Intel memory chip - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
PA0039-S-ND	PA0039-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: TSSOP Number of Positions: 38 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0074-S-ND	IPC0074-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: DFN Number of Positions: 16 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm) Thermal Center Pad: 0.096" L x 0.171" W (2.45mm x 4.35mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
BGA0012-S-ND	BGA0012-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: BGA Number of Positions: 54 Pitch: 0.047" (1.20mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $14.2758
SMD291AX-ND	SMD291AX	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Sn63Pb37 (63/37) Melting Point: 361F (183C) Flux Type: No-Clean Process: Leaded Form: Syringe, 0.53 oz (15g), 5cc Shelf Life: 12 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37F ~ 46F (3C ~ 8C) Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. Weight: 0.033 lb (14.97g)	1356 Order	1+: $9.4437
PA0030-ND	PA0030	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QSOP Number of Positions: 24 Pitch: 0.025" (0.64mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm)	80 Order	1+: $3.6477
IPC0063-ND	IPC0063	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: DFN Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)	1000 Order	1+: $3.3327
PA0025-ND	PA0025	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SSOP Number of Positions: 48 Pitch: 0.025" (0.64mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)	1000 Order	1+: $5.1597
SMDIN97AG3-ND	SMDIN97AG3	Chip Quik Inc.	View more Series: SMD Part Status: Active Type: Wire Solder Composition: In97Ag3 (97/3) Diameter: 0.031" (0.79mm) Melting Point: 289F (143C) Wire Gauge: 20 AWG, 21 SWG Process: Lead Free Form: Spool Shelf Life: Not Applicable	24 Order	1+: $19.9899 5+: $19.5804 10+: $17.9487 25+: $14.6853 50+: $13.8694 100+: $13.0536 500+: $12.2378
PA0094-S-ND	PA0094-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: TQFP Number of Positions: 48 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	6 Order	1+: $7.56
PA0174-S-ND	PA0174-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: SOT/SC Number of Positions: 3 Pitch: 0.091" (2.30mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.140" L x 0.256" W (3.56mm x 6.50mm) Thermal Center Pad: 0.079" L x 0.130" W (2.00mm x 3.30mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0116-S-ND	PA0116-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: CSP Number of Positions: 24 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.138" L x 0.177" W (3.50mm x 4.50mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0118-S-ND	IPC0118-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 100 Pitch: 0.016" (0.40mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm) Thermal Center Pad: 0.398" L x 0.398" W (10.10mm x 10.10mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0193-ND	PA0193	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: TSSOP Number of Positions: 16 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)	326 Order	1+: $3.3327
PA0091-ND	PA0091	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: LQFP, TQFP Number of Positions: 32 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)	81 Order	1+: $4.6557
PA0050-ND	PA0050	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: MLP, MLF Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)	1000 Order	1+: $2.3247
IPC0016-ND	IPC0016	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 28 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)	1000 Order	1+: $5.9787
IPC0026-ND	IPC0026	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 40 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)	1000 Order	1+: $7.9317
BGA0012-ND	BGA0012	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: BGA Number of Positions: 54 Pitch: 0.047" (1.20mm)	1000 Order	1+: $23.8014
PA0001-S-ND	PA0001-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: SOIC Number of Positions: 8 Pitch: 0.050" (1.27mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	9 Order	1+: $7.3017
DC2917J-10X-ND	DC2917J-10X	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to Plated Through Hole Package Accepted: 2917 Number of Positions: 2 Pitch: 0.244" (6.20mm) Material: FR4 Epoxy Glass Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)	39 Order	1+: $3.4713 5+: $3.3806 10+: $3.2886 25+: $3.1974 50+: $3.0146 100+: $2.9232 250+: $2.7405
IPC0089-ND	IPC0089	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: DFN Number of Positions: 22 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.300" (25.40mm x 33.02mm)	1000 Order	1+: $5.6637
TS391AX-ND	TS391AX	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Sn63Pb37 (63/37) Melting Point: 361F (183C) Flux Type: No-Clean Process: Leaded Form: Syringe, 0.53 oz (15g), 5cc Shelf Life: 12 Months Shelf Life Start: Date of Manufacture	146 Order	1+: $10.0485
SMD1-ND	SMD1	Chip Quik Inc.	View more Part Status: Active Accessory Type: Solder Removal Kit	282 Order	1+: $10.08
SMD4.5NL-ND	SMD4.5NL	Chip Quik Inc.	View more Part Status: Active Accessory Type: Removal Alloy	188 Order	1+: $21.42
PA0053-S-ND	PA0053-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: MLP/MLF Number of Positions: 16 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
SBB400-ND	SBB400	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Lead Free Status / RoHS Status: Lead free / RoHS Compliant Proto Board Type: Breadboard, General Purpose Moisture Sensitivity Level (MSL): 1 (Unlimited) Plating: Plated Through Hole (PTH) Pitch: 0.100" (2.54mm) Circuit Pattern: 5 Hole Pad (Single Side) Hole Diameter: 0.039" (1.00mm) Size / Dimension: 3.60" L x 2.30" W (91.4mm x 58.4mm) Board Thickness: 0.063" (1.60mm) Material: FR4 Epoxy Glass	830 Order	1+: $2.5137
SMDC-20G-ND	SMDC-20G	Chip Quik Inc.	View more Part Status: Active Accessory Type: Dispenser Needle, Tip Tip - Type: Needle Tip Gauge: 20 Number of Pieces: 100	12 Order	1+: $13.8159 5+: $13.4102 10+: $13.0032 25+: $12.1905
IPC0085-S-ND	IPC0085-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: DFN Number of Positions: 8 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm) Thermal Center Pad: 0.022" L x 0.085" W (0.56mm x 2.15mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0077-ND	IPC0077	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: MSOP Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)	308 Order	1+: $3.6477
PA0107SOCKET-ND	PA0107SOCKET	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Number of Positions: 44 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)	53 Order	1+: $12.5937
SMDPMUSB413-ND	SMDPMUSB413	Chip Quik Inc.	View more Part Status: Active Type: Microscope, Digital Magnification Range: 1x ~ 200x Illumination: LED Camera Type: CMOS, 2MP	13 Order	1+: $151.2
PA0033-S-ND	PA0033-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: TSSOP Number of Positions: 14 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0038-S-ND	IPC0038-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 12 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Thermal Center Pad: 0.055" L x 0.055" W (1.40mm x 1.40mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0131-S-ND	IPC0131-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: DFN Number of Positions: 12 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm) Thermal Center Pad: 0.035" L x 0.079" W (0.90mm x 2.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0239-S-ND	PA0239-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: SOIC Number of Positions: 44 Pitch: 0.031" (0.80mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0059-S-ND	PA0059-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 14 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
SMDLTLFP250T4-N D	SMDLTLFP250T4	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Melting Point: 281F (138C) Flux Type: No-Clean Process: Lead Free Form: Jar, 8.8 oz (250g) Shelf Life: 6 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37F ~ 46F (3C ~ 8C) Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.	32 Order	1+: $52.8885
TS391AX250-ND	TS391AX250	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Sn63Pb37 (63/37) Melting Point: 361F (183C) Flux Type: No-Clean Process: Leaded Form: Jar, 8.8 oz (250g) Shelf Life: 12 Months Shelf Life Start: Date of Manufacture	41 Order	1+: $34.6185
SMD3SW.031.7OZ- ND	SMD3SW.031 .7OZ	Chip Quik Inc.	View more Series: SMD3 Part Status: Active Type: Wire Solder Composition: Sn62Pb36Ag2 (62/36/2) Diameter: 0.031" (0.79mm) Melting Point: 354F (179C) Flux Type: No-Clean, Water Soluble Wire Gauge: 20 AWG, 21 SWG Process: Leaded Form: Tube, 0.7 oz (19.85g) Shelf Life: Not Applicable	97 Order	1+: $8.6814 5+: $8.505 10+: $8.1579 25+: $6.9426 50+: $6.2483 100+: $5.9012 500+: $5.207
SMDSW.0201LB-ND	SMDSW.020 1LB	Chip Quik Inc.	View more Part Status: Active Type: Wire Solder Composition: Sn63Pb37 (63/37) Diameter: 0.020" (0.51mm) Melting Point: 361F (183C) Flux Type: No-Clean, Water Soluble Wire Gauge: 24 AWG, 25 SWG Process: Leaded Form: Spool, 1 lb (454 g) Shelf Life: Not Applicable	24 Order	1+: $26.4726 5+: $25.3726 10+: $20.9595 25+: $18.7534 50+: $17.6501 100+: $16.5469

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