Programmable modulator ic - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
M2S010T-VF400I- ND	M2S010T-VF400I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 195	1000 Order	90+: $26.7422
M2S025TS-1VF400 -ND	M2S025TS-1VF400	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207	1000 Order	90+: $50.3243
M2S050T-VF400I- ND	M2S050T-VF400I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207	1000 Order	90+: $67.657
M2S060T-1FG484I -ND	M2S060T-1FG484I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267	1000 Order	60+: $82.6973
M2S060TS-1FG676 -ND	M2S060TS-1FG676	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27) Number of I/O: 387	1000 Order	40+: $86.8616
M2S005-1TQ144-N D	M2S005-1TQ144	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Last Time Buy Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 64KB Peripherals: DDR Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 5K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20) Number of I/O: 84	1000 Order	60+: $11.4801
M2S005S-VFG256- ND	M2S005S-VFG256	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 64KB Peripherals: DDR Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 5K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: 161	1000 Order	119+: $11.7258
1100-1226-ND	M2S050T-VFG400	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207 Base Part Number: M2S050T	1000 Order	90+: $62.3153
M2S010TS-1FGG48 4M-ND	M2S010TS-1FGG48 4M	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -55C ~ 125C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 233	1000 Order	60+: $69.317
M2S060T-FG676-N D	M2S060T-FG676	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27) Number of I/O: 387	1000 Order	40+: $69.4909
M2S090TS-1FG484 M-ND	M2S090TS-1FG484 M	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: -55C ~ 125C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267	1000 Order	60+: $285.667
M2S150T-1FCG115 2M-ND	M2S150T-1FCG115 2M	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: -55C ~ 125C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35) Number of I/O: 574	1000 Order	1+: $0
1100-1222-ND	M2S025T-VFG400	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207 Base Part Number: M2S025T	1000 Order	90+: $41.669
M2S060-1FG676-N D	M2S060-1FG676	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27) Number of I/O: 387	1000 Order	40+: $72.3863
M2S090-1FCSG325 I-ND	M2S090-1FCSG325 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 325-TFBGA Supplier Device Package: 325-BGA (11x11) Number of I/O: 180	1000 Order	176+: $86.1917
M2S050TS-FGG896 I-ND	M2S050TS-FGG896 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31) Number of I/O: 377	1000 Order	27+: $92.085
M2S150-FCSG536I -ND	M2S150-FCSG536I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 536-LFBGA Supplier Device Package: 536-BGA (16x16) Number of I/O: 293	1000 Order	90+: $192.181
M2S010-1VF400I- ND	M2S010-1VF400I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 195 Base Part Number: M2S010	1000 Order	90+: $27.7301
M2S010T-1FG484I -ND	M2S010T-1FG484I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 233 Base Part Number: M2S010T	1000 Order	60+: $33.1884
M2S060-1FG484-N D	M2S060-1FG484	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267	1000 Order	60+: $68.9088
M2S060-1FGG484- ND	M2S060-1FGG484	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267	1000 Order	60+: $68.9088
M2S150T-1FCSG53 6-ND	M2S150T-1FCSG53 6	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 536-LFBGA Supplier Device Package: 536-BGA (16x16) Number of I/O: 293	1000 Order	90+: $207.556
M2S150TS-FC1152 I-ND	M2S150TS-FC1152 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35) Number of I/O: 574	1000 Order	24+: $228.403
1100-1153-ND	M2S050T-FG896	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 896-FBGA Supplier Device Package: 896-FBGA (31x31) Number of I/O: 377 Base Part Number: M2S050	1000 Order	1+: $0
M2S010-TQG144I- ND	M2S010-TQG144I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20) Number of I/O: 84	1000 Order	60+: $20.2608
M2S025T-FG484-N D	M2S025T-FG484	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267 Base Part Number: M2S025T	1000 Order	60+: $46.4148
PCM16YL0-ND	PCM16YL0	Microchip Technology	View more Part Status: Obsolete Accessory Type: Processor Module For Use With/Related Products: ICE2000	1000 Order	1+: $0
PCM18XH2-ND	PCM18XH2	Microchip Technology	View more Part Status: Obsolete Accessory Type: Processor Module For Use With/Related Products: ICE2000	1000 Order	1+: $0
544-2278-ND	EPM3064ATI100-1 0N	Intel FPGAs/Altera	View more Series: MAX 3000A Packaging: Tray Part Status: Obsolete Programmable Type: In System Programmable Delay Time tpd(1) Max: 10.0ns	1000 Order	--
1530-1018-2-ND	A2135-H	Maestro Wireless Solutions	View more Series: SiRFstarIV Packaging: Tape & Reel (TR) Part Status: Obsolete Frequency: 1.575GHz Sensitivity: -163dBm Modulation or Protocol: GPS Applications: General Purpose Current - Receiving: 36mA Data Interface: IC, SPI Antenna Connector: On-Board, Patch Voltage - Supply: 3.3V Operating Temperature: -40C ~ 85C Package / Case: Module Supplier Device Package: Module	1000 Order	1+: $0
JF2-B3A6-DR-ND	JF2-B3A6-DR	Telit	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Frequency: 1.575GHz Sensitivity: -163dBm Modulation or Protocol: GPS Applications: General Purpose Current - Receiving: 37mA Data Interface: IC, UART, SPI, 1PPS Memory Size: 1.25M (64K x 20)(128K x 10) Antenna Connector: On-Board, Trace Voltage - Supply: 1.79 ~ 1.9VDC Operating Temperature: -40C ~ 85C Package / Case: Module Supplier Device Package: Module	1000 Order	1+: $0
GS2000D1-124-10 0-ND	GS2000D1-124-10 0	GainSpan Corporation	View more Part Status: Active Type: TxRx + MCU RF Family/Standard: WiFi Frequency: 2.4GHz Data Rate (Max): 54Mbps Serial Interfaces: IC, IS, SPI, UART Operating Temperature: -40C ~ 85C	1000 Order	100+: $6.552
GS2000D1-68-100 -ND	GS2000D1-68-100	GainSpan Corporation	View more Series: * Part Status: Active Type: TxRx + MCU RF Family/Standard: WiFi Frequency: 2.4GHz Data Rate (Max): 54Mbps Serial Interfaces: IC, IS, SPI, UART Operating Temperature: -40C ~ 85C	1000 Order	100+: $9.6075
GS2000D1-124-ND	GS2000D1-124	GainSpan Corporation	View more Part Status: Active Type: TxRx + MCU RF Family/Standard: WiFi Frequency: 2.4GHz Data Rate (Max): 54Mbps Serial Interfaces: IC, IS, SPI, UART Operating Temperature: -40C ~ 85C	1000 Order	12480+: $7.56
GS2000D1-68-ND	GS2000D1-68	GainSpan Corporation	View more Series: * Part Status: Active Type: TxRx + MCU RF Family/Standard: WiFi Frequency: 2.4GHz Data Rate (Max): 54Mbps Serial Interfaces: IC, IS, SPI, UART Operating Temperature: -40C ~ 85C	1000 Order	12480+: $4.6872
HMC137-ND	HMC137	Analog Devices Inc.	View more Packaging: Bulk Part Status: Obsolete Function: Modulator RF Frequency: 6GHz ~ 11GHz P1dB: 8dBm Current - Supply: 5mA Test Frequency: 6GHz ~ 11GHz Package / Case: Die	1000 Order	1+: $0
HMC135-ND	HMC135	Analog Devices Inc.	View more Packaging: Bulk Part Status: Obsolete Function: Modulator RF Frequency: 1.8GHz ~ 5.2GHz P1dB: 8dBm Current - Supply: 5mA Test Frequency: 1.8GHz ~ 5.2GHz Package / Case: Die	1000 Order	1+: $0
HMC136-ND	HMC136	Analog Devices Inc.	View more Packaging: Bulk Part Status: Obsolete Function: Modulator RF Frequency: 4GHz ~ 8GHz P1dB: 8dBm Current - Supply: 5mA Test Frequency: 4GHz ~ 8GHz Package / Case: Die	1000 Order	1+: $0
1127-2527-ND	HMC1093-SX	Analog Devices Inc.	View more Packaging: Bulk Part Status: Active Frequency: 37GHz ~ 46.5GHz Number of Mixers: 1 Current - Supply: 160mA Voltage - Supply: 3V Package / Case: Module Supplier Device Package: Module Base Part Number: HMC1093	8 Order	2+: $72.6327 10+: $69.1986
725-OP-ND	725-OP		View more Packaging: Bulk Part Status: Active Function: Output Add-On Module Package / Case: Module Supplier Device Package: Module	2 Order	1+: $46.4121 10+: $43.2747 100+: $37.6301

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