N male connector - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
XR2C-1611-N-ND	XR2C-1611-N	Omron Electronics Inc-EMC Div	View more Series: XR2 Packaging: Bulk Part Status: Active Type: SIP Number of Positions or Pins (Grid): 16 (1 x 16) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0in (0.25m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0in (0.25m) Contact Material - Post: Beryllium Copper Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Operating Temperature: -55C ~ 125C Termination Post Length: 0.126" (3.20mm) Material Flammability Rating: UL94 V-0 Current Rating: 1A Contact Resistance: 20 mOhm	1000 Order	200+: $1.0625
XR2A-2811-N-ND	XR2A-2811-N	Omron Electronics Inc-EMC Div	View more Series: XR2 Packaging: Bulk Part Status: Active Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0in (0.25m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0in (0.25m) Contact Material - Post: Beryllium Copper Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Operating Temperature: -55C ~ 125C Termination Post Length: 0.126" (3.20mm) Material Flammability Rating: UL94 V-0 Current Rating: 1A Contact Resistance: 20 mOhm	1000 Order	17+: $2.2602
XR2A-0811-N-ND	XR2A-0811-N	Omron Electronics Inc-EMC Div	View more Series: XR2 Packaging: Bulk Part Status: Active Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0in (0.25m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0in (0.25m) Contact Material - Post: Beryllium Copper Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Operating Temperature: -55C ~ 125C Termination Post Length: 0.126" (3.20mm) Material Flammability Rating: UL94 V-0 Current Rating: 1A Contact Resistance: 20 mOhm	1000 Order	60+: $0.4811
XR2A-3201-N-ND	XR2A-3201-N	Omron Electronics Inc-EMC Div	View more Series: XR2 Packaging: Bulk Part Status: Active Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0in (0.76m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0in (0.76m) Contact Material - Post: Beryllium Copper Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Operating Temperature: -55C ~ 125C Termination Post Length: 0.126" (3.20mm) Material Flammability Rating: UL94 V-0 Current Rating: 1A Contact Resistance: 20 mOhm	1000 Order	15+: $3.1714
XR2A-3211-N-ND	XR2A-3211-N	Omron Electronics Inc-EMC Div	View more Series: XR2 Packaging: Bulk Part Status: Active Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0in (0.25m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0in (0.25m) Contact Material - Post: Beryllium Copper Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Operating Temperature: -55C ~ 125C Termination Post Length: 0.126" (3.20mm) Material Flammability Rating: UL94 V-0 Current Rating: 1A Contact Resistance: 20 mOhm	1000 Order	15+: $2.6867
XR2T-2021-N-ND	XR2T-2021-N	Omron Electronics Inc-EMC Div	View more Series: XR2 Packaging: Bulk Part Status: Active Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame, Seal Tape Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Beryllium Copper Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Operating Temperature: -55C ~ 125C Termination Post Length: 0.138" (3.50mm) Material Flammability Rating: UL94 V-0 Current Rating: 1A Contact Resistance: 20 mOhm	1000 Order	24+: $2.9348
XR2A-4001-N-ND	XR2A-4001-N	Omron Electronics Inc-EMC Div	View more Series: XR2 Packaging: Bulk Part Status: Active Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0in (0.76m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0in (0.76m) Contact Material - Post: Beryllium Copper Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Operating Temperature: -55C ~ 125C Termination Post Length: 0.126" (3.20mm) Material Flammability Rating: UL94 V-0 Current Rating: 1A Contact Resistance: 20 mOhm	1000 Order	12+: $3.6251
XR2D-4001-N-ND	XR2D-4001-N	Omron Electronics Inc-EMC Div	View more Series: XR2 Packaging: Bulk Part Status: Obsolete Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5in (0.75m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Carrier Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 29.5in (0.75m) Contact Material - Post: Beryllium Copper Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Operating Temperature: -55C ~ 125C Material Flammability Rating: UL94 V-0 Current Rating: 1A Contact Resistance: 20 mOhm	1000 Order	1+: $0
XR2D-2401-N-ND	XR2D-2401-N	Omron Electronics Inc-EMC Div	View more Series: XR2 Packaging: Bulk Part Status: Obsolete Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5in (0.75m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Carrier Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 29.5in (0.75m) Contact Material - Post: Beryllium Copper Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Operating Temperature: -55C ~ 125C Material Flammability Rating: UL94 V-0 Current Rating: 1A Contact Resistance: 20 mOhm	1000 Order	1+: $0
XR2A-1801-N-ND	XR2A-1801-N	Omron Electronics Inc-EMC Div	View more Series: XR2 Packaging: Bulk Part Status: Active Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 18 (2 x 9) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0in (0.76m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0in (0.76m) Contact Material - Post: Beryllium Copper Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Operating Temperature: -55C ~ 125C Termination Post Length: 0.126" (3.20mm) Material Flammability Rating: UL94 V-0 Current Rating: 1A Contact Resistance: 20 mOhm	1000 Order	26+: $1.3601
XR2C-2011-N-ND	XR2C-2011-N	Omron Electronics Inc-EMC Div	View more Series: XR2 Packaging: Bulk Part Status: Active Type: SIP Number of Positions or Pins (Grid): 20 (1 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0in (0.25m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0in (0.25m) Contact Material - Post: Beryllium Copper Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Operating Temperature: -55C ~ 125C Termination Post Length: 0.126" (3.20mm) Material Flammability Rating: UL94 V-0 Current Rating: 1A Contact Resistance: 20 mOhm	1000 Order	100+: $1.2243
XR2A-1411-N-ND	XR2A-1411-N	Omron Electronics Inc-EMC Div	View more Series: XR2 Packaging: Bulk Part Status: Active Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0in (0.25m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0in (0.25m) Contact Material - Post: Beryllium Copper Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Operating Temperature: -55C ~ 125C Termination Post Length: 0.126" (3.20mm) Material Flammability Rating: UL94 V-0 Current Rating: 1A Contact Resistance: 20 mOhm	1000 Order	34+: $1.1194
XR2H-1611-N-ND	XR2H-1611-N	Omron Electronics Inc-EMC Div	View more Series: XR2 Packaging: Bulk Part Status: Active Type: Zig-Zag Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0in (0.25m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0in (0.25m) Contact Material - Post: Beryllium Copper Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Operating Temperature: -55C ~ 125C Termination Post Length: 0.138" (3.50mm) Material Flammability Rating: UL94 V-0 Current Rating: 1A Contact Resistance: 20 mOhm	1000 Order	30+: $1.4459
XR2A-4011-N-ND	XR2A-4011-N	Omron Electronics Inc-EMC Div	View more Series: XR2 Packaging: Bulk Part Status: Active Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0in (0.25m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0in (0.25m) Contact Material - Post: Beryllium Copper Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Operating Temperature: -55C ~ 125C Termination Post Length: 0.126" (3.20mm) Material Flammability Rating: UL94 V-0 Current Rating: 1A Contact Resistance: 20 mOhm	1000 Order	12+: $3.3595
XR2T-1621-N-ND	XR2T-1621-N	Omron Electronics Inc-EMC Div	View more Series: XR2 Packaging: Bulk Part Status: Active Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame, Seal Tape Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Beryllium Copper Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Operating Temperature: -55C ~ 125C Termination Post Length: 0.138" (3.50mm) Material Flammability Rating: UL94 V-0 Current Rating: 1A Contact Resistance: 20 mOhm	1000 Order	30+: $1.8833
XR2E-3201-N-ND	XR2E-3201-N	Omron Electronics Inc-EMC Div	View more Series: XR2 Packaging: Bulk Part Status: Obsolete Type: SIP Number of Positions or Pins (Grid): 32 (1 x 32) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5in (0.75m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Carrier Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 29.5in (0.75m) Contact Material - Post: Beryllium Copper Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Operating Temperature: -55C ~ 125C Material Flammability Rating: UL94 V-0 Current Rating: 1A Contact Resistance: 20 mOhm	1000 Order	1+: $0
XR2C-1501-N-ND	XR2C-1501-N	Omron Electronics Inc-EMC Div	View more Series: XR2 Packaging: Bulk Part Status: Active Type: SIP Number of Positions or Pins (Grid): 15 (1 x 15) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0in (0.25m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0in (0.25m) Contact Material - Post: Beryllium Copper Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Operating Temperature: -55C ~ 125C Termination Post Length: 0.126" (3.20mm) Material Flammability Rating: UL94 V-0 Current Rating: 1A Contact Resistance: 20 mOhm	1000 Order	200+: $1.255
XR2A-2001-N-ND	XR2A-2001-N	Omron Electronics Inc-EMC Div	View more Series: XR2 Packaging: Bulk Part Status: Active Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0in (0.76m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0in (0.76m) Contact Material - Post: Beryllium Copper Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Operating Temperature: -55C ~ 125C Termination Post Length: 0.126" (3.20mm) Material Flammability Rating: UL94 V-0 Current Rating: 1A Contact Resistance: 20 mOhm	1000 Order	24+: $2.5691
XR2A-2801-N-ND	XR2A-2801-N	Omron Electronics Inc-EMC Div	View more Series: XR2 Packaging: Bulk Part Status: Active Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0in (0.76m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0in (0.76m) Contact Material - Post: Beryllium Copper Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Operating Temperature: -55C ~ 125C Termination Post Length: 0.126" (3.20mm) Material Flammability Rating: UL94 V-0 Current Rating: 1A Contact Resistance: 20 mOhm	1000 Order	17+: $2.7405
XR2A-2401-N-ND	XR2A-2401-N	Omron Electronics Inc-EMC Div	View more Series: XR2 Packaging: Bulk Part Status: Active Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0in (0.76m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0in (0.76m) Contact Material - Post: Beryllium Copper Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Operating Temperature: -55C ~ 125C Termination Post Length: 0.126" (3.20mm) Material Flammability Rating: UL94 V-0 Current Rating: 1A Contact Resistance: 20 mOhm	1000 Order	20+: $2.3833
XR2C-1511-N-ND	XR2C-1511-N	Omron Electronics Inc-EMC Div	View more Series: XR2 Packaging: Bulk Part Status: Active Type: SIP Number of Positions or Pins (Grid): 15 (1 x 15) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0in (0.25m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0in (0.25m) Contact Material - Post: Beryllium Copper Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Operating Temperature: -55C ~ 125C Termination Post Length: 0.126" (3.20mm) Material Flammability Rating: UL94 V-0 Current Rating: 1A Contact Resistance: 20 mOhm	1000 Order	100+: $1.23
APA-648-T-N-ND	APA-648-T-N	Samtec Inc.	View more Series: * Part Status: Active	1000 Order	1+: $5.3172
APA-322-G-N-ND	APA-322-G-N	Samtec Inc.	View more Series: * Part Status: Active	1000 Order	1+: $5.9535
PLCC-028-T-N-ND	PLCC-028-T-N	Samtec Inc.	View more Series: PLCC Packaging: Tube Part Status: Obsolete Type: PLCC Number of Positions or Pins (Grid): 28 (4 x 7) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Beryllium Copper Housing Material: Liquid Crystal Polymer (LCP) Operating Temperature: -55C ~ 125C Contact Resistance: 10 mOhm	1000 Order	1+: $0
APA-318-T-N-ND	APA-318-T-N	Samtec Inc.	View more Series: * Part Status: Active	1000 Order	1+: $2.1735
APA-632-T-N-ND	APA-632-T-N	Samtec Inc.	View more Series: * Part Status: Active	1000 Order	1+: $3.8619
APA-324-G-N-ND	APA-324-G-N	Samtec Inc.	View more Series: * Part Status: Active	1000 Order	1+: $6.489
APA-314-G-N-ND	APA-314-G-N	Samtec Inc.	View more Series: * Part Status: Active	1000 Order	1+: $3.9627
APA-320-T-N-ND	APA-320-T-N	Samtec Inc.	View more Series: * Part Status: Active	1000 Order	1+: $2.4129
APA-308-T-N-ND	APA-308-T-N	Samtec Inc.	View more Series: * Part Status: Active	1000 Order	1+: $1.0395
APA-640-T-N-ND	APA-640-T-N	Samtec Inc.	View more Series: * Part Status: Active	1000 Order	1+: $4.6242
APA-624-T-N-ND	APA-624-T-N	Samtec Inc.	View more Series: * Part Status: Active	1000 Order	1+: $2.898
PLCC-084-T-N-ND	PLCC-084-T-N	Samtec Inc.	View more Series: PLCC Packaging: Tube Part Status: Active Type: PLCC Number of Positions or Pins (Grid): 84 (4 x 21) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Beryllium Copper Housing Material: Liquid Crystal Polymer (LCP) Operating Temperature: -55C ~ 125C Contact Resistance: 10 mOhm	1000 Order	1+: $3.087
APA-318-G-N-ND	APA-318-G-N	Samtec Inc.	View more Series: * Part Status: Active	1000 Order	1+: $5.0778
APA-624-G-N-ND	APA-624-G-N	Samtec Inc.	View more Series: * Part Status: Active	1000 Order	1+: $6.489
APA-320-G-N-ND	APA-320-G-N	Samtec Inc.	View more Series: * Part Status: Active	1000 Order	1+: $5.418
APA-308-G-N-ND	APA-308-G-N	Samtec Inc.	View more Series: * Part Status: Active	1000 Order	1+: $2.3625
APA-314-T-N-ND	APA-314-T-N	Samtec Inc.	View more Series: * Part Status: Active	1000 Order	1+: $1.6884
PLCC-052-T-N-ND	PLCC-052-T-N	Samtec Inc.	View more Series: PLCC Packaging: Tube Part Status: Active Type: PLCC Number of Positions or Pins (Grid): 52 (4 x 13) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Beryllium Copper Housing Material: Liquid Crystal Polymer (LCP) Operating Temperature: -55C ~ 125C Contact Resistance: 10 mOhm	1000 Order	1+: $2.5074
APA-322-T-N-ND	APA-322-T-N	Samtec Inc.	View more Series: * Part Status: Active	1000 Order	1+: $2.646

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