatile Memory Format: SRAM Technology: SRAM - Dual Port, Synchronous Memory Size: 9Mb (512K x 18) Clock Frequency: 200MHz Access Time: 3.4ns Memory Interface: Parallel Voltage - Supply: 3.15 V ~ 3.45 V Operating Temperature: 0C ~ 70C (TA) Mounting Type: Surface Mount Package / Case: 256-LBGA Supplier Device Package: 256-CABGA (17x17) Base Part Number: IDT70V7339	1000 Order	1000+: $62.1466
70T633S12BCI8-N D	70T633S12BCI8	IDT, Integrated Device Technology Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Memory Type: Volatile Memory Format: SRAM Technology: SRAM - Dual Port, Asynchronous Memory Size: 9Mb (512K x 18) Write Cycle Time - Word, Page: 12ns Access Time: 12ns Memory Interface: Parallel Voltage - Supply: 2.4 V ~ 2.6 V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 256-LBGA Supplier Device Package: 256-CABGA (17x17) Base Part Number: IDT70T633	1000 Order	1000+: $87.2543
428-3290-ND	CYD18S18V18-200 BBAXI	Cypress Semiconductor Corp	View more Packaging: Tray Part Status: Obsolete Memory Type: Volatile Memory Format: SRAM Technology: SRAM - Dual Port, Synchronous Memory Size: 18Mb (1M x 18) Clock Frequency: 200MHz Access Time: 3.3ns Memory Interface: Parallel Voltage - Supply: 1.42 V ~ 1.58 V, 1.7 V ~ 1.9 V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17) Base Part Number: CYD18S18	1000 Order	1+: $0
70V3579S6BC8-ND	70V3579S6BC8	IDT, Integrated Device Technology Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Memory Type: Volatile Memory Format: SRAM Technology: SRAM - Dual Port, Synchronous Memory Size: 1.125Mb (32K x 36) Access Time: 6ns Memory Interface: Parallel Voltage - Supply: 3.15 V ~ 3.45 V Operating Temperature: 0C ~ 70C (TA) Mounting Type: Surface Mount Package / Case: 256-LBGA Supplier Device Package: 256-CABGA (17x17) Base Part Number: IDT70V3579	1000 Order	1000+: $32.7601
70V658S12BC8-ND	70V658S12BC8	IDT, Integrated Device Technology Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Memory Type: Volatile Memory Format: SRAM Technology: SRAM - Dual Port, Asynchronous Memory Size: 2Mb (64K x 36) Write Cycle Time - Word, Page: 12ns Access Time: 12ns Memory Interface: Parallel Voltage - Supply: 3.15 V ~ 3.45 V Operating Temperature: 0C ~ 70C (TA) Mounting Type: Surface Mount Package / Case: 256-LBGA Supplier Device Package: 256-CABGA (17x17) Base Part Number: IDT70V658	1000 Order	1000+: $46.9374
CYD09S72V18-250 BBXC-ND	CYD09S72V18-250 BBXC	Cypress Semiconductor Corp	View more Packaging: Tray Part Status: Obsolete Memory Type: Volatile Memory Format: SRAM Technology: SRAM - Dual Port, Synchronous Memory Size: 9Mb (128K x 72) Clock Frequency: 250MHz Access Time: 2.64ns Memory Interface: Parallel Voltage - Supply: 1.42 V ~ 1.58 V, 1.7 V ~ 1.9 V Operating Temperature: 0C ~ 70C (TA) Mounting Type: Surface Mount Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17) Base Part Number: CYD09S72	1000 Order	1+: $0
CYD02S36V18-167 BBC-ND	CYD02S36V18-167 BBC	Cypress Semiconductor Corp	View more Packaging: Tray Part Status: Obsolete Memory Type: Volatile Memory Format: SRAM Technology: SRAM - Dual Port, Synchronous Memory Size: 2Mb (64K x 36) Clock Frequency: 167MHz Access Time: 4ns Memory Interface: Parallel Voltage - Supply: 1.7 V ~ 1.9 V Operating Temperature: 0C ~ 70C (TA) Mounting Type: Surface Mount Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17) Base Part Number: CYD02S36	1000 Order	1+: $0
A2F060M3E-1FGG2 56-ND	A2F060M3E-1FGG2 56	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17) Number of I/O: MCU - 26, FPGA - 66 Base Part Number: A2F060M3E	1000 Order	1+: $0
A2F060M3E-1FGG2 56M-ND	A2F060M3E-1FGG2 56M	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -55C ~ 125C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17) Number of I/O: MCU - 26, FPGA - 66 Base Part Number: A2F060M3E	1000 Order	1+: $0
A2F060M3E-1FG25 6M-ND	A2F060M3E-1FG25 6M	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -55C ~ 125C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: MCU - 26, FPGA - 66 Base Part Number: A2F060M3E	1000 Order	1+: $0
A2F060M3E-1FG25 6-ND	A2F060M3E-1FG25 6	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: MCU - 26, FPGA - 66 Base Part Number: A2F060M3E	1000 Order	1+: $0
1100-1003-ND	A2F200M3F-FGG25 6	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17) Number of I/O: MCU - 25, FPGA - 66 Base Part Number: A2F200	1000 Order	1+: $0
1100-1007-ND	A2F500M3G-1FGG2 56	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17) Number of I/O: MCU - 25, FPGA - 66 Base Part Number: A2F500M3G	1000 Order	1+: $0
A2F060M3E-FG256 M-ND	A2F060M3E-FG256 M	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -55C ~ 125C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: MCU - 26, FPGA - 66 Base Part Number: A2F060M3E	1000 Order	1+: $0
A2F060M3E-1FGG2 56I-ND	A2F060M3E-1FGG2 56I	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -40C ~ 100C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17) Number of I/O: MCU - 26, FPGA - 66 Base Part Number: A2F060M3E	1000 Order	1+: $0
A2F060M3E-1FG25 6I-ND	A2F060M3E-1FG25 6I	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -40C ~ 100C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: MCU - 26, FPGA - 66 Base Part Number: A2F060M3E	1000 Order	1+: $0
A2F060M3E-FGG25 6I-ND	A2F060M3E-FGG25 6I	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -40C ~ 100C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17) Number of I/O: MCU - 26, FPGA - 66 Base Part Number: A2F060M3E	1000 Order	1+: $0
A2F500M3G-FGG25 6M-ND	A2F500M3G-FGG25 6M	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -55C ~ 125C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17) Number of I/O: MCU - 25, FPGA - 66 Base Part Number: A2F500M3G	1000 Order	1+: $0
1100-1000-ND	A2F200M3F-1FGG2 56	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17) Number of I/O: MCU - 25, FPGA - 66 Base Part Number: A2F200	1000 Order	1+: $0
1100-1009-ND	A2F500M3G-FGG25 6	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17) Number of I/O: MCU - 25, FPGA - 66 Base Part Number: A2F500M3G	1000 Order	--
A2F060M3E-FG256 I-ND	A2F060M3E-FG256 I	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -40C ~ 100C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: MCU - 26, FPGA - 66 Base Part Number: A2F060M3E	1000 Order	1+: $0
A2F500M3G-FG256 M-ND	A2F500M3G-FG256 M	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -55C ~ 125C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: MCU - 25, FPGA - 66 Base Part Number: A2F500M3G	1000 Order	1+: $0
A2F500M3G-1FG25 6M-ND	A2F500M3G-1FG25 6M	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -55C ~ 125C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: MCU - 25, FPGA - 66 Base Part Number: A2F500M3G	1000 Order	1+: $0
A2F500M3G-1FGG2 56M-ND	A2F500M3G-1FGG2 56M	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -55C ~ 125C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17) Number of I/O: MCU - 25, FPGA - 66 Base Part Number: A2F500M3G	1000 Order	90+: $385.234
A2F060M3E-FGG25 6-ND	A2F060M3E-FGG25 6	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17) Number of I/O: MCU - 26, FPGA - 66 Base Part Number: A2F060M3E	1000 Order	1+: $0
A2F060M3E-FGG25 6M-ND	A2F060M3E-FGG25 6M	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -55C ~ 125C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17) Number of I/O: MCU - 26, FPGA - 66 Base Part Number: A2F060M3E	1000 Order	1+: $0
A2F060M3E-FG256 -ND	A2F060M3E-FG256	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: MCU - 26, FPGA - 66 Base Part Number: A2F060M3E	1000 Order	1+: $0
1568-1144-ND	DEV-13040	SparkFun Electronics	View more Part Status: Obsolete Platform: Intel Edison Type: Interface Function: UART Contents: Board(s)	1000 Order	1+: $0
768-1002-ND	VDIP2	FTDI, Future Technology Devices International Ltd	View more Series: Vinculum Part Status: Active Type: Interface Function: USB 2.0 Host/Controller Embedded: Yes, ASIC Utilized IC / Part: VNC1L-1A Primary Attributes: Dual A-Type Connector, UART / Parallel FIFO / SPI Interfaces Supplied Contents: Board(s) Secondary Attributes: Firmware Update via USB Flash Drive or UART, Traffic LEDs	23 Order	1+: $18.585 10+: $17.4277
TMS320C6747DZKB T3R-ND	TMS320C6747DZKB T3R	Texas Instruments	View more Series: TMS320C674x Packaging: Tape & Reel (TR) Part Status: Discontinued at Digi-Key Type: Fixed/Floating Point Interface: EBI/EMI, Ethernet MAC, Host Interface, IC, McASP, SPI, UART, USB Clock Rate: 375MHz Non-Volatile Memory: External On-Chip RAM: 448kB Voltage - I/O: 3.30V Voltage - Core: 1.20V Operating Temperature: -40C ~ 125C (TJ) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-BGA (17x17) Base Part Number: TMS320C6747	1000 Order	1+: $0
602-1198-ND	XEB-AW140	Digi International	View more Series: XPress Part Status: Obsolete Type: Interface Function: Anti Tamper and Security Utilized IC / Part: XEB-AW140 Primary Attributes: AES 128/192/256 Bit Encryption at 5Mbps Supplied Contents: Board(s)	5 Order	1+: $179.55
768-1011-ND	C232HD-DDHSP-0	FTDI, Future Technology Devices International Ltd	View more Series: C232HD Part Status: Active Lead Free Status / RoHS Status: Lead free / RoHS Compliant Usage: USB to UART Moisture Sensitivity Level (MSL): 1 (Unlimited) Convert From (Adapter End): USB - A, Plug Convert To (Adapter End): Single Pole, 10 Female Sockets Length: 5.90' (1.80m)	415 Order	1+: $18.3141 10+: $18.1125
768-1112-ND	C232HD-EDHSP-0	FTDI, Future Technology Devices International Ltd	View more Series: C232HD Part Status: Active Lead Free Status / RoHS Status: Lead free / RoHS Compliant Usage: USB to UART Moisture Sensitivity Level (MSL): 1 (Unlimited) Convert From (Adapter End): USB - A, Plug Convert To (Adapter End): Single Pole, 10 Female Sockets Length: 5.90' (1.80m)	269 Order	1+: $17.9928 10+: $17.7975
MTI-10-2A8G4-ND	MTI-10-2A8G4	XSens Technologies BV	View more Series: MTi 10 Part Status: Active Sensor Type: Accelerometer, Gyroscope, Magnetometer, 3 Axis Output Type: UART, USB Operating Temperature: -40C ~ 85C (TA)	4 Order	1+: $535.5
MTI-30-2A5G4-ND	MTI-30-2A5G4	XSens Technologies BV	View more Series: MTi 10 Part Status: Obsolete Sensor Type: Accelerometer, Gyroscope, Magnetometer, 3 Axis Output Type: UART, USB Operating Temperature: -40C ~ 85C (TA)	1000 Order	1+: $0
MTI-10-2A5G4-ND	MTI-10-2A5G4	XSens Technologies BV	View more Series: MTi 10 Part Status: Discontinued at Digi-Key Sensor Type: Accelerometer, Gyroscope, Magnetometer, 3 Axis Output Type: UART, USB Operating Temperature: -40C ~ 85C (TA)	1000 Order	1+: $535.5
342-1101-ND	HG1120AA50		View more Part Status: Active Sensor Type: Accelerometer, Gyroscope, Magnetometer, 3 Axis Output Type: CAN, SPI, UART Operating Temperature: -40C ~ 85C (TA)	5 Order	1+: $629.213
1845-1004-ND	V50024-17-02	Thales Visionix - a Division of Thales Defense & Security, Inc.	View more Series: NavChip Part Status: Active Sensor Type: Accelerometer, Gyroscope, Temperature, 6 Axis Output Type: SPI, TTL, UART Operating Temperature: -40C ~ 85C (TA)	1000 Order	1+: $283.5
MTI-20-2A8G4-ND	MTI-20-2A8G4	XSens Technologies BV	View more Series: MTi 10 Part Status: Active Sensor Type: Accelerometer, Gyroscope, Magnetometer, 3 Axis Output Type: UART, USB Operating Temperature: -40C ~ 85C (TA)	4 Order	1+: $0.63

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