Osc ocxo 25mhz smd - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
MC68040RC25A-ND	MC68040RC25A	NXP USA Inc	View more Series: M680x0 Packaging: Tray Part Status: Obsolete Core Processor: 68040 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Graphics Acceleration: No Voltage - I/O: 5.0V Operating Temperature: 0C ~ 70C (TA) Package / Case: 179-BPGA Supplier Device Package: 179-PGA (47.24x47.24) Additional Interfaces: SCI, SPI Base Part Number: MC68040	1000 Order	1+: $0
MC68040FE25A-ND	MC68040FE25A	NXP USA Inc	View more Series: M680x0 Packaging: Tray Part Status: Obsolete Core Processor: 68040 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Graphics Acceleration: No Voltage - I/O: 5.0V Operating Temperature: 0C ~ 70C (TA) Package / Case: 184-BCQFP Supplier Device Package: 184-CQFP (31x31) Additional Interfaces: SCI, SPI Base Part Number: MC68040	1000 Order	1+: $0
MC68LC040RC25A- ND	MC68LC040RC25A	NXP USA Inc	View more Series: M680x0 Packaging: Tray Part Status: Obsolete Core Processor: 68040 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Graphics Acceleration: No Voltage - I/O: 5.0V Operating Temperature: 0C ~ 70C (TA) Package / Case: 179-BPGA Supplier Device Package: 179-PGA (47.24x47.24) Additional Interfaces: SCI, SPI Base Part Number: MC68LC040	1000 Order	--
MC68030CRC25C-N D	MC68030CRC25C	NXP USA Inc	View more Series: M680x0 Packaging: Tray Part Status: Obsolete Core Processor: 68030 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Graphics Acceleration: No Voltage - I/O: 5.0V Operating Temperature: -40C ~ 85C (TA) Package / Case: 128-BPGA Supplier Device Package: 128-PGA (34.55x34.55) Additional Interfaces: SCI, SPI Base Part Number: MC68030	1000 Order	--
MC68360VR25LR2- ND	MC68360VR25LR2	NXP USA Inc	View more Series: M683xx Packaging: Tape & Reel (TR) Part Status: Obsolete Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 5.0V Operating Temperature: 0C ~ 70C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68360	1000 Order	1+: $0
MC68360EM25VL-N D	MC68360EM25VL	NXP USA Inc	View more Series: M683xx Packaging: Tray Part Status: Obsolete Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 70C (TA) Package / Case: 240-BFQFP Supplier Device Package: 240-FQFP (32x32) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68360	1000 Order	1+: $0
MC68EN360CRC25L -ND	MC68EN360CRC25L	NXP USA Inc	View more Series: M683xx Packaging: Tray Part Status: Obsolete Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 5.0V Operating Temperature: -40C ~ 85C (TA) Package / Case: 241-BPGA Exposed Pad Supplier Device Package: 241-PGA (47.24x47.24) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68EN360	1000 Order	--
MC68360CRC25L-N D	MC68360CRC25L	NXP USA Inc	View more Series: M683xx Packaging: Tray Part Status: Obsolete Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 5.0V Operating Temperature: -40C ~ 85C (TA) Package / Case: 241-BPGA Exposed Pad Supplier Device Package: 241-PGA (47.24x47.24) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68360	1000 Order	1+: $0
MC68EN360EM25L- ND	MC68EN360EM25L	NXP USA Inc	View more Series: M683xx Packaging: Tray Part Status: Obsolete Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 5.0V Operating Temperature: 0C ~ 70C (TA) Package / Case: 240-BFQFP Supplier Device Package: 240-FQFP (32x32) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68EN360	1000 Order	1+: $0
MC68MH360ZQ25LR 2-ND	MC68MH360ZQ25LR 2	NXP USA Inc	View more Series: M683xx Packaging: Tape & Reel (TR) Part Status: Obsolete Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 5.0V Operating Temperature: 0C ~ 70C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68MH360	1000 Order	1+: $0
MC68360ZQ25LR2- ND	MC68360ZQ25LR2	NXP USA Inc	View more Series: M683xx Packaging: Tape & Reel (TR) Part Status: Obsolete Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 5.0V Operating Temperature: 0C ~ 70C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68360	1000 Order	1+: $0
MC68EN360CZP25L -ND	MC68EN360CZP25L	NXP USA Inc	View more Series: M683xx Packaging: Tray Part Status: Obsolete Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 5.0V Operating Temperature: -40C ~ 85C (TA) Package / Case: 357-BGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68EN360	1000 Order	--
MC68EN360EM25VL -ND	MC68EN360EM25VL	NXP USA Inc	View more Series: M683xx Packaging: Tray Part Status: Obsolete Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 70C (TA) Package / Case: 240-BFQFP Supplier Device Package: 240-FQFP (32x32) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68EN360	1000 Order	1+: $0
KMC68MH360ZP25V L-ND	KMC68MH360ZP25V L	NXP USA Inc	View more Series: M683xx Packaging: Tray Part Status: Obsolete Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 70C (TA) Package / Case: 357-BGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68MH360	1000 Order	1+: $0
MC68EN360VR25LR 2-ND	MC68EN360VR25LR 2	NXP USA Inc	View more Series: M683xx Packaging: Tape & Reel (TR) Part Status: Obsolete Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 5.0V Operating Temperature: 0C ~ 70C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68EN360	1000 Order	1+: $0
MC68360AI25VL-N D	MC68360AI25VL	NXP USA Inc	View more Series: M683xx Packaging: Tray Part Status: Not For New Designs Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 70C (TA) Package / Case: 240-BFQFP Supplier Device Package: 240-FQFP (32x32) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68360	1000 Order	24+: $61.382
MC68360ZP25VL-N D	MC68360ZP25VL	NXP USA Inc	View more Series: M683xx Packaging: Tray Part Status: Obsolete Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 70C (TA) Package / Case: 357-BGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68360	1000 Order	1+: $0
MC68EN360ZP25LR 2-ND	MC68EN360ZP25LR 2	NXP USA Inc	View more Series: M683xx Packaging: Tape & Reel (TR) Part Status: Obsolete Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 5.0V Operating Temperature: 0C ~ 70C (TA) Package / Case: 357-BGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68EN360	1000 Order	1+: $0
MC68040RC25V-ND	MC68040RC25V	NXP USA Inc	View more Series: M680x0 Packaging: Tray Part Status: Obsolete Core Processor: 68040 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Graphics Acceleration: No Voltage - I/O: 5.0V Operating Temperature: 0C ~ 70C (TA) Package / Case: 182-BEPGA Supplier Device Package: 182-PGA (47.24x47.24) Additional Interfaces: SCI, SPI Base Part Number: MC68040	60 Order	1+: $32.83
MC68M360ZP25VLR 2-ND	MC68M360ZP25VLR 2	NXP USA Inc	View more Series: M683xx Packaging: Tape & Reel (TR) Part Status: Obsolete Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 70C (TA) Package / Case: 357-BGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68M360	1000 Order	1+: $0
MC68EN360CEM25L -ND	MC68EN360CEM25L	NXP USA Inc	View more Series: M683xx Packaging: Tray Part Status: Obsolete Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 5.0V Operating Temperature: -40C ~ 85C (TA) Package / Case: 240-BFQFP Supplier Device Package: 240-FQFP (32x32) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68EN360	1000 Order	1+: $0
MC68EN360CVR25L -ND	MC68EN360CVR25L	NXP USA Inc	View more Series: M683xx Packaging: Tray Part Status: Not For New Designs Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 5.0V Operating Temperature: -40C ~ 85C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68EN360	1000 Order	44+: $61.0989
MC68EN360RC25L- ND	MC68EN360RC25L	NXP USA Inc	View more Series: M683xx Packaging: Tray Part Status: Obsolete Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 5.0V Operating Temperature: 0C ~ 70C (TA) Package / Case: 241-BPGA Exposed Pad Supplier Device Package: 241-PGA (47.24x47.24) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68EN360	1000 Order	--
MC68360VR25VL-N D	MC68360VR25VL	NXP USA Inc	View more Series: M683xx Packaging: Tray Part Status: Not For New Designs Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 70C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68360	1000 Order	--
MC68M360ZQ25VLR 2-ND	MC68M360ZQ25VLR 2	NXP USA Inc	View more Series: M683xx Packaging: Tape & Reel (TR) Part Status: Obsolete Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 70C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68M360	1000 Order	1+: $0
MC68EN360AI25VL -ND	MC68EN360AI25VL	NXP USA Inc	View more Series: M683xx Packaging: Tray Part Status: Not For New Designs Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 70C (TA) Package / Case: 240-BFQFP Supplier Device Package: 240-FQFP (32x32) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68EN360	1000 Order	24+: $68.6335
MC68MH360ZP25LR 2-ND	MC68MH360ZP25LR 2	NXP USA Inc	View more Series: M683xx Packaging: Tape & Reel (TR) Part Status: Obsolete Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 5.0V Operating Temperature: 0C ~ 70C (TA) Package / Case: 357-BGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68MH360	1000 Order	1+: $0
MC68MH360VR25VL -ND	MC68MH360VR25VL	NXP USA Inc	View more Series: M683xx Packaging: Tray Part Status: Obsolete Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 70C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68MH360	1000 Order	1+: $0
MC68360CZP25L-N D	MC68360CZP25L	NXP USA Inc	View more Series: M683xx Packaging: Tray Part Status: Obsolete Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 5.0V Operating Temperature: -40C ~ 85C (TA) Package / Case: 357-BGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68360	1000 Order	1+: $0
MC68MH360VR25L- ND	MC68MH360VR25L	NXP USA Inc	View more Series: M683xx Packaging: Tray Part Status: Obsolete Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 5.0V Operating Temperature: 0C ~ 70C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68MH360	1000 Order	1+: $0
MC68MH360ZQ25L- ND	MC68MH360ZQ25L	NXP USA Inc	View more Series: M683xx Packaging: Tray Part Status: Obsolete Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 5.0V Operating Temperature: 0C ~ 70C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68MH360	1000 Order	1+: $0
MC68360RC25L-ND	MC68360RC25L	NXP USA Inc	View more Series: M683xx Packaging: Tray Part Status: Obsolete Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 5.0V Operating Temperature: 0C ~ 70C (TA) Package / Case: 241-BPGA Exposed Pad Supplier Device Package: 241-PGA (47.24x47.24) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68360	1000 Order	1+: $0
MC68MH360EM25L- ND	MC68MH360EM25L	NXP USA Inc	View more Series: M683xx Packaging: Tray Part Status: Obsolete Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 5.0V Operating Temperature: 0C ~ 70C (TA) Package / Case: 240-BFQFP Supplier Device Package: 240-FQFP (32x32) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68MH360	1000 Order	1+: $0
MC68360ZQ25L-ND	MC68360ZQ25L	NXP USA Inc	View more Series: M683xx Packaging: Tray Part Status: Active Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 5.0V Operating Temperature: 0C ~ 70C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68360	1000 Order	88+: $46.2792
MC68360CZP25LR2 -ND	MC68360CZP25LR2	NXP USA Inc	View more Series: M683xx Packaging: Tape & Reel (TR) Part Status: Obsolete Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 5.0V Operating Temperature: -40C ~ 85C (TA) Package / Case: 357-BGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68360	1000 Order	1+: $0
KMC68EN360VR25V L-ND	KMC68EN360VR25V L	NXP USA Inc	View more Series: M683xx Packaging: Tray Part Status: Obsolete Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 70C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68EN360	1000 Order	1+: $0
MC68360ZQ25VL-N D	MC68360ZQ25VL	NXP USA Inc	View more Series: M683xx Packaging: Tray Part Status: Not For New Designs Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 70C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68360	1000 Order	44+: $59.7117
MC68360ZP25L-ND	MC68360ZP25L	NXP USA Inc	View more Series: M683xx Packaging: Tray Part Status: Obsolete Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 5.0V Operating Temperature: 0C ~ 70C (TA) Package / Case: 357-BGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68360	1000 Order	1+: $0
MC68360CAI25L-N D	MC68360CAI25L	NXP USA Inc	View more Series: M683xx Packaging: Tray Part Status: Not For New Designs Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 5.0V Operating Temperature: -40C ~ 85C (TA) Package / Case: 240-BFQFP Supplier Device Package: 240-FQFP (32x32) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68360	1000 Order	--
MC68MH360CZQ25L -ND	MC68MH360CZQ25L	NXP USA Inc	View more Series: M683xx Packaging: Tray Part Status: Obsolete Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) Voltage - I/O: 5.0V Operating Temperature: -40C ~ 85C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: SCC, SMC, SPI Base Part Number: MC68MH360	1000 Order	1+: $0

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