Nxp ideal diode - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
A7002CGHN1/T1AG 502-ND	A7002CGHN1/T1AG 502	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	2450+: $1.8853
ASC8850ET/M2,55 1-ND	ASC8850ET/M2,55 1	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9 Interface: EBI/EMI, Ethernet, IS, IrDA, SD/MMC, SPI, UART/USART, USB OTG Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15) Base Part Number: ASC8850	1000 Order	1+: $0
MM912H634DV1AER 2-ND	MM912H634DV1AER 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (64 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912H634	1000 Order	--
ASC8850AETK-ND	ASC8850AETK	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9 Interface: EBI/EMI, Ethernet, IS, IrDA, SD/MMC, SPI, UART/USART, USB OTG Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15) Base Part Number: ASC8850	1000 Order	1+: $0
568-14066-2-ND	A7102CHTK2/T0BC 2AJ	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Authentication Core Processor: MX51 Interface: IC Voltage - Supply: 2.5 V ~ 3.6 V Operating Temperature: -40C ~ 90C (TA) Mounting Type: Surface Mount Package / Case: 8-VDFN Exposed Pad Supplier Device Package: 8-HVSON (4x4)	1000 Order	6000+: $0.8211
MM908E624ACDWBR 2-ND	MM908E624ACDWBR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	--
A7005CGHN1/T1AG AEL-ND	A7005CGHN1/T1AG AEL	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	2450+: $2.078
A7001CMHN1/T1AG CEL-ND	A7001CMHN1/T1AG CEL	NXP USA Inc	View more Part Status: Active Applications: Authentication Core Processor: MX51 Program Memory Type: EEPROM (76.4 kB) Controller Series: A700x RAM Size: 3.2kB Interface: IC, 2-Wire Serial Voltage - Supply: 1.62 V ~ 5.5 V Operating Temperature: -25C ~ 85C	1000 Order	2450+: $1.2569
MM912F634DV2AE- ND	MM912F634DV2AE	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (32 KB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912F634	1000 Order	--
MM912G634CM1AER 2-ND	MM912G634CM1AER 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.25 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7) Base Part Number: MM912G634	1000 Order	1+: $0
ASC8848ET/M2,55 1-ND	ASC8848ET/M2,55 1	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9 Interface: EBI/EMI, Ethernet, IS, IrDA, SD/MMC, SPI, UART/USART, USB OTG Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15) Base Part Number: ASC8848	1000 Order	1+: $0
A7005CGHN1/T1AG BFJ-ND	A7005CGHN1/T1AG BFJ	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	6000+: $2.078
MM908E622ACPEKR 2-ND	MM908E622ACPEKR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E622	1000 Order	1000+: $4.1419
MM912JS812AMAF- ND	MM912JS812AMAF	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Engine Control Core Processor: S12XS Program Memory Type: FLASH (128 kB) Controller Series: HCS12 RAM Size: 8K x 8 Interface: CAN, SCI, SPI Number of I/O: 6 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14) Base Part Number: MM912JS812	1000 Order	--
A7001AGHN1/T1AG 315-ND	A7001AGHN1/T1AG 315	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Authentication Core Processor: MX51 Program Memory Type: EEPROM (76.4 kB) Controller Series: A700x RAM Size: 3.2kB Interface: IC, 2-Wire Serial Voltage - Supply: 1.62 V ~ 5.5 V Operating Temperature: -25C ~ 85C Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5) Base Part Number: A700*	1000 Order	1+: $0
EM783-SPE-ND	EM783-SPE	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Energy Measurement Core Processor: ARM Cortex-M0 Program Memory Type: FLASH (32 kB) RAM Size: 8K x 8 Interface: IC, IrDA, SPI, UART/USART Number of I/O: 22 Voltage - Supply: 2.6 V ~ 3.6 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 32-VQFN Exposed Pad Supplier Device Package: 32-HVQFN (7x7)	1000 Order	1+: $0
MM908E625ACDWB- ND	MM908E625ACDWB	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E625	1000 Order	--
PNX1302EH,557-N D	PNX1302EH,557	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Multimedia Core Processor: TriMedia Controller Series: Nexperia RAM Size: 48K x 8 Interface: IC, 2-Wire Serial Number of I/O: 169 Voltage - Supply: 2.375 V ~ 2.625 V Operating Temperature: 0C ~ 85C Mounting Type: Surface Mount Package / Case: 292-HBGA Supplier Device Package: 292-BGA Base Part Number: PNX13*	1000 Order	1+: $0
ASC8848ET/M2,55 7-ND	ASC8848ET/M2,55 7	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9 Interface: EBI/EMI, Ethernet, IS, IrDA, SD/MMC, SPI, UART/USART, USB OTG Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15) Base Part Number: ASC8848	1000 Order	1+: $0
PNX1502E,557-ND	PNX1502E,557	NXP USA Inc	View more Series: PNX15xx Packaging: Tray Part Status: Obsolete Applications: Multimedia Core Processor: TM3260 Controller Series: Nexperia Interface: IC, 2-Wire Serial Number of I/O: 61 Voltage - Supply: 1.23 V ~ 1.37 V Operating Temperature: 0C ~ 85C Mounting Type: Surface Mount Package / Case: 456-BGA Supplier Device Package: 456-PBGA (27x27) Base Part Number: PNX15*	1000 Order	1+: $0
MM912G634DC1AER 2-ND	MM912G634DC1AER 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912G634	1000 Order	2000+: $3.3851
A7005CGHN1/T1AG 589-ND	A7005CGHN1/T1AG 589	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	2450+: $2.078
A7005CGHN1/T1AG BEL-ND	A7005CGHN1/T1AG BEL	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	2450+: $2.078
568-12070-ND	ASC8852AETE	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9 Interface: EBI/EMI, Ethernet, IS, IrDA, SD/MMC, SPI, UART/USART, USB OTG Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15) Base Part Number: ASC8852	1000 Order	1+: $0
MM908E622ACPEK- ND	MM908E622ACPEK	NXP USA Inc	View more Packaging: Tube Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E622	1000 Order	--
PNX1501E,557-ND	PNX1501E,557	NXP USA Inc	View more Series: PNX15xx Packaging: Tray Part Status: Obsolete Applications: Multimedia Core Processor: TM3260 Controller Series: Nexperia Interface: IC, 2-Wire Serial Number of I/O: 61 Voltage - Supply: 1.14 V ~ 1.26 V Operating Temperature: 0C ~ 85C Mounting Type: Surface Mount Package / Case: 456-BGA Supplier Device Package: 456-PBGA (27x27) Base Part Number: PNX15*	1000 Order	1+: $0
MM912F634BV1AE- ND	MM912F634BV1AE	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (32 KB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912F634	1000 Order	--
A7006CGHN1/T1AG BEL-ND	A7006CGHN1/T1AG BEL	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	2450+: $2.2791
MM912G634DC2AP- ND	MM912G634DC2AP	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7) Base Part Number: MM912G634	1000 Order	250+: $4.027
MM908E624ACPEW- ND	MM908E624ACPEW	NXP USA Inc	View more Packaging: Tube Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	--
568-14486-ND	MM912H634DV1AE	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (64 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912H634	250 Order	--
MM908E626AVDWB- ND	MM908E626AVDWB	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 115C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E626	1000 Order	--
MM912F634CV2AE- ND	MM912F634CV2AE	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (32 KB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912F634	1000 Order	--
A7002CIHN1/T1AG BEL-ND	A7002CIHN1/T1AG BEL	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	2450+: $2.0529
EM783-MC6E-ND	EM783-MC6E	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Energy Measurement Core Processor: ARM Cortex-M0 Program Memory Type: FLASH (32 kB) RAM Size: 8K x 8 Interface: IC, IrDA, SPI, UART/USART Number of I/O: 22 Voltage - Supply: 2.6 V ~ 3.6 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 32-VQFN Exposed Pad Supplier Device Package: 32-HVQFN (7x7)	1000 Order	1+: $0
MM912G634CV1AER 2-ND	MM912G634CV1AER 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.25 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912G634	1000 Order	1+: $0
A7001CGHN1/T1AG AEL-ND	A7001CGHN1/T1AG AEL	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	2450+: $1.8853
MM912G634DM1AE- ND	MM912G634DM1AE	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912G634	1000 Order	250+: $5.0016
A7001CGHN1/T1AG BEL-ND	A7001CGHN1/T1AG BEL	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	--
ASC8852AETK-ND	ASC8852AETK	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9 Interface: EBI/EMI, Ethernet, IS, IrDA, SD/MMC, SPI, UART/USART, USB OTG Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15) Base Part Number: ASC8852	1000 Order	1+: $0

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