Enhanced embedded rs-485 transceiver ic chip

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
122-1925-ND	XC7Z030-2SBG485 I	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex-7 FPGA, 125K Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-FBGA Supplier Device Package: 485-FBGA (19x19) Number of I/O: 130	71 Order	--
122-2007-ND	XC7Z012S-2CLG48 5E	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Single ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 766MHz Primary Attributes: Artix-7 FPGA, 55K Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 484-LFBGA, CSPBGA Supplier Device Package: 485-CSBGA (19x19) Number of I/O: 150	84 Order	1+: $78.6744
122-2006-ND	XC7Z012S-2CLG48 5I	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Single ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 766MHz Primary Attributes: Artix-7 FPGA, 55K Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-LFBGA, CSPBGA Supplier Device Package: 485-CSBGA (19x19) Number of I/O: 150	81 Order	1+: $82.2465
XC7Z030-1SB485I -ND	XC7Z030-1SB485I	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Kintex-7 FPGA, 125K Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-FBGA Supplier Device Package: 485-FBGA (19x19) Number of I/O: 130	1000 Order	1+: $217.854
122-1924-ND	XC7Z030-1SBG485 C	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Kintex-7 FPGA, 125K Logic Cells Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-FBGA Supplier Device Package: 485-FBGA (19x19) Number of I/O: 130	18 Order	--
122-2014-ND	XC7Z012S-1CLG48 5C	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Single ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Artix-7 FPGA, 55K Logic Cells Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-LFBGA, CSPBGA Supplier Device Package: 485-CSBGA (19x19) Number of I/O: 150	49 Order	1+: $62.181
122-1926-ND	XC7Z030-3SBG485 E	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1GHz Primary Attributes: Kintex-7 FPGA, 125K Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 484-FBGA Supplier Device Package: 485-FBGA (19x19) Number of I/O: 130	9 Order	1+: $240.786
XC7Z030-2SBG485 E-ND	XC7Z030-2SBG485 E	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex-7 FPGA, 125K Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 484-FBGA Supplier Device Package: 485-FBGA (19x19) Number of I/O: 130	1000 Order	2+: $200.655
XC7Z030-2SB485I -ND	XC7Z030-2SB485I	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex-7 FPGA, 125K Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-FBGA Supplier Device Package: 485-FBGA (19x19) Number of I/O: 130	1000 Order	1+: $261.261
122-2180-ND	XC7Z030-1SBG485 I	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Kintex-7 FPGA, 125K Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-FBGA Supplier Device Package: 485-FBGA (19x19) Number of I/O: 130	82 Order	--
XC7Z015-L1CLG48 5I-ND	XC7Z015-L1CLG48 5I	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Artix-7 FPGA, 74K Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-LFBGA, CSPBGA Supplier Device Package: 485-CSBGA (19x19) Number of I/O: 130	1000 Order	84+: $100.737
122-2001-ND	XC7Z012S-1CLG48 5I	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Single ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Artix-7 FPGA, 55K Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-LFBGA, CSPBGA Supplier Device Package: 485-CSBGA (19x19) Number of I/O: 150	84 Order	1+: $71.5302
XC7Z030-L2SBG48 5I-ND	XC7Z030-L2SBG48 5I	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex-7 FPGA, 125K Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-FBGA Supplier Device Package: 485-FBGA (19x19) Number of I/O: 130	1000 Order	1+: $240.786
122-2189-ND	XC7Z015-2CLG485 E	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 766MHz Primary Attributes: Artix-7 FPGA, 74K Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 484-LFBGA, CSPBGA Supplier Device Package: 485-CSBGA (19x19) Number of I/O: 130	84 Order	--
XC7Z015-3CLG485 E-ND	XC7Z015-3CLG485 E	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 866MHz Primary Attributes: Artix-7 FPGA, 74K Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 484-LFBGA, CSPBGA Supplier Device Package: 485-CSBGA (19x19) Number of I/O: 130	1000 Order	--
122-2088-ND	XC7Z015-2CLG485 I	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 766MHz Primary Attributes: Artix-7 FPGA, 74K Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-LFBGA, CSPBGA Supplier Device Package: 485-CSBGA (19x19) Number of I/O: 130	500 Order	1+: $41.04
122-2190-ND	XC7Z015-1CLG485 I	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Artix-7 FPGA, 74K Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-LFBGA, CSPBGA Supplier Device Package: 485-CSBGA (19x19) Number of I/O: 130	500 Order	1+: $36.11
122-1905-ND	XC7Z015-1CLG485 C	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Artix-7 FPGA, 74K Logic Cells Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-LFBGA, CSPBGA Supplier Device Package: 485-CSBGA (19x19) Number of I/O: 130	150 Order	1+: $49.25
M2S060TS-1FG484 M-ND	M2S060TS-1FG484 M	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -55C ~ 125C (TJ) Number of I/O: 267	1000 Order	60+: $175.339
M2S060T-1FGG676 -ND	M2S060T-1FGG676	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27) Number of I/O: 387	1000 Order	40+: $78.1767
M2S010S-TQG144- ND	M2S010S-TQG144	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Number of I/O: 84	1000 Order	60+: $20.9765
M2S010S-1TQG144 -ND	M2S010S-1TQG144	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Number of I/O: 84	1000 Order	60+: $23.4965
M2S060T-1FGG484 M-ND	M2S060T-1FGG484 M	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -55C ~ 125C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267	1000 Order	60+: $159.393
M2S010S-1TQG144 I-ND	M2S010S-1TQG144 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Number of I/O: 84	1000 Order	60+: $26.0064
M2S010S-TQ144I- ND	M2S010S-TQ144I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Last Time Buy Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Number of I/O: 84	1000 Order	60+: $23.4965
1100-1296-ND	M2S010S-TQ144	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Last Time Buy Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: Module Supplier Device Package: Module Number of I/O: 84	1000 Order	60+: $20.9765
M2S090-1FG676IX 417-ND	M2S090-1FG676IX 417	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Number of I/O: 425	1000 Order	1+: $0
M2S010S-1TQ144- ND	M2S010S-1TQ144	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Last Time Buy Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Number of I/O: 84	1000 Order	60+: $23.4965
M2S060TS-1FGG48 4M-ND	M2S060TS-1FGG48 4M	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -55C ~ 125C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267	1000 Order	60+: $175.339
M2S010S-TQG144I -ND	M2S010S-TQG144I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Number of I/O: 84	1000 Order	60+: $23.4965
M2S010S-1TQ144I -ND	M2S010S-1TQ144I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Last Time Buy Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Number of I/O: 84	1000 Order	60+: $26.0064
M2S060T-1FG484M -ND	M2S060T-1FG484M	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -55C ~ 125C (TJ) Number of I/O: 267	1000 Order	60+: $159.393
M2S005S-1TQG144 T2-ND	M2S005S-1TQG144 T2	Microsemi Corporation	View more Series: * Packaging: Tray Part Status: Active	1000 Order	60+: $28.5264
122-2169-ND	XAZU3EG-L1SFVC7 84I	Xilinx Inc.	View more Series: * Packaging: Tray Part Status: Active	60 Order	1+: $392.301
XCZU28DR-L2FFVE 1156I-ND	XCZU28DR-L2FFVE 1156I	Xilinx Inc.	View more Series: * Packaging: Tray Part Status: Active	1000 Order	1+: $15.12
XCZU29DR-2FFVF1 760E-ND	XCZU29DR-2FFVF1 760E	Xilinx Inc.	View more Series: * Packaging: Tray Part Status: Active	1000 Order	1+: $12.6
122-2173-ND	XAZU2EG-L1SFVA6 25I	Xilinx Inc.	View more Series: * Packaging: Tray Part Status: Active	60 Order	1+: $244.881
122-2170-ND	XAZU3EG-L1SFVA6 25I	Xilinx Inc.	View more Series: * Packaging: Tray Part Status: Active	60 Order	1+: $381.654
XCZU27DR-2FFVG1 517E-ND	XCZU27DR-2FFVG1 517E	Xilinx Inc.	View more Series: * Packaging: Tray Part Status: Active	1000 Order	--
XAZU3EG-1SFVC78 4Q-ND	XAZU3EG-1SFVC78 4Q	Xilinx Inc.	View more Series: * Packaging: Tray Part Status: Active	1000 Order	1+: $392.301

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