Nxp interface codec - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
LFSTBBAT9-ND	LFSTBBAT9	NXP USA Inc	View more Part Status: Obsolete Accessory Type: Battery Board For Use With/Related Products: LFSTBEB7361, LFSTBEB7455, LFSTBEB7660	1000 Order	1+: $0
M68TQS032SAN1E- ND	M68TQS032SAN1E	NXP USA Inc	View more Part Status: Obsolete Accessory Type: Adapter For Use With/Related Products: Freescale EVAL Boards	1000 Order	1+: $0
BC635-16,126-ND	BC635-16,126	NXP USA Inc	View more Packaging: Tape & Box (TB) Part Status: Obsolete Transistor Type: NPN Current - Collector (Ic) (Max): 1A Voltage - Collector Emitter Breakdown (Max): 45V Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 2V Power - Max: 830mW Frequency - Transition: 180MHz Operating Temperature: 150C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3 Base Part Number: BC635	1000 Order	1+: $0
BUK9Y29-40E/CX- ND	BUK9Y29-40E/CX	NXP USA Inc	View more Series: * Part Status: Obsolete	1000 Order	1+: $0
MC68HC908MR8CDW -ND	MC68HC908MR8CDW	NXP USA Inc	View more Series: HC08 Packaging: Tube Part Status: Obsolete Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI Peripherals: LVD, POR, PWM Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SOIC Base Part Number: MC68HC908	1000 Order	1+: $0
MCF5272CVF66-ND	MCF5272CVF66	NXP USA Inc	View more Series: MCF527x Packaging: Tray Part Status: Obsolete Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 66MHz Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART, USB Peripherals: DMA, WDT Number of I/O: 32 Program Memory Size: 16KB (4K x 32) Program Memory Type: ROM RAM Size: 1K x 32 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Oscillator Type: External Operating Temperature: -40C ~ 85C (TA) Package / Case: 196-LBGA Supplier Device Package: 196-MAPBGA (15x15) Base Part Number: MCF5272	1000 Order	1+: $0
568-1895-ND	LPC2194JBD64,15 1	NXP USA Inc	View more Series: LPC2100 Packaging: Tray Part Status: Obsolete Core Processor: ARM7 Core Size: 16/32-Bit Speed: 60MHz Connectivity: CANbus, IC, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 46 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10) Base Part Number: LPC2194	1000 Order	1+: $0
568-8757-2-ND	TFA9815T/N1,118	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Type: Class D Output Type: 2-Channel (Stereo) Max Output Power x Channels @ Load: 18W x 2 @ 4 Ohm Voltage - Supply: 8 V ~ 20 V Features: Differential Inputs, Short-Circuit and Thermal Protection Mounting Type: Surface Mount Operating Temperature: -40C ~ 85C (TA) Supplier Device Package: 32-SO Package / Case: 32-SOIC (0.295", 7.50mm Width) Base Part Number: TFA9815	1000 Order	1+: $0
SSL5301T/1J-ND	SSL5301T/1J	NXP USA Inc	View more Series: GreenChip Packaging: Tape & Reel (TR) Part Status: Discontinued at Digi-Key Type: AC DC Offline Switcher Topology: Flyback, Step-Down (Buck), Step-Up (Boost) Internal Switch(s): No Number of Outputs: 1 Voltage - Supply (Min): 8.8V Voltage - Supply (Max): 32V Applications: Lighting Operating Temperature: -40C ~ 125C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	1000 Order	1+: $0
TDA1519CJ/N3C,1 12-ND	TDA1519CJ/N3C,1 12	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Type: Class B Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Max Output Power x Channels @ Load: 22W x 1 @ 4 Ohm; 11W x 2 @ 2 Ohm Voltage - Supply: 6 V ~ 17.5 V Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Through Hole Operating Temperature: -25C ~ 150C (TJ) Supplier Device Package: 9-PSIL Package / Case: 9-SIP Base Part Number: TDA1519	1000 Order	1+: $0
TSA5060ATS/C1,1 18-ND	TSA5060ATS/C1,1 18	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Type: PLL Frequency Synthesizer PLL: No Input: Clock, Crystal Output: Clock, Crystal Number of Circuits: 1 Ratio - Input:Output: 3:2 Differential - Input:Output: No/No Frequency - Max: 1.3GHz Divider/Multiplier: Yes/No Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -20C ~ 85C Mounting Type: Surface Mount Package / Case: 16-LSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-SSOP Base Part Number: TSA5060A	1000 Order	1+: $0
PTN3310D,118-ND	PTN3310D,118	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Translator Type: Mixed Signal Channel Type: Unidirectional Number of Circuits: 1 Channels per Circuit: 1 Input Signal: LVDS Output Signal: PECL Output Type: Differential Data Rate: 800Mbps Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO Base Part Number: PTN3310	1000 Order	1+: $0
568-3541-2-ND	SSTUB32864EC/G, 518	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Logic Type: 1:1, 1:2 Configurable Registered Buffer Supply Voltage: 1.7 V ~ 2 V Number of Bits: 25, 14 Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 96-LFBGA Supplier Device Package: 96-LFBGA (13.5x5.5) Base Part Number: 74SSTUB32864	1000 Order	1+: $0
BGY885B,112-ND	BGY885B,112	NXP USA Inc	View more Packaging: Bulk Part Status: Obsolete Applications: CATV Number of Circuits: 1 Current - Supply: 235mA Package / Case: SOT-115J Supplier Device Package: SOT115J Base Part Number: BGY885	1000 Order	1+: $0
568-10035-2-ND	LD6806TD/33H,12 5	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 3.3V Voltage Dropout (Max): 0.13V @ 200mA Current - Output: 200mA Current - Quiescent (Iq): 100A Current - Supply (Max): 250A PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: SC-74A, SOT-753 Supplier Device Package: 5-TSOP Base Part Number: LD6806	1000 Order	1+: $0
568-14442-ND	MMPF0200F6AEP	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	--
MC34PF3000A4EP- ND	MC34PF3000A4EP	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Processor Voltage - Supply: 2.8 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	140 Order	1+: $3.528 10+: $3.167 100+: $2.595 500+: $2.2091 1000+: $1.8631
568-14457-ND	MC33813AE	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Small Engine Current - Supply: 10mA Voltage - Supply: 4.5 V ~ 36 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7) Base Part Number: MC33813	250 Order	--
568-13650-2-ND	MC13892DJVLR2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 186-LFBGA Supplier Device Package: 186-PBGA (12x12) Base Part Number: MC13892	1000 Order	1000+: $2.7059 2000+: $2.6658
SC900841JVKR2-N D	SC900841JVKR2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: PC's, PDA's Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 338-TFBGA Supplier Device Package: 338-MAPBGA Base Part Number: SC900841	1000 Order	1+: $0
568-3325-2-ND	UBA2032TS/N3,11 8	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Driven Configuration: Half-Bridge Channel Type: Synchronous Number of Drivers: 4 Gate Type: N-Channel MOSFET Voltage - Supply: 10.5 V ~ 13.5 V Logic Voltage - VIL, VIH: 2V, 4V; 3V, 6V Current - Peak Output (Source, Sink): 180mA, 200mA Input Type: RC Input Circuit High Side Voltage - Max (Bootstrap): 550V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 28-SSOP (0.209", 5.30mm Width) Supplier Device Package: 28-SSOP Base Part Number: UBA2032	1000 Order	1+: $0
568-14340-ND	MCF51QU128VHS	NXP USA Inc	View more Series: MCF51Qx Packaging: Tray Part Status: Active Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: EBI/EMI, IC, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 31 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 11x12b, D/A 1x12b Oscillator Type: External Operating Temperature: -40C ~ 105C (TA) Package / Case: 44-VFLGA Exposed Pad Supplier Device Package: 44-MAPLGA (5x5) Base Part Number: MCF51QU128	1000 Order	1+: $3.1563 10+: $2.8337 100+: $2.3219 500+: $1.9766 1000+: $1.667
568-13641-2-ND	MK60FN1M0VMD12R	NXP USA Inc	View more Series: Kinetis K60 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: ARM Cortex-M4 Core Size: 32-Bit Speed: 120MHz Connectivity: CANbus, EBI/EMI, Ethernet, IC, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, IS, LVD, POR, PWM, WDT Number of I/O: 100 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 58x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 144-LBGA Supplier Device Package: 144-MAPBGA (13x13) Base Part Number: MK60FN1M0	1000 Order	1000+: $6.0245
MC9S08PA8VLDR-N D	MC9S08PA8VLDR	NXP USA Inc	View more Series: S08 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: IC, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 37 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	1000 Order	1500+: $0.7399
S9S08RNA16W2MTJ R-ND	S9S08RNA16W2MTJ R	NXP USA Inc	View more Series: S08 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: IC, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 16 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 10x10b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	1000 Order	5000+: $0.9971
MC908QT1AMDWER- ND	MC908QT1AMDWER	NXP USA Inc	View more Series: HC08 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Peripherals: LVD, POR, PWM Number of I/O: 5 Program Memory Size: 1.5KB (1.5K x 8) Program Memory Type: FLASH RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 8-SOIC (0.209", 5.30mm Width) Supplier Device Package: 8-SOIC Base Part Number: MC908QT1	1000 Order	2000+: $1.0306
568-8559-ND	LPC11U12FHN33/2 01,	NXP USA Inc	View more Series: LPC11Uxx Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: IC, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 26 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH RAM Size: 6K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 32-VQFN Exposed Pad Supplier Device Package: 32-HVQFN (7x7) Base Part Number: LPC11U	1000 Order	260+: $1.2121
S9S12GN32BVLC-N D	S9S12GN32BVLC	NXP USA Inc	View more Series: HCS12 Packaging: Tray Part Status: Active Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	1000 Order	--
MC9S08SH32CTLR- ND	MC9S08SH32CTLR	NXP USA Inc	View more Series: S08 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: IC, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 23 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 28-TSSOP Base Part Number: MC9S08SH32	1000 Order	--
S9S12G96ACLFR-N D	S9S12G96ACLFR	NXP USA Inc	View more Series: HCS12 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: 3K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	1000 Order	2000+: $1.659
MC9S08JS16LCFK- ND	MC9S08JS16LCFK	NXP USA Inc	View more Series: S08 Packaging: Tray Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 48MHz Connectivity: LINbus, SCI, SPI, USB Peripherals: LVD, POR, PWM Number of I/O: 14 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 24-VQFN Exposed Pad Supplier Device Package: 24-QFN-EP (5x5) Base Part Number: MC9S08JS16	1000 Order	490+: $1.69
S9S12GN32F1VTJ- ND	S9S12GN32F1VTJ	NXP USA Inc	View more Series: HCS12 Packaging: Tube Part Status: Active Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 14 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	1000 Order	75+: $1.8995
S9S08AW16AE0CLD -ND	S9S08AW16AE0CLD	NXP USA Inc	View more Series: S08 Packaging: Tray Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: IC, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10) Base Part Number: S9S08AW16	1000 Order	--
MC9S08AC48CFGER -ND	MC9S08AC48CFGER	NXP USA Inc	View more Series: S08 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: IC, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	1000 Order	1500+: $2.1124
MC9S08AC60CFGER -ND	MC9S08AC60CFGER	NXP USA Inc	View more Series: S08 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: IC, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10) Base Part Number: MC9S08AC60	1000 Order	--
S912ZVC64F0MKHR -ND	S912ZVC64F0MKHR	NXP USA Inc	View more Series: S12 MagniV Packaging: Tape & Reel (TR) Part Status: Active Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, IC, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V Data Converters: A/D 16x10b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP (10x10)	1000 Order	1500+: $2.2708
S9S08DN32F2CLF- ND	S9S08DN32F2CLF	NXP USA Inc	View more Series: S08 Packaging: Tray Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: IC, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 1.5K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7) Base Part Number: S9S08DN32	1000 Order	--
S9S08DN32F2VLC- ND	S9S08DN32F2VLC	NXP USA Inc	View more Series: S08 Packaging: Tray Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: IC, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 25 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 1.5K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7) Base Part Number: S9S08DN32	1000 Order	--
MC9S08QE64CLD-N D	MC9S08QE64CLD	NXP USA Inc	View more Series: S08 Packaging: Tray Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 50MHz Connectivity: IC, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 34 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10) Base Part Number: MC9S08QE64	1000 Order	800+: $2.7147
S9S08AW60E5CPUE R-ND	S9S08AW60E5CPUE R	NXP USA Inc	View more Series: S08 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: IC, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	1000 Order	1500+: $2.8152

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