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Search Result:compu-shift ii 4l60e controller from hgm automotive electronics

 --1148 Item(s) In Category:Embedded - Microcontrollers - Application Specific

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Photo Allicdata Part# Mft.Part# Company Spec. QTY. Pricing(USD) PDF
TLE9834QXXUMA1 TLE9834QXXUMA1-
ND		 TLE9834QXXUMA1 Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (64 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 11
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-29
1000
Order

1+:

$0

 TLE9834QXXUMA1-ND Datasheet
LX3301A LX3301A-ND LX3301A Microsemi Corporation
View more  Series: Automotive, AEC-Q100
 Part Status: Active
 Applications: Inductive Sensor Interface
 Core Processor: 32-Bit RISC
 Program Memory Type: ROM (12 kB)
 Interface: Analog, PWM
 Operating Temperature: -40C ~ 125C
 Mounting Type: Surface Mount
 Supplier Device Package: 14-TSSOP
1000
Order

2500+:

$0.8793

 LX3301A-ND Datasheet
MM912G634CV2AP MM912G634CV2AP-
ND		 MM912G634CV2AP NXP USA Inc
View more  Packaging: Tray
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (48 kB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.25 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP
 Supplier Device Package: 48-LQFP (7x7)
 Base Part Number: MM912G634
1000
Order

1+:

$0

 MM912G634CV2AP-ND Datasheet
TLE98322QVXUMA1 TLE98322QVXUMA1
-ND		 TLE98322QVXUMA1 Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (36 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 11
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-31
1000
Order

1+:

$0

 TLE98322QVXUMA1-ND Datasheet
TLE9832QVXUMA1 TLE9832QVXUMA1-
ND		 TLE9832QVXUMA1 Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (36 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 11
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-31
1000
Order

1+:

$0

 TLE9832QVXUMA1-ND Datasheet
TLE9831QV TLE9831QV-ND TLE9831QV Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (36 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 5
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-31
1000
Order

1+:

$0

 TLE9831QV-ND Datasheet
MM912G634DV2AP MM912G634DV2AP-
ND		 MM912G634DV2AP NXP USA Inc
View more  Packaging: Tray
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (48 kB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP
 Supplier Device Package: 48-LQFP (7x7)
 Base Part Number: MM912G634
1000
Order

--

 MM912G634DV2AP-ND Datasheet
TLE9832QX TLE9832QX-ND TLE9832QX Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (36 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 11
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-31
1000
Order

1+:

$0

 TLE9832QX-ND Datasheet
MM912G634DC2APR2 MM912G634DC2APR
2-ND		 MM912G634DC2APR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (48 kB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP
 Supplier Device Package: 48-LQFP (7x7)
 Base Part Number: MM912G634
1000
Order

2000+:

$3.1505

 MM912G634DC2APR2-ND Datasheet
TLE9833QXXUMA1 TLE9833QXXUMA1-
ND		 TLE9833QXXUMA1 Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (48 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 11
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
1000
Order

1+:

$0

 TLE9833QXXUMA1-ND Datasheet
MB88121CPMC1-GS-ERE2 MB88121CPMC1-GS
-ERE2-ND		 MB88121CPMC1-GS
-ERE2		 Cypress Semiconductor Corp
View more  Packaging: Tray
 Part Status: Last Time Buy
 Applications: Automotive
 Core Processor: External
 Program Memory Type: External Program Memory
 RAM Size: 8K x 8
 Interface: Parallel Host, SPI
 Voltage - Supply: 1.65 V ~ 5.5 V
 Operating Temperature: -40C ~ 125C (TA)
 Mounting Type: Surface Mount
 Package / Case: 64-LQFP
 Supplier Device Package: 64-LQFP (10x10)
1000
Order

1500+:

$11.466

 MB88121CPMC1-GS-ERE2-ND Datasheet
TLE9832QXXUMA2 TLE9832QXXUMA2-
ND		 TLE9832QXXUMA2 Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (36 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 11
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-31
1000
Order

1+:

$0

 TLE9832QXXUMA2-ND Datasheet
TLE9835QXXUMA1 TLE9835QXXUMA1-
ND		 TLE9835QXXUMA1 Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (64 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 11
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-29
1000
Order

1+:

$0

 TLE9835QXXUMA1-ND Datasheet
TLE9833QXXUMA2 TLE9833QXXUMA2-
ND		 TLE9833QXXUMA2 Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (48 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 11
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-29
1000
Order

1+:

$0

 TLE9833QXXUMA2-ND Datasheet
MM912H634DV1AE 568-14486-ND MM912H634DV1AE NXP USA Inc
View more  Packaging: Tray
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (64 kB)
 Controller Series: HCS12
 RAM Size: 6K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912H634
250
Order

--

 568-14486-ND Datasheet
MM912F634DV2APR2 MM912F634DV2APR
2-ND		 MM912F634DV2APR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (32 KB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP
 Supplier Device Package: 48-LQFP (7x7)
 Base Part Number: MM912F634
1000
Order

2000+:

$1.8937

 MM912F634DV2APR2-ND Datasheet
TLE9832QXXUMA3 TLE9832QXXUMA3-
ND		 TLE9832QXXUMA3 Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (36 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 11
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-31
1000
Order

1+:

$0

 TLE9832QXXUMA3-ND Datasheet
MM912F634CV2APR2 MM912F634CV2APR
2-ND		 MM912F634CV2APR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (32 KB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912F634
1000
Order

1+:

$0

 MM912F634CV2APR2-ND Datasheet
MM912F634CV2AP MM912F634CV2AP-
ND		 MM912F634CV2AP NXP USA Inc
View more  Packaging: Tray
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (32 KB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912F634
1000
Order

1+:

$0

 MM912F634CV2AP-ND Datasheet
MM912G634DM1AE MM912G634DM1AE-
ND		 MM912G634DM1AE NXP USA Inc
View more  Packaging: Tray
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (48 kB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912G634
1000
Order

250+:

$5.0016

 MM912G634DM1AE-ND Datasheet
MM912F634CV2AE MM912F634CV2AE-
ND		 MM912F634CV2AE NXP USA Inc
View more  Packaging: Tray
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (32 KB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912F634
1000
Order

--

 MM912F634CV2AE-ND Datasheet
TLE98322QXXUMA1 TLE98322QXXUMA1
-ND		 TLE98322QXXUMA1 Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (36 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 11
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-31
1000
Order

1+:

$0

 TLE98322QXXUMA1-ND Datasheet
MM912F634BV1AE MM912F634BV1AE-
ND		 MM912F634BV1AE NXP USA Inc
View more  Packaging: Tray
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (32 KB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912F634
1000
Order

--

 MM912F634BV1AE-ND Datasheet
MM912F634DV1AE MM912F634DV1AE-
ND		 MM912F634DV1AE NXP USA Inc
View more  Packaging: Tray
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (32 KB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912F634
1000
Order

--

 MM912F634DV1AE-ND Datasheet
MM912G634DC2AP MM912G634DC2AP-
ND		 MM912G634DC2AP NXP USA Inc
View more  Packaging: Tray
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (48 kB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP
 Supplier Device Package: 48-LQFP (7x7)
 Base Part Number: MM912G634
1000
Order

250+:

$4.027

 MM912G634DC2AP-ND Datasheet
TLE98322QVXUMA2 TLE98322QVXUMA2
-ND		 TLE98322QVXUMA2 Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (36 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 11
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-31
1000
Order

1+:

$0

 TLE98322QVXUMA2-ND Datasheet
TLE9832QV TLE9832QV-ND TLE9832QV Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (36 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 11
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-31
1000
Order

1+:

$0

 TLE9832QV-ND Datasheet
MM912F634DV2AP MM912F634DV2AP-
ND		 MM912F634DV2AP NXP USA Inc
View more  Packaging: Tray
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (32 KB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP
 Supplier Device Package: 48-LQFP (7x7)
 Base Part Number: MM912F634
1000
Order

--

 MM912F634DV2AP-ND Datasheet
TLE9832QVXUMA2 TLE9832QVXUMA2-
ND		 TLE9832QVXUMA2 Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (36 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 11
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-31
1000
Order

1+:

$0

 TLE9832QVXUMA2-ND Datasheet
MM912G634DV2APR2 MM912G634DV2APR
2-ND		 MM912G634DV2APR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (48 kB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP
 Supplier Device Package: 48-LQFP (7x7)
 Base Part Number: MM912G634
1000
Order

2000+:

$3.6281

 MM912G634DV2APR2-ND Datasheet
MM912F634CV1AE MM912F634CV1AE-
ND		 MM912F634CV1AE NXP USA Inc
View more  Packaging: Tray
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (32 KB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912F634
1000
Order

--

 MM912F634CV1AE-ND Datasheet
TLE9834QXXUMA2 TLE9834QXXUMA2-
ND		 TLE9834QXXUMA2 Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (64 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 11
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-29
1000
Order

1+:

$0

 TLE9834QXXUMA2-ND Datasheet
MM912H634DM1AE 568-14449-ND MM912H634DM1AE NXP USA Inc
View more  Packaging: Tray
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (64 kB)
 Controller Series: HCS12
 RAM Size: 6K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912H634
250
Order

--

 568-14449-ND Datasheet
MB88121CPMC1-GS-N2E2 428-4313-ND MB88121CPMC1-GS
-N2E2		 Cypress Semiconductor Corp
View more  Packaging: Tray
 Part Status: Active
 Applications: Automotive
 Core Processor: External
 Program Memory Type: External Program Memory
 RAM Size: 8K x 8
 Interface: Parallel Host, SPI
 Voltage - Supply: 1.65 V ~ 5.5 V
 Operating Temperature: -40C ~ 125C (TA)
 Mounting Type: Surface Mount
 Package / Case: 64-LQFP
 Supplier Device Package: 64-LQFP (10x10)
220
Order

1+:

$12.6

10+:

$11.655

25+:

$10.71

160+:

$9.954

320+:

$9.135

640+:

$8.694

 428-4313-ND Datasheet
TLE9831QVXUMA2 TLE9831QVXUMA2-
ND		 TLE9831QVXUMA2 Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (36 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 5
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-31
1000
Order

1+:

$0

 TLE9831QVXUMA2-ND Datasheet
MM912G634CV1AER2 MM912G634CV1AER
2-ND		 MM912G634CV1AER
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (48 kB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.25 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912G634
1000
Order

1+:

$0

 MM912G634CV1AER2-ND Datasheet
MM912F634BV1AER2 MM912F634BV1AER
2-ND		 MM912F634BV1AER
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (32 KB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912F634
1000
Order

1+:

$0

 MM912F634BV1AER2-ND Datasheet
MM912G634DC1AER2 MM912G634DC1AER
2-ND		 MM912G634DC1AER
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (48 kB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912G634
1000
Order

2000+:

$3.3851

 MM912G634DC1AER2-ND Datasheet
MM912H634DM1AER2 MM912H634DM1AER
2-ND		 MM912H634DM1AER
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (64 kB)
 Controller Series: HCS12
 RAM Size: 6K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912H634
1000
Order

2000+:

$1.8434

 MM912H634DM1AER2-ND Datasheet
MM912H634DV1AER2 MM912H634DV1AER
2-ND		 MM912H634DV1AER
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (64 kB)
 Controller Series: HCS12
 RAM Size: 6K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912H634
1000
Order

--

 MM912H634DV1AER2-ND Datasheet
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