Nxp buffer amplifier - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
KMPC860DTZQ80D4 -ND	KMPC860DTZQ80D4	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 80MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (2), 10/100 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 95C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MPC860	1000 Order	1+: $0
KMPC880VR133-ND	KMPC880VR133	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (2), 10/100 Mbps (2) USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 95C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MPC880	1000 Order	1+: $0
MC68302CRC16C-N D	MC68302CRC16C	NXP USA Inc	View more Series: M683xx Packaging: Tray Part Status: Obsolete Core Processor: M68000 Number of Cores/Bus Width: 1 Core, 8/16-Bit Speed: 16MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Voltage - I/O: 5.0V Operating Temperature: -40C ~ 85C (TA) Package / Case: 132-BPGA Exposed Pad Supplier Device Package: 132-PGA (34.5x34.5) Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI Base Part Number: MC68302	1000 Order	1+: $0
MPC5200CBV266-N D	MPC5200CBV266	NXP USA Inc	View more Series: MPC52xx Packaging: Tray Part Status: Obsolete Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz RAM Controllers: DDR, SDRAM Graphics Acceleration: No Ethernet: 10/100 Mbps (1) USB: USB 1.1 (2) Voltage - I/O: 2.5V, 3.3V Operating Temperature: -40C ~ 85C (TA) Package / Case: 272-BBGA Supplier Device Package: 272-PBGA (27x27) Additional Interfaces: AC97, CAN, J1850, IC, IS, IrDA, PCI, PSC, SPI, UART Base Part Number: PC5200	1000 Order	--
568-14512-ND	MCF51QM128VLH	NXP USA Inc	View more Series: MCF51Qx Packaging: Tray Part Status: Active Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: EBI/EMI, IC, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 48 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 2x16b, 18x16b, D/A 1x12b Oscillator Type: External Operating Temperature: -40C ~ 105C (TA) Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10) Base Part Number: MCF51QM128	160 Order	--
MPC8541EPXAKE-N D	MPC8541EPXAKE	NXP USA Inc	View more Series: MPC85xx Packaging: Tray Part Status: Obsolete Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR, SDRAM Graphics Acceleration: No Ethernet: 10/100/1000 Mbps (2) Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0C ~ 105C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29) Additional Interfaces: DUART, IC, PCI Base Part Number: MPC8541	1000 Order	1+: $0
MPC862TZQ66B-ND	MPC862TZQ66B	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (4), 10/100 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 105C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MPC862	1000 Order	1+: $0
MPC8533VTALF-ND	MPC8533VTALF	NXP USA Inc	View more Series: MPC85xx Packaging: Tray Part Status: Obsolete Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000 Mbps (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0C ~ 90C (TA) Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29) Additional Interfaces: DUART, HSSI, IC, PCI Base Part Number: MPC8533	1000 Order	1+: $0
MC8640DTHX1000N C-ND	MC8640DTHX1000N C	NXP USA Inc	View more Series: MPC86xx Packaging: Bulk Part Status: Obsolete Core Processor: PowerPC e600 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000 Mbps (4) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40C ~ 105C (TA) Package / Case: 1023-BCBGA, FCCBGA Supplier Device Package: 1023-FCCBGA (33x33) Additional Interfaces: DUART, HSSI, IC, RapidIO Base Part Number: MC8640	1000 Order	1+: $0
MPC8544VTANG-ND	MPC8544VTANG	NXP USA Inc	View more Series: MPC85xx Packaging: Tray Part Status: Obsolete Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Ethernet: 10/100/1000 Mbps (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0C ~ 105C (TA) Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29) Additional Interfaces: DUART, IC, PCI Base Part Number: MPC8544	1000 Order	1+: $0
P1013PSE2HFA-ND	P1013PSE2HFA	NXP USA Inc	View more Series: QorIQ P1 Packaging: Tray Part Status: Obsolete Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.067GHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Operating Temperature: 0C ~ 105C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31) Additional Interfaces: DUART, IC, IS, MMC/SD, SPI Base Part Number: P1013	1000 Order	1+: $0
MKE02Z32VLD2-ND	MKE02Z32VLD2	NXP USA Inc	View more Series: Kinetis KE02 Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M0+ Core Size: 32-Bit Speed: 20MHz Connectivity: IC, SPI, UART/USART Peripherals: LVD, PWM, WDT Number of I/O: 37 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 2x6b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	125 Order	1+: $1.7892 10+: $1.6046 100+: $1.3145
MC9S12DG128VFUE -ND	MC9S12DG128VFUE	NXP USA Inc	View more Series: HCS12 Packaging: Tray Part Status: Active Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IC, SCI, SPI Peripherals: PWM, WDT Number of I/O: 59 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14) Base Part Number: MC9S12DG128	34 Order	--
SAF7754EL/N208Y -ND	SAF7754EL/N208Y	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	1000+: $9.3217
SAF7730HV/N336, 557-ND	SAF7730HV/N336, 557	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Mounting Type: Surface Mount Package / Case: 144-LQFP Exposed Pad Supplier Device Package: 144-HLQFP (20x20) Base Part Number: SAF7730	1000 Order	1+: $0
MK10DN512ZVLQ10 -ND	MK10DN512ZVLQ10	NXP USA Inc	View more Series: Kinetis K10 Packaging: Tray Part Status: Not For New Designs Core Processor: ARM Cortex-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, SD, SPI, UART/USART Peripherals: DMA, IS, LVD, POR, PWM, WDT Number of I/O: 104 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 46x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20) Base Part Number: MK10DN512	3574 Order	--
MC33186VW2R2-ND	MC33186VW2R2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Output Configuration: Half Bridge (2) Applications: DC Motors, General Purpose, Solenoids Interface: Logic Load Type: Inductive Technology: Bi-CMOS Rds On (Typ): 150 mOhm Current - Output / Channel: 5A Voltage - Supply: 5 V ~ 28 V Voltage - Load: 5 V ~ 28 V Operating Temperature: -40C ~ 150C (TJ) Features: Status Flag Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO Mounting Type: Surface Mount Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Supplier Device Package: 20-HSOP Base Part Number: MC33186	1000 Order	1+: $0
568-5121-2-ND	NVT2002DP,118	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Translator Type: Voltage Level Channel Type: Bidirectional Number of Circuits: 1 Channels per Circuit: 2 Voltage - VCCA: 1V ~ 3.6V Voltage - VCCB: 1.8V ~ 5.5V Output Type: Open Drain, Push-Pull Operating Temperature: -40C ~ 85C (TA) Features: Auto-Direction Sensing Mounting Type: Surface Mount Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Supplier Device Package: 8-TSSOP Base Part Number: NVT2002	20000 Order	2500+: $0.1753 5000+: $0.1632 12500+: $0.1608
568-10216-2-ND	NTSX2102GU8H	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Translator Type: Voltage Level Channel Type: Bidirectional Number of Circuits: 1 Channels per Circuit: 2 Voltage - VCCA: 1.65V ~ 5.5V Voltage - VCCB: 1.65V ~ 5.5V Output Type: Open Drain, Tri-State Data Rate: 50Mbps Operating Temperature: -40C ~ 85C (TA) Features: Auto-Direction Sensing Mounting Type: Surface Mount Package / Case: 8-XFQFN Supplier Device Package: 8-XQFN (1.4x1.2) Base Part Number: NTSX2102	8000 Order	4000+: $0.1661 8000+: $0.1546 12000+: $0.1523
568-12374-2-ND	NTB0102DP-Q100H	NXP USA Inc	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Active Translator Type: Voltage Level Channel Type: Bidirectional Number of Circuits: 1 Channels per Circuit: 2 Voltage - VCCA: 1.2V ~ 3.6V Voltage - VCCB: 1.65V ~ 5.5V Output Type: Tri-State, Non-Inverted Data Rate: 100Mbps Operating Temperature: -40C ~ 125C (TA) Features: Auto-Direction Sensing Mounting Type: Surface Mount Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Supplier Device Package: 8-TSSOP Base Part Number: NTB0102	6000 Order	3000+: $0.2405 6000+: $0.2285
568-8405-2-ND	NTS0101GF,132	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Translator Type: Voltage Level Channel Type: Bidirectional Number of Circuits: 1 Channels per Circuit: 1 Voltage - VCCA: 1.65V ~ 3.6V Voltage - VCCB: 2.3V ~ 5.5V Output Type: Open Drain, Tri-State Data Rate: 50Mbps Operating Temperature: -40C ~ 125C (TA) Features: Auto-Direction Sensing Mounting Type: Surface Mount Package / Case: 6-XFDFN Supplier Device Package: 6-XSON, SOT891 (1x1) Base Part Number: NTS0101	1000 Order	1+: $0
568-5877-2-ND	IP4772CZ16,118	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Type: Signal Conditioner Applications: Graphic Cards, VGA Interfaces Mounting Type: Surface Mount Package / Case: 16-SSOP (0.154", 3.90mm Width) Supplier Device Package: 16-SSOP Base Part Number: IP4772	1000 Order	1+: $0
TDA8263HN/C1,51 8-ND	TDA8263HN/C1,51 8	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Type: Satellite Tuner Applications: Demodulation Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5) Base Part Number: TDA8263	1000 Order	1+: $0
TDA9989ET/C1,51 8-ND	TDA9989ET/C1,51 8	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Type: Transmitter Applications: Cameras, Cell Phones, Media Players Mounting Type: Surface Mount Package / Case: 64-TFBGA Supplier Device Package: 64-TFBGA (4.5x4.5) Base Part Number: TDA9989	1000 Order	1+: $0
568-5667-5-ND	BGO807C/FC0,112	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: CATV Number of Circuits: 1 Current - Supply: 190mA Package / Case: SOT-115X Supplier Device Package: SOT115X Base Part Number: BGO807	1000 Order	1+: $0
74LV153D,118-ND	74LV153D,118	NXP USA Inc	View more Series: 74LV Packaging: Tape & Reel (TR) Part Status: Obsolete Type: Multiplexer Circuit: 2 x 4:1 Independent Circuits: 1 Current - Output High, Low: 6mA, 6mA Voltage Supply Source: Single Supply Voltage - Supply: 1 V ~ 3.6 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO Base Part Number: 74LV153	1000 Order	1+: $0
568-2777-5-ND	74HCT147D,652	NXP USA Inc	View more Series: 74HCT Packaging: Tube Part Status: Obsolete Type: Priority Encoder Circuit: 1 x 10:4 Independent Circuits: 1 Current - Output High, Low: 4mA, 4mA Voltage Supply Source: Single Supply Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO Base Part Number: 74HCT147	1000 Order	1+: $0
568-3639-5-ND	PCF8594C-2P/02, 112	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Memory Type: Non-Volatile Memory Format: EEPROM Technology: EEPROM Memory Size: 4Kb (512 x 8) Clock Frequency: 100kHz Memory Interface: IC Voltage - Supply: 2.5 V ~ 6.0 V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Through Hole Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-DIP Base Part Number: PCF8594	1000 Order	1+: $0
74LV573DB,118-N D	74LV573DB,118	NXP USA Inc	View more Series: 74LV Packaging: Tape & Reel (TR) Part Status: Obsolete Logic Type: D-Type Transparent Latch Circuit: 8:8 Output Type: Tri-State Voltage - Supply: 1 V ~ 5.5 V Independent Circuits: 1 Delay Time - Propagation: 24ns Current - Output High, Low: 16mA, 16mA Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 20-SSOP (0.209", 5.30mm Width) Supplier Device Package: 20-SSOP Base Part Number: 74LV573	1000 Order	1+: $0
74ABT16821ADL,5 12-ND	74ABT16821ADL,5 12	NXP USA Inc	View more Series: 74ABT Packaging: Tube Part Status: Obsolete Function: Standard Type: D-Type Output Type: Tri-State, Non-Inverted Number of Elements: 2 Number of Bits per Element: 10 Clock Frequency: 250MHz Max Propagation Delay @ V, Max CL: 3.3ns @ 5V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Iq): 1mA Input Capacitance: 3pF Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 56-BSSOP (0.295", 7.50mm Width) Base Part Number: 74ABT16821	1000 Order	1+: $0
568-1087-5-ND	PCF8591P,112	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Type: ADC, DAC Number of Channels: 4 Resolution (Bits): 8 b Sampling Rate (Per Second): 11.1k Data Interface: IC, Serial Voltage Supply Source: Single Supply Voltage - Supply: 2.5 V ~ 6 V Operating Temperature: -40C ~ 85C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP Base Part Number: PCF8591	1000 Order	1+: $0
568-1068-2-ND	PCF8563T/F4,118	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Type: Clock/Calendar Features: Alarm, Leap Year, Watchdog Timer Time Format: HH:MM:SS (24 hr) Date Format: YY-MM-DD-dd Interface: IC, 2-Wire Serial Voltage - Supply: 1.8 V ~ 5.5 V Current - Timekeeping (Max): 0.6A ~ 0.75A @ 2V ~ 5V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO Base Part Number: PCF8563	15000 Order	2500+: $0.3616 5000+: $0.3435
568-13736-ND	MC9S08AC48CFUE	NXP USA Inc	View more Series: S08 Packaging: Tray Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: IC, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14) Base Part Number: MC9S08AC48	1000 Order	1+: $4.032 10+: $3.6439 100+: $3.0166 500+: $2.6268 1000+: $2.2878
S9S08RN8W2MTGR- ND	S9S08RN8W2MTGR	NXP USA Inc	View more Series: S08 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: IC, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	1000 Order	5000+: $0.9049
568-4954-ND	LPC1112FHN33/20 1,5	NXP USA Inc	View more Series: LPC1100 Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: IC, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 28 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 32-VQFN Exposed Pad Supplier Device Package: 32-HVQFN (7x7) Base Part Number: LPC1112	1000 Order	260+: $1.1642
S9S12GN32AMLFR- ND	S9S12GN32AMLFR	NXP USA Inc	View more Series: HCS12 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	1000 Order	2000+: $1.2736
MKL14Z64VFT4R-N D	MKL14Z64VFT4R	NXP USA Inc	View more Series: Kinetis KL1 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: ARM Cortex-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: IC, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 15x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	1000 Order	--
S9S08RN16W2VTJ- ND	S9S08RN16W2VTJ	NXP USA Inc	View more Series: S08 Packaging: Tube Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: IC, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 16 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 10x10b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	1000 Order	75+: $1.7152
S9S08SL16F1MTLR -ND	S9S08SL16F1MTLR	NXP USA Inc	View more Series: S08 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: IC, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 22 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: External Operating Temperature: -40C ~ 125C (TA) Package / Case: 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 28-TSSOP Base Part Number: S9S08SL16	1000 Order	5000+: $1.9104
MKL27Z64VDA4-ND	MKL27Z64VDA4	NXP USA Inc	View more Series: Kinetis KL2 Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: IC, FlexIO, SPI, UART/USART, USB Peripherals: DMA, IS, PWM, WDT Number of I/O: 30 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 14x16b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 36-XFBGA Supplier Device Package: 36-XFBGA (3.5x3.5)	1000 Order	--

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