Nxp linear stabilizer - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
EM783-SCE-ND	EM783-SCE	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Energy Measurement Core Processor: ARM Cortex-M0 Program Memory Type: FLASH (32 kB) RAM Size: 8K x 8 Interface: IC, IrDA, SPI, UART/USART Number of I/O: 22 Voltage - Supply: 2.6 V ~ 3.6 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 32-VQFN Exposed Pad Supplier Device Package: 32-HVQFN (7x7)	1000 Order	1+: $0
ASC8849AETE-ND	ASC8849AETE	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9 Interface: EBI/EMI, Ethernet, IS, IrDA, SD/MMC, SPI, UART/USART, USB OTG Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15) Base Part Number: ASC8849	1000 Order	1+: $0
568-14487-ND	MM912G634DV1AE	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912G634	250 Order	--
MM908E626AVPEK- ND	MM908E626AVPEK	NXP USA Inc	View more Packaging: Tube Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 115C Mounting Type: Surface Mount Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC Base Part Number: MM908E626	1000 Order	--
EM783-MC3E-ND	EM783-MC3E	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Energy Measurement Core Processor: ARM Cortex-M0 Program Memory Type: FLASH (32 kB) RAM Size: 8K x 8 Interface: IC, IrDA, SPI, UART/USART Number of I/O: 22 Voltage - Supply: 2.6 V ~ 3.6 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 32-VQFN Exposed Pad Supplier Device Package: 32-HVQFN (7x7)	1000 Order	1+: $0
A7101CGHN1/T0B0 406-ND	A7101CGHN1/T0B0 406	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	1500+: $1.076
MM908E622ACDWB- ND	MM908E622ACDWB	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E622	1000 Order	--
MM912KS812AMAF- ND	MM912KS812AMAF	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Engine Control Core Processor: S12XS Program Memory Type: FLASH (256 kB) Controller Series: HCS12 RAM Size: 12K x 8 Interface: CAN, SCI, SPI Number of I/O: 6 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14)	78 Order	1+: $6.4953 10+: $5.8691 100+: $4.8589 500+: $4.2311 1000+: $3.6851
ASC8849ET/M2,55 7-ND	ASC8849ET/M2,55 7	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9 Interface: EBI/EMI, Ethernet, IS, IrDA, SD/MMC, SPI, UART/USART, USB OTG Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15) Base Part Number: ASC8849	1000 Order	1+: $0
A7001CMHN1/T1AG CEL-ND	A7001CMHN1/T1AG CEL	NXP USA Inc	View more Part Status: Active Applications: Authentication Core Processor: MX51 Program Memory Type: EEPROM (76.4 kB) Controller Series: A700x RAM Size: 3.2kB Interface: IC, 2-Wire Serial Voltage - Supply: 1.62 V ~ 5.5 V Operating Temperature: -25C ~ 85C	1000 Order	2450+: $1.2569
MM912F634DV2AE- ND	MM912F634DV2AE	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (32 KB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912F634	1000 Order	--
MM912G634CM1AER 2-ND	MM912G634CM1AER 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.25 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7) Base Part Number: MM912G634	1000 Order	1+: $0
ASC8848ET/M2,55 1-ND	ASC8848ET/M2,55 1	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9 Interface: EBI/EMI, Ethernet, IS, IrDA, SD/MMC, SPI, UART/USART, USB OTG Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15) Base Part Number: ASC8848	1000 Order	1+: $0
MM912G634CV1AER 2-ND	MM912G634CV1AER 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.25 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912G634	1000 Order	1+: $0
568-14332-ND	MM912I637AV1EP	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Battery Monitor Core Processor: S12 Program Memory Type: FLASH (96 KB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI, SPI Number of I/O: 8 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7) Base Part Number: MM912I637	260 Order	1+: $5.4999 10+: $4.9663 100+: $4.1114 500+: $3.5801 1000+: $3.1182
MM908E621ACDWB- ND	MM908E621ACDWB	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E621	1000 Order	1+: $0
EM783-TPE-ND	EM783-TPE	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Energy Measurement Core Processor: ARM Cortex-M0 Program Memory Type: FLASH (32 kB) RAM Size: 8K x 8 Interface: IC, IrDA, SPI, UART/USART Number of I/O: 22 Voltage - Supply: 2.6 V ~ 3.6 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 32-VQFN Exposed Pad Supplier Device Package: 32-HVQFN (7x7)	1000 Order	1+: $0
A7102CGHN1/T0B0 AEL-ND	A7102CGHN1/T0B0 AEL	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	2450+: $1.215
568-14088-ND	MM912J637AM2EP	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Battery Monitor Core Processor: S12 Program Memory Type: FLASH (128 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI, SPI Number of I/O: 8 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7) Base Part Number: MM912J637	1300 Order	--
MM908E621ACDWBR 2-ND	MM908E621ACDWBR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E621	1000 Order	1+: $0
A7101CGTK2/T0B0 40X-ND	A7101CGTK2/T0B0 40X	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	1500+: $0.882
MM912G634DC1AE- ND	MM912G634DC1AE	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912G634	1000 Order	250+: $4.3268
MM912F634BV1AER 2-ND	MM912F634BV1AER 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (32 KB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912F634	1000 Order	1+: $0
MM912IP812AMAF- ND	MM912IP812AMAF	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Engine Control Core Processor: S12P Program Memory Type: FLASH (96 KB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: CAN, SCI, SPI Number of I/O: 8 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14) Base Part Number: MM912IP812	1000 Order	450+: $2.7203
MM912G634DC1AER 2-ND	MM912G634DC1AER 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912G634	1000 Order	2000+: $3.3851
MM912H634DM1AER 2-ND	MM912H634DM1AER 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (64 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912H634	1000 Order	2000+: $1.8434
MM912G634CV2APR 2-ND	MM912G634CV2APR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.25 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7) Base Part Number: MM912G634	1000 Order	1+: $0
MM908E624ACEW-N D	MM908E624ACEW	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	--
MM908E625ACPEKR 2-ND	MM908E625ACPEKR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-SOIC (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC	1000 Order	1000+: $3.5211
A7002CGHN1/T1AG 502-ND	A7002CGHN1/T1AG 502	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	2450+: $1.8853
ASC8850ET/M2,55 1-ND	ASC8850ET/M2,55 1	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9 Interface: EBI/EMI, Ethernet, IS, IrDA, SD/MMC, SPI, UART/USART, USB OTG Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15) Base Part Number: ASC8850	1000 Order	1+: $0
PNX1502E,557-ND	PNX1502E,557	NXP USA Inc	View more Series: PNX15xx Packaging: Tray Part Status: Obsolete Applications: Multimedia Core Processor: TM3260 Controller Series: Nexperia Interface: IC, 2-Wire Serial Number of I/O: 61 Voltage - Supply: 1.23 V ~ 1.37 V Operating Temperature: 0C ~ 85C Mounting Type: Surface Mount Package / Case: 456-BGA Supplier Device Package: 456-PBGA (27x27) Base Part Number: PNX15*	1000 Order	1+: $0
A7005CGHN1/T1AG BFJ-ND	A7005CGHN1/T1AG BFJ	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	6000+: $2.078
MM912H634DV1AER 2-ND	MM912H634DV1AER 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (64 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912H634	1000 Order	--
MM912G634CV2AP- ND	MM912G634CV2AP	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.25 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7) Base Part Number: MM912G634	1000 Order	1+: $0
A7004CIHN1/T1AG BAJ-ND	A7004CIHN1/T1AG BAJ	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	--
MM908E624ACEWR2 TR-ND	MM908E624ACEWR2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	--
MM908E624ACDWBR 2-ND	MM908E624ACDWBR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	--
MM908E622ACEK-N D	MM908E622ACEK	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E622	1000 Order	--
MM908E621ACPEKR 2-ND	MM908E621ACPEKR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC W EP Base Part Number: MM908E621	1000 Order	1000+: $3.5721

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