Mainboard chip - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
PCB3005A1-ND	PCB3005A1	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SOIC Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.400" x 0.400" (10.16mm x 10.16mm)	891 Order	1+: $1.3167
PA0004-ND	PA0004	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SOIC Number of Positions: 14 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)	183 Order	1+: $2.1987
F127T254P16-ND	F127T254P16	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: Plated Through Hole to Plated Through Hole Number of Positions: 16 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Material: FR4 Epoxy Glass	82 Order	1+: $1.8837
PA0035-S-ND	PA0035-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: TSSOP Number of Positions: 20 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0135-S-ND	PA0135-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: LLP Number of Positions: 10 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Thermal Center Pad: 0.063" L x 0.236" W (1.60mm x 6.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
MLU-8066-2BHC-N D	MLU-8066-2BHC	Chip Quik Inc.	View more Part Status: Active Lamp/Magnifier Type: Lamp, Magnifier Voltage: 120V Lens Style/Size: 3 Diopter (1.75x), 5.00" (127.00mm) Diameter Bulb: Fluorescent, 22W Color: White Mounting Type: Base, Weighted	18 Order	1+: $75.5685
PA0109-S-ND	PA0109-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: TQFP Number of Positions: 100 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	9 Order	1+: $7.3017
FPC080P010-S-ND	FPC080P010-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: FPC/FFC Number of Positions: 10 Pitch: 0.031" (0.80mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Thermal Center Pad: 0.157" L x 0.618" W (4.00mm x 15.70mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0175-S-ND	IPC0175-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 20 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.157" L x 0.138" W (4.00mm x 3.50mm) Thermal Center Pad: 0.081" L x 0.100" W (2.05mm x 2.55mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $8.1459
SMDSW.0204OZ-ND	SMDSW.020 4OZ	Chip Quik Inc.	View more Part Status: Active Type: Wire Solder Composition: Sn63Pb37 (63/37) Diameter: 0.020" (0.51mm) Melting Point: 361F (183C) Flux Type: No-Clean, Water Soluble Wire Gauge: 24 AWG, 25 SWG Process: Leaded Form: Spool, 4 oz (113.40g) Shelf Life: Not Applicable Weight: 0.25 lb (113.4g)	108 Order	1+: $7.0623
PA0002-ND	PA0002	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SOIC Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)	280 Order	1+: $2.1987
CN0023-ND	CN0023	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: Connector to SIP Package Accepted: microSD Card Number of Positions: 10 Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)	51 Order	1+: $6.6087
PA0081-ND	PA0081	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: TVSOP Number of Positions: 56 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)	1000 Order	1+: $6.6087
PA0196-ND	PA0196	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: TSSOP Number of Positions: 64 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm)	1000 Order	1+: $6.9867
PA0062-S-ND	PA0062-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 16 Pitch: 0.031" (0.80mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0235-S-ND	PA0235-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: LQFP Number of Positions: 40 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0134-S-ND	IPC0134-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: TQFP Number of Positions: 44 Pitch: 0.031" (0.80mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
SMD2SW.015100G- ND	SMD2SW.015 100G	Chip Quik Inc.	View more Series: SMD2 Part Status: Active Type: Wire Solder Composition: Sn60Pb40 (60/40) Diameter: 0.015" (0.38mm) Melting Point: 361 ~ 370F (183 ~ 188C) Flux Type: No-Clean, Water Soluble Wire Gauge: 27 AWG, 28 SWG Process: Leaded Form: Spool, 3.53 oz (100g) Shelf Life: Not Applicable	86 Order	1+: $15.5295 5+: $15.2107 10+: $13.9432 25+: $11.408 50+: $10.7743 100+: $10.1405 500+: $9.5067
SMDLTLFP500T5C- ND	SMDLTLFP500T5C	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Melting Point: 281F (138C) Flux Type: No-Clean Process: Lead Free Form: Cartridge, 17.64 oz (500g) Shelf Life: 6 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37F ~ 46F (3C ~ 8C) Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.	1000 Order	1+: $132.3
PA0172-ND	PA0172	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: POS Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)	1000 Order	1+: $2.0097
PA0087-ND	PA0087	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SC-70, SC-88, SOT-363 Number of Positions: 6 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)	907 Order	1+: $1.6947
DC2924J-10X-ND	DC2924J-10X	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to Plated Through Hole Package Accepted: 2924 Number of Positions: 2 Pitch: 0.245" (6.22mm) Material: FR4 Epoxy Glass Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)	96 Order	1+: $3.4713 5+: $3.3806 10+: $3.2886 25+: $3.1974 50+: $3.0146 100+: $2.9232 250+: $2.7405
IPC0066-ND	IPC0066	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: DFN Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)	1000 Order	1+: $3.6477
PA0037-S-ND	PA0037-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: TSSOP Number of Positions: 28 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0066-S-ND	PA0066-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 28 Pitch: 0.031" (0.80mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
FPC040P050-S-ND	FPC040P050-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: FPC/FFC Number of Positions: 50 Pitch: 0.016" (0.40mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Thermal Center Pad: 0.157" L x 1.016" W (4.00mm x 25.80mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0002-S-ND	IPC0002-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 8 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Thermal Center Pad: 0.043" L x 0.043" W (1.10mm x 1.10mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0212-S-ND	PA0212-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: TSOP Number of Positions: 66 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
TS391AX50-ND	TS391AX50	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Sn63Pb37 (63/37) Melting Point: 361F (183C) Flux Type: No-Clean Process: Leaded Form: Jar, 1.76 oz (50g) Shelf Life: 12 Months Shelf Life Start: Date of Manufacture	92 Order	1+: $8.7885
SMDLTLFPT4-ND	SMDLTLFPT4	Chip Quik Inc.	View more Series: SMD Part Status: Active Type: Solder Paste Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Melting Point: 281F (138C) Flux Type: No-Clean Process: Lead Free Form: Syringe, 0.53 oz (15g), 5cc Shelf Life: 6 Months Shelf Life Start: Date of Manufacture	34 Order	1+: $18.9063 5+: $18.522 10+: $16.9785 25+: $13.8915 50+: $13.1198 100+: $12.348 500+: $11.5763
IPC0012-ND	IPC0012	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 20 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)	69 Order	1+: $5.2857
CN0073-ND	CN0073	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: Connector to DIP Package Accepted: USB - C Number of Positions: 24 Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm)	84 Order	1+: $13.5954 5+: $13.2187 10+: $12.4639 25+: $12.0859 50+: $11.3306
IPC0035-ND	IPC0035	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 10 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)	1000 Order	1+: $3.6477
IPC0140-ND	IPC0140	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SSOP Number of Positions: 36 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)	1000 Order	1+: $4.5297
IPC0046-ND	IPC0046	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 68 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 3.600" (25.40mm x 91.44mm)	1000 Order	1+: $10.5777
PA0020-S-ND	PA0020-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: SSOP Number of Positions: 28 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	6 Order	1+: $7.56
BGA0004-S-ND	BGA0004-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: BGA Number of Positions: 100 Pitch: 0.039" (1.00mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	3 Order	1+: $13.2237
FPC030P045-S-ND	FPC030P045-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: FPC/FFC Number of Positions: 45 Pitch: 0.012" (0.30mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0034-S-ND	IPC0034-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 72 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm) Thermal Center Pad: 0.185" L x 0.185" W (4.70mm x 4.70mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
HDR-ETD-ND	HDR-ETD	Chip Quik Inc.	View more Series: Proto-Advantage Packaging: Bulk Part Status: Active Connector Type: Header Contact Type: Male Pin Pitch - Mating: 0.100" (2.54mm) Number of Positions: 40, 40 Number of Rows: 1 Number of Positions Loaded: All Style: Board to Board Shrouding: Unshrouded Mounting Type: Through Hole, Right Angle Termination: Wire Wrap Fastening Type: Push-Pull Contact Length - Mating: 0.118" (3.00mm) Insulation Height: 0.100" (2.54mm) Contact Shape: Square Contact Finish - Mating: Gold Contact Finish - Post: Gold	361 Order	1+: $1.0017

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