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Search Result:nxp power controller

 --1177 Item(s) In Category:Embedded - Microcontrollers - Application Specific

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Photo Allicdata Part# Mft.Part# Company Spec. QTY. Pricing(USD) PDF
MM912KS812AMAF MM912KS812AMAF-
ND		 MM912KS812AMAF NXP USA Inc
View more  Packaging: Tray
 Part Status: Active
 Applications: Engine Control
 Core Processor: S12XS
 Program Memory Type: FLASH (256 kB)
 Controller Series: HCS12
 RAM Size: 12K x 8
 Interface: CAN, SCI, SPI
 Number of I/O: 6
 Voltage - Supply: 4.7 V ~ 36 V
 Operating Temperature: -40C ~ 125C
 Mounting Type: Surface Mount
 Package / Case: 100-LQFP Exposed Pad
 Supplier Device Package: 100-LQFP-EP (14x14)
78
Order

1+:

$6.4953

10+:

$5.8691

100+:

$4.8589

500+:

$4.2311

1000+:

$3.6851

 MM912KS812AMAF-ND Datasheet
MM912KS812AMAFR2 MM912KS812AMAFR
2-ND		 MM912KS812AMAFR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Engine Control
 Core Processor: S12XS
 Program Memory Type: FLASH (256 kB)
 Controller Series: HCS12
 RAM Size: 12K x 8
 Interface: CAN, SCI, SPI
 Number of I/O: 6
 Voltage - Supply: 4.7 V ~ 36 V
 Operating Temperature: -40C ~ 125C
 Mounting Type: Surface Mount
 Package / Case: 100-LQFP Exposed Pad
 Supplier Device Package: 100-LQFP-EP (14x14)
1000
Order

1000+:

$3.6851

 MM912KS812AMAFR2-ND Datasheet
MM908E626AVPEK MM908E626AVPEK-
ND		 MM908E626AVPEK NXP USA Inc
View more  Packaging: Tube
 Part Status: Active
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 13
 Voltage - Supply: 8 V ~ 18 V
 Operating Temperature: -40C ~ 115C
 Mounting Type: Surface Mount
 Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
 Supplier Device Package: 54-SOIC
 Base Part Number: MM908E626
1000
Order

--

 MM908E626AVPEK-ND Datasheet
MM908E622ACDWB MM908E622ACDWB-
ND		 MM908E622ACDWB NXP USA Inc
View more  Packaging: Tube
 Part Status: Obsolete
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 12
 Voltage - Supply: 9 V ~ 16 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
 Supplier Device Package: 54-SOICW-EP
 Base Part Number: MM908E622
1000
Order

--

 MM908E622ACDWB-ND Datasheet
MM908E621ACDWB MM908E621ACDWB-
ND		 MM908E621ACDWB NXP USA Inc
View more  Packaging: Tube
 Part Status: Obsolete
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 12
 Voltage - Supply: 9 V ~ 16 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
 Supplier Device Package: 54-SOICW-EP
 Base Part Number: MM908E621
1000
Order

1+:

$0

 MM908E621ACDWB-ND Datasheet
MM908E621ACDWBR2 MM908E621ACDWBR
2-ND		 MM908E621ACDWBR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 12
 Voltage - Supply: 9 V ~ 16 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
 Supplier Device Package: 54-SOICW-EP
 Base Part Number: MM908E621
1000
Order

1+:

$0

 MM908E621ACDWBR2-ND Datasheet
MM912IP812AMAF MM912IP812AMAF-
ND		 MM912IP812AMAF NXP USA Inc
View more  Packaging: Tray
 Part Status: Active
 Applications: Engine Control
 Core Processor: S12P
 Program Memory Type: FLASH (96 KB)
 Controller Series: HCS12
 RAM Size: 6K x 8
 Interface: CAN, SCI, SPI
 Number of I/O: 8
 Voltage - Supply: 4.7 V ~ 36 V
 Operating Temperature: -40C ~ 125C
 Mounting Type: Surface Mount
 Package / Case: 100-LQFP Exposed Pad
 Supplier Device Package: 100-LQFP-EP (14x14)
 Base Part Number: MM912IP812
1000
Order

450+:

$2.7203

 MM912IP812AMAF-ND Datasheet
MM908E624ACEW MM908E624ACEW-N
D		 MM908E624ACEW NXP USA Inc
View more  Packaging: Tube
 Part Status: Obsolete
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 16
 Voltage - Supply: 5.5 V ~ 18 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width)
 Supplier Device Package: 54-SOIC
 Base Part Number: MM908E624
1000
Order

--

 MM908E624ACEW-ND Datasheet
MM908E625ACPEKR2 MM908E625ACPEKR
2-ND		 MM908E625ACPEKR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 13
 Voltage - Supply: 8 V ~ 18 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-SOIC (0.295", 7.50mm Width) Exposed Pad
 Supplier Device Package: 54-SOIC
1000
Order

1000+:

$3.5211

 MM908E625ACPEKR2-ND Datasheet
MM908E624ACEWR2 MM908E624ACEWR2
TR-ND		 MM908E624ACEWR2 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 16
 Voltage - Supply: 5.5 V ~ 18 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width)
 Supplier Device Package: 54-SOIC
 Base Part Number: MM908E624
1000
Order

--

 MM908E624ACEWR2TR-ND Datasheet
MM908E624ACDWBR2 MM908E624ACDWBR
2-ND		 MM908E624ACDWBR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 16
 Voltage - Supply: 5.5 V ~ 18 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width)
 Supplier Device Package: 54-SOIC
 Base Part Number: MM908E624
1000
Order

--

 MM908E624ACDWBR2-ND Datasheet
MM908E622ACEK MM908E622ACEK-N
D		 MM908E622ACEK NXP USA Inc
View more  Packaging: Tube
 Part Status: Obsolete
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 12
 Voltage - Supply: 9 V ~ 16 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
 Supplier Device Package: 54-SOICW-EP
 Base Part Number: MM908E622
1000
Order

--

 MM908E622ACEK-ND Datasheet
MM908E621ACPEKR2 MM908E621ACPEKR
2-ND		 MM908E621ACPEKR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 12
 Voltage - Supply: 9 V ~ 16 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
 Supplier Device Package: 54-SOIC W EP
 Base Part Number: MM908E621
1000
Order

1000+:

$3.5721

 MM908E621ACPEKR2-ND Datasheet
MM912JP812AMAF MM912JP812AMAF-
ND		 MM912JP812AMAF NXP USA Inc
View more  Packaging: Tray
 Part Status: Active
 Applications: Engine Control
 Core Processor: S12P
 Program Memory Type: FLASH (128 kB)
 Controller Series: HCS12
 RAM Size: 6K x 8
 Interface: CAN, SCI, SPI
 Number of I/O: 8
 Voltage - Supply: 4.7 V ~ 36 V
 Operating Temperature: -40C ~ 125C
 Mounting Type: Surface Mount
 Package / Case: 100-LQFP Exposed Pad
 Supplier Device Package: 100-LQFP-EP (14x14)
 Base Part Number: MM912JP812
1000
Order

90+:

$3.3967

 MM912JP812AMAF-ND Datasheet
MM912JS812AMAFR2 MM912JS812AMAFR
2-ND		 MM912JS812AMAFR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Engine Control
 Core Processor: S12XS
 Program Memory Type: FLASH (128 kB)
 Controller Series: HCS12
 RAM Size: 8K x 8
 Interface: CAN, SCI, SPI
 Number of I/O: 6
 Voltage - Supply: 4.7 V ~ 36 V
 Operating Temperature: -40C ~ 125C
 Mounting Type: Surface Mount
 Package / Case: 100-LQFP Exposed Pad
 Supplier Device Package: 100-LQFP-EP (14x14)
 Base Part Number: MM912JS812
1000
Order

800+:

$2.8612

 MM912JS812AMAFR2-ND Datasheet
MM912IP812AMAFR2 MM912IP812AMAFR
2-ND		 MM912IP812AMAFR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Engine Control
 Core Processor: S12P
 Program Memory Type: FLASH (96 KB)
 Controller Series: HCS12
 RAM Size: 6K x 8
 Interface: CAN, SCI, SPI
 Number of I/O: 8
 Voltage - Supply: 4.7 V ~ 36 V
 Operating Temperature: -40C ~ 125C
 Mounting Type: Surface Mount
 Package / Case: 100-LQFP Exposed Pad
 Supplier Device Package: 100-LQFP-EP (14x14)
 Base Part Number: MM912IP812
1000
Order

800+:

$2.4803

 MM912IP812AMAFR2-ND Datasheet
MM908E626AVPEKR2 MM908E626AVPEKR
2-ND		 MM908E626AVPEKR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 13
 Voltage - Supply: 8 V ~ 18 V
 Operating Temperature: -40C ~ 115C
 Mounting Type: Surface Mount
 Package / Case: 54-SOIC (0.295", 7.50mm Width) Exposed Pad
 Supplier Device Package: 54-SOIC W EP
 Base Part Number: MM908E626
1000
Order

1000+:

$3.5636

 MM908E626AVPEKR2-ND Datasheet
MM908E626AVDWB MM908E626AVDWB-
ND		 MM908E626AVDWB NXP USA Inc
View more  Packaging: Tube
 Part Status: Obsolete
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 13
 Voltage - Supply: 8 V ~ 18 V
 Operating Temperature: -40C ~ 115C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
 Supplier Device Package: 54-SOICW-EP
 Base Part Number: MM908E626
1000
Order

--

 MM908E626AVDWB-ND Datasheet
MM908E624AYPEWR2 MM908E624AYPEWR
2-ND		 MM908E624AYPEWR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 16
 Voltage - Supply: 5.5 V ~ 18 V
 Operating Temperature: -40C ~ 125C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width)
 Supplier Device Package: 54-SOIC
 Base Part Number: MM908E624
1000
Order

1000+:

$3.0958

 MM908E624AYPEWR2-ND Datasheet
MM908E624ACDWB MM908E624ACDWB-
ND		 MM908E624ACDWB NXP USA Inc
View more  Packaging: Tube
 Part Status: Obsolete
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 16
 Voltage - Supply: 5.5 V ~ 18 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width)
 Supplier Device Package: 54-SOIC
 Base Part Number: MM908E624
1000
Order

--

 MM908E624ACDWB-ND Datasheet
MM908E624AYPEW MM908E624AYPEW-
ND		 MM908E624AYPEW NXP USA Inc
View more  Packaging: Tube
 Part Status: Active
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 16
 Voltage - Supply: 5.5 V ~ 18 V
 Operating Temperature: -40C ~ 125C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width)
 Supplier Device Package: 54-SOIC
 Base Part Number: MM908E624
1000
Order

--

 MM908E624AYPEW-ND Datasheet
MM908E625ACEK MM908E625ACEK-N
D		 MM908E625ACEK NXP USA Inc
View more  Packaging: Tube
 Part Status: Obsolete
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 13
 Voltage - Supply: 8 V ~ 18 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
 Supplier Device Package: 54-SOICW-EP
 Base Part Number: MM908E625
1000
Order

--

 MM908E625ACEK-ND Datasheet
MM908E622ACPEK MM908E622ACPEK-
ND		 MM908E622ACPEK NXP USA Inc
View more  Packaging: Tube
 Part Status: Active
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 12
 Voltage - Supply: 9 V ~ 16 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
 Supplier Device Package: 54-SOICW-EP
 Base Part Number: MM908E622
1000
Order

--

 MM908E622ACPEK-ND Datasheet
MM908E624ACPEW MM908E624ACPEW-
ND		 MM908E624ACPEW NXP USA Inc
View more  Packaging: Tube
 Part Status: Active
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 16
 Voltage - Supply: 5.5 V ~ 18 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width)
 Supplier Device Package: 54-SOIC
 Base Part Number: MM908E624
1000
Order

--

 MM908E624ACPEW-ND Datasheet
MM908E626AVEK MM908E626AVEK-N
D		 MM908E626AVEK NXP USA Inc
View more  Packaging: Tube
 Part Status: Obsolete
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 13
 Voltage - Supply: 8 V ~ 18 V
 Operating Temperature: -40C ~ 115C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
 Supplier Device Package: 54-SOICW-EP
 Base Part Number: MM908E626
1000
Order

--

 MM908E626AVEK-ND Datasheet
MM908E624ACPEWR2 MM908E624ACPEWR
2-ND		 MM908E624ACPEWR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 16
 Voltage - Supply: 5.5 V ~ 18 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width)
 Supplier Device Package: 54-SOIC
 Base Part Number: MM908E624
1000
Order

--

 MM908E624ACPEWR2-ND Datasheet
MM912JS812AMAF MM912JS812AMAF-
ND		 MM912JS812AMAF NXP USA Inc
View more  Packaging: Tray
 Part Status: Active
 Applications: Engine Control
 Core Processor: S12XS
 Program Memory Type: FLASH (128 kB)
 Controller Series: HCS12
 RAM Size: 8K x 8
 Interface: CAN, SCI, SPI
 Number of I/O: 6
 Voltage - Supply: 4.7 V ~ 36 V
 Operating Temperature: -40C ~ 125C
 Mounting Type: Surface Mount
 Package / Case: 100-LQFP Exposed Pad
 Supplier Device Package: 100-LQFP-EP (14x14)
 Base Part Number: MM912JS812
1000
Order

--

 MM912JS812AMAF-ND Datasheet
MM908E625ACDWB MM908E625ACDWB-
ND		 MM908E625ACDWB NXP USA Inc
View more  Packaging: Tube
 Part Status: Obsolete
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 13
 Voltage - Supply: 8 V ~ 18 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
 Supplier Device Package: 54-SOICW-EP
 Base Part Number: MM908E625
1000
Order

--

 MM908E625ACDWB-ND Datasheet
MM912JP812AMAFR2 MM912JP812AMAFR
2-ND		 MM912JP812AMAFR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Engine Control
 Core Processor: S12P
 Program Memory Type: FLASH (128 kB)
 Controller Series: HCS12
 RAM Size: 6K x 8
 Interface: CAN, SCI, SPI
 Number of I/O: 8
 Voltage - Supply: 4.7 V ~ 36 V
 Operating Temperature: -40C ~ 125C
 Mounting Type: Surface Mount
 Package / Case: 100-LQFP Exposed Pad
 Supplier Device Package: 100-LQFP-EP (14x14)
 Base Part Number: MM912JP812
1000
Order

800+:

$2.5682

 MM912JP812AMAFR2-ND Datasheet
MM908E624AYEW MM908E624AYEW-N
D		 MM908E624AYEW NXP USA Inc
View more  Packaging: Tube
 Part Status: Obsolete
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 16
 Voltage - Supply: 5.5 V ~ 18 V
 Operating Temperature: -40C ~ 125C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width)
 Supplier Device Package: 54-SOIC
 Base Part Number: MM908E624
1000
Order

--

 MM908E624AYEW-ND Datasheet
MM908E625ACPEK 568-14587-ND MM908E625ACPEK NXP USA Inc
View more  Packaging: Tube
 Part Status: Active
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 13
 Voltage - Supply: 8 V ~ 18 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
 Supplier Device Package: 54-SOICW-EP
 Base Part Number: MM908E625
26
Order

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 568-14587-ND Datasheet
MM908E622ACPEKR2 MM908E622ACPEKR
2-ND		 MM908E622ACPEKR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 12
 Voltage - Supply: 9 V ~ 16 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
 Supplier Device Package: 54-SOICW-EP
 Base Part Number: MM908E622
1000
Order

1000+:

$4.1419

 MM908E622ACPEKR2-ND Datasheet
MM908E624AYEWR2 MM908E624AYEWR2
-ND		 MM908E624AYEWR2 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 16
 Voltage - Supply: 5.5 V ~ 18 V
 Operating Temperature: -40C ~ 125C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width)
 Supplier Device Package: 54-SOIC
 Base Part Number: MM908E624
1000
Order

1+:

$0

 MM908E624AYEWR2-ND Datasheet
EM783-SCE EM783-SCE-ND EM783-SCE NXP USA Inc
View more  Packaging: Tray
 Part Status: Obsolete
 Applications: Energy Measurement
 Core Processor: ARM Cortex-M0
 Program Memory Type: FLASH (32 kB)
 RAM Size: 8K x 8
 Interface: IC, IrDA, SPI, UART/USART
 Number of I/O: 22
 Voltage - Supply: 2.6 V ~ 3.6 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 32-VQFN Exposed Pad
 Supplier Device Package: 32-HVQFN (7x7)
1000
Order

1+:

$0

 EM783-SCE-ND Datasheet
ASC8849AETE ASC8849AETE-ND ASC8849AETE NXP USA Inc
View more  Packaging: Tray
 Part Status: Obsolete
 Applications: Embedded Multimedia Communication, Security and Entertainment
 Core Processor: ARM9
 Interface: EBI/EMI, Ethernet, IS, IrDA, SD/MMC, SPI, UART/USART, USB OTG
 Mounting Type: Surface Mount
 Package / Case: 484-TFBGA
 Supplier Device Package: 484-TFBGA (15x15)
 Base Part Number: ASC8849
1000
Order

1+:

$0

 ASC8849AETE-ND Datasheet
MM912G634DV1AE 568-14487-ND MM912G634DV1AE NXP USA Inc
View more  Packaging: Tray
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (48 kB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912G634
250
Order

--

 568-14487-ND Datasheet
EM783-MC3E EM783-MC3E-ND EM783-MC3E NXP USA Inc
View more  Packaging: Tray
 Part Status: Obsolete
 Applications: Energy Measurement
 Core Processor: ARM Cortex-M0
 Program Memory Type: FLASH (32 kB)
 RAM Size: 8K x 8
 Interface: IC, IrDA, SPI, UART/USART
 Number of I/O: 22
 Voltage - Supply: 2.6 V ~ 3.6 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 32-VQFN Exposed Pad
 Supplier Device Package: 32-HVQFN (7x7)
1000
Order

1+:

$0

 EM783-MC3E-ND Datasheet
ASC8849ET/M2,557 ASC8849ET/M2,55
7-ND		 ASC8849ET/M2,55
7		 NXP USA Inc
View more  Packaging: Tray
 Part Status: Obsolete
 Applications: Embedded Multimedia Communication, Security and Entertainment
 Core Processor: ARM9
 Interface: EBI/EMI, Ethernet, IS, IrDA, SD/MMC, SPI, UART/USART, USB OTG
 Mounting Type: Surface Mount
 Package / Case: 484-TFBGA
 Supplier Device Package: 484-TFBGA (15x15)
 Base Part Number: ASC8849
1000
Order

1+:

$0

 ASC8849ET/M2,557-ND Datasheet
A7001CMHN1/T1AGCEL A7001CMHN1/T1AG
CEL-ND		 A7001CMHN1/T1AG
CEL		 NXP USA Inc
View more  Part Status: Active
 Applications: Authentication
 Core Processor: MX51
 Program Memory Type: EEPROM (76.4 kB)
 Controller Series: A700x
 RAM Size: 3.2kB
 Interface: IC, 2-Wire Serial
 Voltage - Supply: 1.62 V ~ 5.5 V
 Operating Temperature: -25C ~ 85C
1000
Order

2450+:

$1.2569

 A7001CMHN1/T1AGCEL-ND Datasheet
MM912F634DV2AE MM912F634DV2AE-
ND		 MM912F634DV2AE NXP USA Inc
View more  Packaging: Tray
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (32 KB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912F634
1000
Order

--

 MM912F634DV2AE-ND Datasheet
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