54-segment display driver - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
MM908E626AVDWB- ND	MM908E626AVDWB	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 115C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E626	1000 Order	--
MM908E626AVEK-N D	MM908E626AVEK	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 115C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E626	1000 Order	--
MM908E624ACDWBR 2-ND	MM908E624ACDWBR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	--
MM908E624AYEW-N D	MM908E624AYEW	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	--
MM908E624AYEWR2 -ND	MM908E624AYEWR2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	1+: $0
MM908E625ACEK-N D	MM908E625ACEK	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E625	1000 Order	--
MM908E622ACEK-N D	MM908E622ACEK	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E622	1000 Order	--
MM908E624ACEW-N D	MM908E624ACEW	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	--
MM908E624ACDWB- ND	MM908E624ACDWB	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	--
MM908E621ACDWBR 2-ND	MM908E621ACDWBR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E621	1000 Order	1+: $0
MM908E622ACPEKR 2-ND	MM908E622ACPEKR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E622	1000 Order	1000+: $4.1419
MM908E625ACDWB- ND	MM908E625ACDWB	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E625	1000 Order	--
MM908E622ACPEK- ND	MM908E622ACPEK	NXP USA Inc	View more Packaging: Tube Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E622	1000 Order	--
MM908E624ACPEW- ND	MM908E624ACPEW	NXP USA Inc	View more Packaging: Tube Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	--
MM908E626AVPEKR 2-ND	MM908E626AVPEKR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 115C Mounting Type: Surface Mount Package / Case: 54-SOIC (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC W EP Base Part Number: MM908E626	1000 Order	1000+: $3.5636
MM908E624ACEWR2 TR-ND	MM908E624ACEWR2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	--
MM908E621ACPEKR 2-ND	MM908E621ACPEKR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC W EP Base Part Number: MM908E621	1000 Order	1000+: $3.5721
MM908E625ACPEKR 2-ND	MM908E625ACPEKR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-SOIC (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC	1000 Order	1000+: $3.5211
MM908E622ACDWB- ND	MM908E622ACDWB	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E622	1000 Order	--
MM908E626AVPEK- ND	MM908E626AVPEK	NXP USA Inc	View more Packaging: Tube Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 115C Mounting Type: Surface Mount Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC Base Part Number: MM908E626	1000 Order	--
MM908E624AYPEWR 2-ND	MM908E624AYPEWR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	1000+: $3.0958
MM908E624AYPEW- ND	MM908E624AYPEW	NXP USA Inc	View more Packaging: Tube Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	--
MM908E621ACDWB- ND	MM908E621ACDWB	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E621	1000 Order	1+: $0
568-14587-ND	MM908E625ACPEK	NXP USA Inc	View more Packaging: Tube Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E625	26 Order	--
MM908E624ACPEWR 2-ND	MM908E624ACPEWR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	--
TLE9879QXA40XUM A1TR-ND	TLE9879QXA40XUM A1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: ARM Cortex-M3 Program Memory Type: FLASH (128 kB) RAM Size: 6K x 8 Interface: LIN, SSI, UART Number of I/O: 10 Voltage - Supply: 5.5 V ~ 28 V Operating Temperature: -40C ~ 150C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: VQFN-48-31	1000 Order	1+: $0
TLE98442QXXUMA1 TR-ND	TLE98442QXXUMA1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: ARM Cortex-M0 Program Memory Type: FLASH (64 kB) RAM Size: 4K x 8 Interface: LIN, SSI, UART Number of I/O: 10 Voltage - Supply: 3 V ~ 28 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	2500 Order	2500+: $1.3688
TLE9832QXXUMA1- ND	TLE9832QXXUMA1	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0
TLE9879QXA20XUM A1-ND	TLE9879QXA20XUM A1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Applications: Automotive Core Processor: ARM Cortex-M3 Program Memory Type: FLASH (128 kB) RAM Size: 6K x 8 Interface: LIN, SSI, UART Number of I/O: 10 Voltage - Supply: 5.5 V ~ 28 V Operating Temperature: -40C ~ 150C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-29	1000 Order	2500+: $2.143
TLE9832QVXUMA2- ND	TLE9832QVXUMA2	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0
TLE9867QXA40XUM A1-ND	TLE9867QXA40XUM A1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Applications: Automotive Core Processor: ARM Cortex-M3 Program Memory Type: FLASH (64 kB) RAM Size: 6K x 8 Interface: LIN, SSI, UART Number of I/O: 10 Voltage - Supply: 5.5 V ~ 28 V Operating Temperature: -40C ~ 150C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: VQFN-48-31	1000 Order	2500+: $1.8464
TLE9832-2QX-ND	TLE9832-2QX	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0
TLE9861QXA20XUM A1-ND	TLE9861QXA20XUM A1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Applications: Automotive Core Processor: ARM Cortex-M3 Program Memory Type: FLASH (36 kB) RAM Size: 3K x 8 Interface: SSI, UART Number of I/O: 10 Voltage - Supply: 5.5 V ~ 28 V Operating Temperature: -40C ~ 150C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-29	1000 Order	2500+: $1.5276
TLE9832QV-ND	TLE9832QV	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0
TLE98322QXXUMA1 -ND	TLE98322QXXUMA1	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0
TLE9833QXXUMA2- ND	TLE9833QXXUMA2	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (48 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-29	1000 Order	1+: $0
TLE98322QVXUMA3 -ND	TLE98322QVXUMA3	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0
TLE9835QX-ND	TLE9835QX	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (64 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-29	1000 Order	1+: $0
TLE9833QXXUMA1- ND	TLE9833QXXUMA1	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (48 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad	1000 Order	1+: $0
TLE9835QXXUMA1- ND	TLE9835QXXUMA1	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (64 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-29	1000 Order	1+: $0

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