Osc xo 2mhz cmos th - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
880-1021-ND	XS1-L01A-LQ64-C 4-THS	XMOS	View more Series: XS1 Packaging: Tray Part Status: Active Core Processor: XCore Core Size: 32-Bit 8-Core Speed: 400MIPS Connectivity: Configurable Number of I/O: 36 Program Memory Size: 64KB (16K x 32) Program Memory Type: SRAM Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V Oscillator Type: External Operating Temperature: 0C ~ 70C (TA) Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP (10x10)	1000 Order	160+: $6.426
880-1026-ND	XS1-L02A-QF124- C5-THS	XMOS	View more Series: XS1 Packaging: Tray Part Status: Active Core Processor: XCore Core Size: 32-Bit Dual-Core Speed: 500MIPS Connectivity: Configurable Number of I/O: 84 Program Memory Size: 128KB (32K x 32) Program Memory Type: SRAM Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V Oscillator Type: External Operating Temperature: 0C ~ 70C (TA) Package / Case: 124-TFQFN Dual Rows, Exposed Pad Supplier Device Package: 124-QFN DualRow (10x10)	1000 Order	184+: $12.8805
880-1024-ND	XS1-L01A-TQ128- C5-THS	XMOS	View more Series: XS1 Packaging: Tray Part Status: Active Core Processor: XCore Core Size: 32-Bit 8-Core Speed: 500MIPS Connectivity: Configurable Number of I/O: 64 Program Memory Size: 64KB (16K x 32) Program Memory Type: SRAM Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V Oscillator Type: External Operating Temperature: 0C ~ 70C (TA) Package / Case: 128-TQFP Exposed Pad Supplier Device Package: 128-TQFP (14x14)	1000 Order	180+: $8.7287
880-1036-ND	XS1-L01A-TQ48-C 5-THS	XMOS	View more Series: XS1 Packaging: Tray Part Status: Active Core Processor: XCore Core Size: 32-Bit 8-Core Speed: 500MIPS Connectivity: Configurable Number of I/O: 28 Program Memory Size: 64KB (16K x 32) Program Memory Type: SRAM Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V Oscillator Type: External Operating Temperature: 0C ~ 70C (TA) Package / Case: 48-TQFP Exposed Pad Supplier Device Package: 48-TQFP (7x7)	1000 Order	250+: $6.318
880-1025-ND	XS1-L02A-QF124- C4-THS	XMOS	View more Series: XS1 Packaging: Tray Part Status: Active Core Processor: XCore Core Size: 32-Bit Dual-Core Speed: 400MIPS Connectivity: Configurable Number of I/O: 84 Program Memory Size: 128KB (32K x 32) Program Memory Type: SRAM Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V Oscillator Type: External Operating Temperature: 0C ~ 70C (TA) Package / Case: 124-TFQFN Dual Rows, Exposed Pad Supplier Device Package: 124-QFN DualRow (10x10)	1000 Order	184+: $12.2434
880-1022-ND	XS1-L01A-LQ64-C 5-THS	XMOS	View more Series: XS1 Packaging: Tray Part Status: Active Core Processor: XCore Core Size: 32-Bit 8-Core Speed: 500MIPS Connectivity: Configurable Number of I/O: 36 Program Memory Size: 64KB (16K x 32) Program Memory Type: SRAM Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V Oscillator Type: External Operating Temperature: 0C ~ 70C (TA) Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP (10x10)	1000 Order	160+: $7.2721
MC11E1CPBE2-ND	MC11E1CPBE2	NXP USA Inc	View more Series: HC11 Packaging: Tray Part Status: Not For New Designs Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 52-LQFP Supplier Device Package: 52-TQFP (10x10) Base Part Number: MC11E1	1000 Order	800+: $7.8287
MC68HC11E1CFN2- ND	MC68HC11E1CFN2	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68HC11	1000 Order	1+: $0
MC68HC11E0CFNE2 R-ND	MC68HC11E0CFNE2 R	NXP USA Inc	View more Series: HC11 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68HC11	1000 Order	450+: $8.0942
MC68L11D0FNE2-N D	MC68L11D0FNE2	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 26 Program Memory Type: ROMless RAM Size: 192 x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: 0C ~ 70C (TA) Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59) Base Part Number: MC68L11	1000 Order	1+: $0
MC68L11E1FNE2-N D	MC68L11E1FNE2	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: 0C ~ 70C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68L11	1000 Order	1+: $0
MC68HC11E0CFNE2 -ND	MC68HC11E0CFNE2	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Not For New Designs Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68HC11	174 Order	1+: $10.9683 10+: $10.08 100+: $8.513 500+: $7.5729
MC68HC11F1CFN2- ND	MC68HC11F1CFN2	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 30 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (25x25) Base Part Number: MC68HC11	1000 Order	--
MCHC11F1CFNE2R- ND	MCHC11F1CFNE2R	NXP USA Inc	View more Series: HC11 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 30 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (25x25) Base Part Number: MCHC11	1000 Order	250+: $8.5151
MC68L11E0FNE2-N D	MC68L11E0FNE2	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: 0C ~ 70C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68L11	1000 Order	1+: $0
MC68L11D0CFBE2- ND	MC68L11D0CFBE2	NXP USA Inc	View more Series: HC11 Packaging: Tray Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 26 Program Memory Type: ROMless RAM Size: 192 x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 44-QFP Supplier Device Package: 44-QFP (10x10) Base Part Number: MC68L11	1000 Order	--
MC68HC11E0MFNE2 -ND	MC68HC11E0MFNE2	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Not For New Designs Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68HC11	1000 Order	23+: $11.0891
MCHC11F1CFNE2-N D	MCHC11F1CFNE2	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Not For New Designs Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 30 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (25x25) Base Part Number: MCHC11	95 Order	--
MC68L11E1CFNE2- ND	MC68L11E1CFNE2	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68L11	1000 Order	1+: $0
MC68HC11E0CFN2- ND	MC68HC11E0CFN2	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68HC11	1000 Order	1+: $0
MC68HC11E9BCFNE 2-ND	MC68HC11E9BCFNE 2	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Not For New Designs Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68HC11	1000 Order	23+: $11.6849
PIC16LV54A-02/S S-ND	PIC16LV54A-02/S S	Microchip Technology	View more Series: PIC 16C Packaging: Tube Part Status: Active Core Processor: PIC Core Size: 8-Bit Speed: 2MHz Peripherals: POR, WDT Number of I/O: 12 Program Memory Size: 768B (512 x 12) Program Memory Type: OTP RAM Size: 25 x 8 Voltage - Supply (Vcc/Vdd): 2 V ~ 3.8 V Oscillator Type: External Operating Temperature: 0C ~ 70C (TA) Package / Case: 20-SSOP (0.209", 5.30mm Width) Supplier Device Package: 20-SSOP Base Part Number: PIC16LV54A	1000 Order	335+: $1.9402
MC68HC711D3CFN2 -ND	MC68HC711D3CFN2	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 26 Program Memory Size: 4KB (4K x 8) Program Memory Type: OTP RAM Size: 192 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59) Base Part Number: MC68HC711	1000 Order	--
MC68HC711E9VFN2 -ND	MC68HC711E9VFN2	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Size: 12KB (12K x 8) Program Memory Type: OTP EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68HC711	1000 Order	1+: $0
MCHLC908QT4CPE- ND	MCHLC908QT4CPE	NXP USA Inc	View more Series: HC08 Packaging: Tube Part Status: Obsolete Core Processor: HC08 Core Size: 8-Bit Speed: 2MHz Peripherals: LVD, POR, PWM Number of I/O: 5 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 4x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP Base Part Number: MCHLC908QT4	1000 Order	1+: $0
S711E20E0VFNE2- ND	S711E20E0VFNE2	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Not For New Designs Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Size: 20KB (20K x 8) Program Memory Type: OTP EEPROM Size: 512 x 8 RAM Size: 768 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.13x19.13)	1000 Order	23+: $21.9782
MC68HC711E9CFN2 -ND	MC68HC711E9CFN2	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Size: 12KB (12K x 8) Program Memory Type: OTP EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68HC711	1000 Order	1+: $0
MC711D3CFNE2RTR -ND	MC711D3CFNE2R	NXP USA Inc	View more Series: HC11 Packaging: Tape & Reel (TR) Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 26 Program Memory Size: 4KB (4K x 8) Program Memory Type: OTP RAM Size: 192 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59) Base Part Number: MC711D3	1000 Order	1+: $0
S711E20E0VFNE2R -ND	S711E20E0VFNE2R	NXP USA Inc	View more Series: HC11 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Size: 20KB (20K x 8) Program Memory Type: OTP EEPROM Size: 512 x 8 RAM Size: 768 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.13x19.13)	1000 Order	450+: $18.425
MCHLC908QY1PE-N D	MCHLC908QY1PE	NXP USA Inc	View more Series: HC08 Packaging: Tube Part Status: Obsolete Core Processor: HC08 Core Size: 8-Bit Speed: 2MHz Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 1.5KB (1.5K x 8) Program Memory Type: FLASH RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V Oscillator Type: Internal Operating Temperature: 0C ~ 70C (TA) Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP Base Part Number: MCHLC908QY1	1000 Order	1+: $0
MC68HC711E9CFU2 -ND	MC68HC711E9CFU2	NXP USA Inc	View more Series: HC11 Packaging: Tray Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Size: 12KB (12K x 8) Program Memory Type: OTP EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14) Base Part Number: MC68HC711	1000 Order	1+: $0
MC68HC711D3CFNE 2-ND	MC68HC711D3CFNE 2	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 26 Program Memory Size: 4KB (4K x 8) Program Memory Type: OTP RAM Size: 192 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59) Base Part Number: MC68HC711	1000 Order	1+: $0
MCHLC908QY1CPE- ND	MCHLC908QY1CPE	NXP USA Inc	View more Series: HC08 Packaging: Tube Part Status: Obsolete Core Processor: HC08 Core Size: 8-Bit Speed: 2MHz Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 1.5KB (1.5K x 8) Program Memory Type: FLASH RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP Base Part Number: MCHLC908QY1	1000 Order	1+: $0
MC68HC711E9MFNE 2-ND	MC68HC711E9MFNE 2	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Size: 12KB (12K x 8) Program Memory Type: OTP EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68HC711	1000 Order	1+: $0
MC68S711E9CFN2- ND	MC68S711E9CFN2	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Size: 12KB (12K x 8) Program Memory Type: OTP EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: External Operating Temperature: -40C ~ 85C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68S711	1000 Order	--
MCHLC908QT1CPE- ND	MCHLC908QT1CPE	NXP USA Inc	View more Series: HC08 Packaging: Tube Part Status: Obsolete Core Processor: HC08 Core Size: 8-Bit Speed: 2MHz Peripherals: LVD, POR, PWM Number of I/O: 5 Program Memory Size: 1.5KB (1.5K x 8) Program Memory Type: FLASH RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP Base Part Number: MCHLC908QT1	1000 Order	1+: $0
ATTINY11L-2PC-N D	ATTINY11L-2PC	Microchip Technology	View more Series: AVR ATtiny Packaging: Tube Part Status: Obsolete Core Processor: AVR Core Size: 8-Bit Speed: 2MHz Peripherals: WDT Number of I/O: 6 Program Memory Size: 1KB (512 x 16) Program Memory Type: FLASH Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: 0C ~ 70C (TA) Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP Base Part Number: ATTINY11	1000 Order	1+: $0
ATTINY11L-2SU-N D	ATTINY11L-2SU	Microchip Technology	View more Series: AVR ATtiny Packaging: Tube Part Status: Obsolete Core Processor: AVR Core Size: 8-Bit Speed: 2MHz Peripherals: WDT Number of I/O: 6 Program Memory Size: 1KB (512 x 16) Program Memory Type: FLASH Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 8-SOIC (0.209", 5.30mm Width) Supplier Device Package: 8-SOIC Base Part Number: ATTINY11	1000 Order	--
PIC16LV54AT-02/ SO-ND	PIC16LV54AT-02/ SO	Microchip Technology	View more Series: PIC 16C Packaging: Tape & Reel (TR) Part Status: Obsolete Core Processor: PIC Core Size: 8-Bit Speed: 2MHz Peripherals: POR, WDT Number of I/O: 12 Program Memory Size: 768B (512 x 12) Program Memory Type: OTP RAM Size: 25 x 8 Voltage - Supply (Vcc/Vdd): 2 V ~ 3.8 V Oscillator Type: External Operating Temperature: 0C ~ 70C (TA) Package / Case: 18-SOIC (0.295", 7.50mm Width) Supplier Device Package: 18-SOIC Base Part Number: PIC16LV54A	1000 Order	1+: $0
MCHLC908QY4CPE- ND	MCHLC908QY4CPE	NXP USA Inc	View more Series: HC08 Packaging: Tube Part Status: Obsolete Core Processor: HC08 Core Size: 8-Bit Speed: 2MHz Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 4x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP Base Part Number: MCHLC908QY4	1000 Order	1+: $0

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