Mainboard chip - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
PA0152-ND	PA0152	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: MicroSMD, BGA Number of Positions: 4 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm)	1000 Order	1+: $2.0097
PA0121-ND	PA0121	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to PGA Package Accepted: LQFP, PQFP Number of Positions: 128 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Material: FR4 Epoxy Glass Size / Dimension: 1.800" L x 2.400" W (45.72mm x 60.96mm)	1000 Order	1+: $10.3635
PA0004-S-ND	PA0004-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: SOIC Number of Positions: 14 Pitch: 0.050" (1.27mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0168-S-ND	PA0168-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: Mini SOIC Number of Positions: 8 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0100-S-ND	PA0100-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: LGA Number of Positions: 16 Pitch: 0.039" (1.00mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.173" L x 0.295" W (4.40mm x 7.50mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
SMDSWLTLFP32-ND	SMDSWLTLFP32	Chip Quik Inc.	View more Part Status: Active Type: Wire Solder Composition: Bi57Sn42Ag1 (57/42/1) Diameter: 0.030" (0.76mm) Melting Point: 281F (138C) Wire Gauge: 21 AWG, 22 SWG Process: Lead Free Shelf Life: Not Applicable	165 Order	1+: $24.1353
SMD8-ND	SMD8	Chip Quik Inc.	View more Series: CHIPQUIK Part Status: Active Accessory Type: Removal Alloy	13 Order	1+: $37.17
SMDLTLFP10T4-ND	SMDLTLFP10T4	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Melting Point: 281F (138C) Flux Type: No-Clean Process: Lead Free Form: Syringe, 1.23 oz (35g), 10cc Shelf Life: 6 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37F ~ 46F (3C ~ 8C) Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.	42 Order	1+: $16.9785
IPC0020-S-ND	IPC0020-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 32 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm) Thermal Center Pad: 0.122" L x 0.122" W (3.10mm x 3.10mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.56
IPC0061-S-ND	IPC0061-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: DFN Number of Positions: 8 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm) Thermal Center Pad: 0.031" L x 0.057" W (0.80mm x 1.45mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0015-S-ND	IPC0015-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 24 Pitch: 0.031" (0.80mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm) Thermal Center Pad: 0.150" L x 0.150" W (3.80mm x 3.80mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
HDR200MET20F-G- V-SM-DR-ND	HDR200MET20F-G- V-SM-DR	Chip Quik Inc.	View more Series: Proto-Advantage Packaging: Bulk Part Status: Active Connector Type: Header Contact Type: Female Socket Style: Board to Board Number of Positions: 20 Number of Positions Loaded: All Pitch - Mating: 0.079" (2.00mm) Number of Rows: 2 Row Spacing - Mating: 0.079" (2.00mm) Mounting Type: Surface Mount Termination: Solder Fastening Type: Push-Pull Contact Finish - Mating: Gold Insulation Height: 0.181" (4.60mm) Contact Shape: Square	1000 Order	1+: $1.1277
PCB3007-1-ND	PCB3007-1	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SOT-23 Number of Positions: 6 Pitch: 0.037" (0.95mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.400" x 0.300" (10.16mm x 7.62mm)	720 Order	1+: $1.3167
CN0002-ND	CN0002	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: Connector to DIP Package Accepted: HDMI Number of Positions: 19 Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)	100 Order	1+: $6.6087
IPC0068-ND	IPC0068	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: DFN Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)	1000 Order	1+: $3.6477
PA0102-ND	PA0102	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: LGA Number of Positions: 16 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)	1000 Order	1+: $3.9627
IPC0176-ND	IPC0176	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: DFN Number of Positions: 12 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Material: FR4 Epoxy Glass Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)	1000 Order	1+: $4.5108
IPC0109-ND	IPC0109	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: LGA Number of Positions: 28 Pitch: 0.024" (0.60mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)	1000 Order	1+: $7.3017
PA0068-S-ND	PA0068-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 32 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
FPC050P050-S-ND	FPC050P050-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: FPC/FFC Number of Positions: 50 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Thermal Center Pad: 0.157" L x 1.291" W (4.00mm x 32.80mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0103-S-ND	IPC0103-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: LGA Number of Positions: 10 Pitch: 0.050" (1.27mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.197" W (3.00mm x 5.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
SMD2SW.020.4OZ- ND	SMD2SW.020 .4OZ	Chip Quik Inc.	View more Series: SMD2 Part Status: Active Type: Wire Solder Composition: Sn60Pb40 (60/40) Diameter: 0.020" (0.51mm) Melting Point: 361 ~ 370F (183 ~ 188C) Flux Type: No-Clean, Water Soluble Wire Gauge: 24 AWG, 25 SWG Process: Leaded Form: Tube, 0.4 oz (11.34g) Shelf Life: Not Applicable	95 Order	1+: $6.1362 5+: $6.0165 10+: $5.7758 25+: $5.0539 50+: $4.5725 100+: $4.3319 500+: $3.8506 1000+: $3.6099
PA0086-ND	PA0086	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SOT-23, SC-59, SC-74A Number of Positions: 5 Pitch: 0.037" (0.95mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)	777 Order	1+: $1.6947
FPC100P020-ND	FPC100P020	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: FPC Connector Number of Positions: 20 Pitch: 0.039" (1.00mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.900" x 1.250" (22.86mm x 31.75mm)	202 Order	1+: $3.0177
PA0107-ND	PA0107	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Number of Positions: 44 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)	91 Order	1+: $9.2547
PA0189-ND	PA0189	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to PGA Package Accepted: LQFP Number of Positions: 176 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 2.700" x 2.700" (68.58mm x 68.58mm)	38 Order	1+: $10.2627
IPC0064-ND	IPC0064	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: DFN Number of Positions: 8 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)	1000 Order	1+: $3.3327
IPC0069-ND	IPC0069	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: DFN Number of Positions: 10 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)	1000 Order	1+: $3.6477
PA0014-ND	PA0014	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SOIC Number of Positions: 54 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 2.700" (25.40mm x 68.58mm)	1000 Order	1+: $4.7817
PA0051-ND	PA0051	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: MLP, MLF Number of Positions: 11 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)	1000 Order	1+: $2.6397
FPC040P050-ND	FPC040P050	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: FPC Connector Number of Positions: 50 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.900" x 2.550" (22.86mm x 64.77mm)	1000 Order	1+: $4.9707
PA0219-S-ND	PA0219-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: PLCC/JLCC Number of Positions: 52 Pitch: 0.050" (1.27mm) Outer Dimension: 1.350" L x 1.950" W (34.29mm x 49.53mm) Inner Dimension: 0.748" L x 0.748" W (19.00mm x 19.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0117-S-ND	PA0117-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: CSP Number of Positions: 28 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.177" L x 0.217" W (4.50mm x 5.50mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0050-S-ND	PA0050-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: MLP/MLF Number of Positions: 8 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Thermal Center Pad: 0.039" L x 0.197" W (1.00mm x 5.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0172-S-ND	PA0172-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: POS Number of Positions: 8 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.098" W (3.00mm x 2.50mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
BGA0010-S-ND	BGA0010-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: BGA Number of Positions: 42 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1 Order	1+: $13.2237
SMDSW.0201OZ-ND	SMDSW.020 1OZ	Chip Quik Inc.	View more Part Status: Active Type: Wire Solder Composition: Sn63Pb37 (63/37) Diameter: 0.020" (0.51mm) Melting Point: 361F (183C) Flux Type: No-Clean, Water Soluble Wire Gauge: 24 AWG, 25 SWG Process: Leaded Form: Spool, 1 oz (28.35g) Shelf Life: Not Applicable Weight: 0.062 lb (28.12g)	56 Order	1+: $3.1689
IPC0061-ND	IPC0061	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: DFN Number of Positions: 8 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)	112 Order	1+: $3.3327
DC0402S-10X-ND	DC0402S-10X	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: 0402 Number of Positions: 2 Board Thickness: 0.031" (0.79mm) 1/32" Material: FR4 Epoxy Glass Size / Dimension: 0.400" x 0.300" (10.16mm x 7.62mm)	43 Order	1+: $3.087
IPC0163-ND	IPC0163	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SOIC Number of Positions: 32 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Material: FR4 Epoxy Glass Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)	1000 Order	1+: $5.3046

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