Nxp lighting controller - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
MM912KS812AMAF- ND	MM912KS812AMAF	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Engine Control Core Processor: S12XS Program Memory Type: FLASH (256 kB) Controller Series: HCS12 RAM Size: 12K x 8 Interface: CAN, SCI, SPI Number of I/O: 6 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14)	78 Order	1+: $6.4953 10+: $5.8691 100+: $4.8589 500+: $4.2311 1000+: $3.6851
MM912KS812AMAFR 2-ND	MM912KS812AMAFR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Engine Control Core Processor: S12XS Program Memory Type: FLASH (256 kB) Controller Series: HCS12 RAM Size: 12K x 8 Interface: CAN, SCI, SPI Number of I/O: 6 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14)	1000 Order	1000+: $3.6851
MM908E624ACDWBR 2-ND	MM908E624ACDWBR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	--
MM908E622ACPEKR 2-ND	MM908E622ACPEKR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E622	1000 Order	1000+: $4.1419
MM912JS812AMAF- ND	MM912JS812AMAF	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Engine Control Core Processor: S12XS Program Memory Type: FLASH (128 kB) Controller Series: HCS12 RAM Size: 8K x 8 Interface: CAN, SCI, SPI Number of I/O: 6 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14) Base Part Number: MM912JS812	1000 Order	--
MM908E625ACDWB- ND	MM908E625ACDWB	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E625	1000 Order	--
MM908E622ACPEK- ND	MM908E622ACPEK	NXP USA Inc	View more Packaging: Tube Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E622	1000 Order	--
MM908E624ACPEW- ND	MM908E624ACPEW	NXP USA Inc	View more Packaging: Tube Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	--
MM908E626AVDWB- ND	MM908E626AVDWB	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 115C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E626	1000 Order	--
MM908E626AVPEKR 2-ND	MM908E626AVPEKR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 115C Mounting Type: Surface Mount Package / Case: 54-SOIC (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC W EP Base Part Number: MM908E626	1000 Order	1000+: $3.5636
MM912JP812AMAFR 2-ND	MM912JP812AMAFR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Engine Control Core Processor: S12P Program Memory Type: FLASH (128 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: CAN, SCI, SPI Number of I/O: 8 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14) Base Part Number: MM912JP812	1000 Order	800+: $2.5682
MM908E624AYEW-N D	MM908E624AYEW	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	--
MM912IP812AMAFR 2-ND	MM912IP812AMAFR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Engine Control Core Processor: S12P Program Memory Type: FLASH (96 KB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: CAN, SCI, SPI Number of I/O: 8 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14) Base Part Number: MM912IP812	1000 Order	800+: $2.4803
MM908E621ACDWBR 2-ND	MM908E621ACDWBR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E621	1000 Order	1+: $0
MM908E624AYEWR2 -ND	MM908E624AYEWR2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	1+: $0
MM908E625ACEK-N D	MM908E625ACEK	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E625	1000 Order	--
MM908E622ACEK-N D	MM908E622ACEK	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E622	1000 Order	--
MM908E624ACEWR2 TR-ND	MM908E624ACEWR2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	--
MM908E626AVEK-N D	MM908E626AVEK	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 115C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E626	1000 Order	--
MM908E621ACPEKR 2-ND	MM908E621ACPEKR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC W EP Base Part Number: MM908E621	1000 Order	1000+: $3.5721
MM912JP812AMAF- ND	MM912JP812AMAF	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Engine Control Core Processor: S12P Program Memory Type: FLASH (128 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: CAN, SCI, SPI Number of I/O: 8 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14) Base Part Number: MM912JP812	1000 Order	90+: $3.3967
MM908E625ACPEKR 2-ND	MM908E625ACPEKR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-SOIC (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC	1000 Order	1000+: $3.5211
MM908E622ACDWB- ND	MM908E622ACDWB	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E622	1000 Order	--
MM908E626AVPEK- ND	MM908E626AVPEK	NXP USA Inc	View more Packaging: Tube Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 115C Mounting Type: Surface Mount Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC Base Part Number: MM908E626	1000 Order	--
MM908E624ACEW-N D	MM908E624ACEW	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	--
MM908E624AYPEWR 2-ND	MM908E624AYPEWR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	1000+: $3.0958
MM908E624ACDWB- ND	MM908E624ACDWB	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	--
MM908E624AYPEW- ND	MM908E624AYPEW	NXP USA Inc	View more Packaging: Tube Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	--
MM908E621ACDWB- ND	MM908E621ACDWB	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E621	1000 Order	1+: $0
568-14587-ND	MM908E625ACPEK	NXP USA Inc	View more Packaging: Tube Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E625	26 Order	--
MM908E624ACPEWR 2-ND	MM908E624ACPEWR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	--
MM912JS812AMAFR 2-ND	MM912JS812AMAFR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Engine Control Core Processor: S12XS Program Memory Type: FLASH (128 kB) Controller Series: HCS12 RAM Size: 8K x 8 Interface: CAN, SCI, SPI Number of I/O: 6 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14) Base Part Number: MM912JS812	1000 Order	800+: $2.8612
MM912IP812AMAF- ND	MM912IP812AMAF	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Engine Control Core Processor: S12P Program Memory Type: FLASH (96 KB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: CAN, SCI, SPI Number of I/O: 8 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14) Base Part Number: MM912IP812	1000 Order	450+: $2.7203
ASC8850ET/M2,55 1-ND	ASC8850ET/M2,55 1	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9 Interface: EBI/EMI, Ethernet, IS, IrDA, SD/MMC, SPI, UART/USART, USB OTG Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15) Base Part Number: ASC8850	1000 Order	1+: $0
ASC8850AETK-ND	ASC8850AETK	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9 Interface: EBI/EMI, Ethernet, IS, IrDA, SD/MMC, SPI, UART/USART, USB OTG Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15) Base Part Number: ASC8850	1000 Order	1+: $0
568-14066-2-ND	A7102CHTK2/T0BC 2AJ	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Authentication Core Processor: MX51 Interface: IC Voltage - Supply: 2.5 V ~ 3.6 V Operating Temperature: -40C ~ 90C (TA) Mounting Type: Surface Mount Package / Case: 8-VDFN Exposed Pad Supplier Device Package: 8-HVSON (4x4)	1000 Order	6000+: $0.8211
A7001CMHN1/T1AG CEL-ND	A7001CMHN1/T1AG CEL	NXP USA Inc	View more Part Status: Active Applications: Authentication Core Processor: MX51 Program Memory Type: EEPROM (76.4 kB) Controller Series: A700x RAM Size: 3.2kB Interface: IC, 2-Wire Serial Voltage - Supply: 1.62 V ~ 5.5 V Operating Temperature: -25C ~ 85C	1000 Order	2450+: $1.2569
MM912F634DV2AE- ND	MM912F634DV2AE	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (32 KB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912F634	1000 Order	--
MM912G634CM1AER 2-ND	MM912G634CM1AER 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.25 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7) Base Part Number: MM912G634	1000 Order	1+: $0
ASC8848ET/M2,55 1-ND	ASC8848ET/M2,55 1	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9 Interface: EBI/EMI, Ethernet, IS, IrDA, SD/MMC, SPI, UART/USART, USB OTG Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15) Base Part Number: ASC8848	1000 Order	1+: $0

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