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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
10AS032H2F35E1S G-ND	10AS032H2F35E1S G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 320K Logic Elements Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35) Number of I/O: 384	1000 Order	1+: $0
XCZU3CG-1SFVC78 4I-ND	XCZU3CG-1SFVC78 4I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 154K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23) Number of I/O: 252	1000 Order	1+: $293.202
XCZU17EG-2FFVD1 760E-ND	XCZU17EG-2FFVD1 760E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 926K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5) Number of I/O: 308	1000 Order	1+: $3.78
10AS032E1F27I1H G-ND	10AS032E1F27I1H G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 320K Logic Elements Operating Temperature: -40C ~ 100C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27) Number of I/O: 240	1000 Order	3+: $0.63
10AS057K2F35E1H G-ND	10AS057K2F35E1H G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 570K Logic Elements Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35) Number of I/O: 396	1000 Order	3+: $1.89
5CSXFC6D6F31I7N ES-ND	5CSXFC6D6F31I7N ES	Intel FPGAs/Altera	View more Series: Cyclone V SX Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 110K Logic Elements Operating Temperature: -40C ~ 100C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31) Number of I/O: MCU - 181, FPGA - 288 Base Part Number: 5CSXFC6	1000 Order	1+: $0
10AS066N2F40E1S G-ND	10AS066N2F40E1S G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 660K Logic Elements Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40) Number of I/O: 588	1000 Order	1+: $0
10AS027H2F34I1S G-ND	10AS027H2F34I1S G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 270K Logic Elements Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35) Number of I/O: 384	1000 Order	1+: $0
XCZU17EG-2FFVB1 517E-ND	XCZU17EG-2FFVB1 517E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 926K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40) Number of I/O: 644	1000 Order	--
10AS032H1F34I1H G-ND	10AS032H1F34I1H G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 320K Logic Elements Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35) Number of I/O: 384	1000 Order	3+: $1.26
10AS057K2F40E1S G-ND	10AS057K2F40E1S G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 570K Logic Elements Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40) Number of I/O: 696	1000 Order	1+: $0
XCZU2EG-L2SFVA6 25E-ND	XCZU2EG-L2SFVA6 25E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 103K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21) Number of I/O: 180	1000 Order	1+: $274.365
XCZU3CG-2SFVC78 4E-ND	XCZU3CG-2SFVC78 4E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 154K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23) Number of I/O: 252	1000 Order	--
XCZU4EV-L1SFVC7 84I-ND	XCZU4EV-L1SFVC7 84I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EV Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 192K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23) Number of I/O: 252	1000 Order	--
XCZU7EV-1FFVC11 56I-ND	XCZU7EV-1FFVC11 56I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EV Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35) Number of I/O: 360	1000 Order	1+: $1.89
XCZU6EG-L2FFVB1 156E-ND	XCZU6EG-L2FFVB1 156E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 469K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35) Number of I/O: 328	1000 Order	1+: $1.89
10AS027E2F27E1H G-ND	10AS027E2F27E1H G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 270K Logic Elements Operating Temperature: 0C ~ 100C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27) Number of I/O: 240	1000 Order	3+: $0.63
10AS022E3F27I1S G-ND	10AS022E3F27I1S G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 220K Logic Elements Operating Temperature: -40C ~ 100C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27) Number of I/O: 240	1000 Order	1+: $0
XC7Z030-3FBG676 E-ND	XC7Z030-3FBG676 E	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1GHz Primary Attributes: Kintex-7 FPGA, 125K Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27) Number of I/O: 130 Base Part Number: XC7Z030	1000 Order	--
XCZU19EG-3FFVB1 517E-ND	XCZU19EG-3FFVB1 517E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 667MHz, 1.5GHz Primary Attributes: ZynqUltraScale+ FPGA, 1143K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40) Number of I/O: 644	1000 Order	1+: $4.41
5CSEBA5U23I7SN- ND	5CSEBA5U23I7SN	Intel FPGAs/Altera	View more Series: Cyclone V SE Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Single ARM Cortex-A9 MPCore with CoreSight RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 85K Logic Elements Operating Temperature: -40C ~ 100C (TJ) Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23) Number of I/O: MCU - 181, FPGA - 145 Base Part Number: 5CSEBA5	1000 Order	60+: $100.996
5CSEMA6U23C7N-N D	5CSEMA6U23C7N	Intel FPGAs/Altera	View more Series: Cyclone V SE Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 110K Logic Elements Operating Temperature: 0C ~ 85C (TJ) Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23) Number of I/O: MCU - 181, FPGA - 145 Base Part Number: 5CSEMA6	1000 Order	60+: $133.15
5ASXBB5D4F40C6N -ND	5ASXBB5D4F40C6N	Intel FPGAs/Altera	View more Series: Arria V SX Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 700MHz Primary Attributes: FPGA - 462K Logic Elements Operating Temperature: 0C ~ 85C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40) Number of I/O: MCU - 208, FPGA - 540 Base Part Number: 5ASXBB5	1000 Order	1+: $0
122-2012-ND	XC7Z007S-1CLG40 0I	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Single ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Artix-7 FPGA, 23K Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 400-LFBGA, CSPBGA Supplier Device Package: 400-CSPBGA (17x17) Number of I/O: 100	172 Order	--
122-2010-ND	XC7Z014S-1CLG40 0C	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Single ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Artix-7 FPGA, 65K Logic Cells Operating Temperature: 0C ~ 85C (TJ) Package / Case: 400-LFBGA, CSPBGA Supplier Device Package: 400-CSPBGA (17x17) Number of I/O: 125	54 Order	1+: $56.007
122-2190-ND	XC7Z015-1CLG485 I	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Artix-7 FPGA, 74K Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-LFBGA, CSPBGA Supplier Device Package: 485-CSBGA (19x19) Number of I/O: 130	500 Order	1+: $36.11
122-2000-ND	XC7Z007S-2CLG22 5E	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Single ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 766MHz Primary Attributes: Artix-7 FPGA, 23K Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 225-LFBGA, CSPBGA Supplier Device Package: 225-CSPBGA (13x13) Number of I/O: 54	160 Order	1+: $36.7794
XCZU7EG-1FFVF15 17I-ND	XCZU7EG-1FFVF15 17I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40) Number of I/O: 464	1000 Order	1+: $1.89
XCZU6EG-3FFVB11 56E-ND	XCZU6EG-3FFVB11 56E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: ZynqUltraScale+ FPGA, 469K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35) Number of I/O: 328	1000 Order	1+: $2.52
XCZU11EG-1FFVC1 760I-ND	XCZU11EG-1FFVC1 760I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 653K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5) Number of I/O: 512	1000 Order	--
XCZU15EG-L2FFVB 1156E-ND	XCZU15EG-L2FFVB 1156E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 747K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35) Number of I/O: 328	1000 Order	--
5CSXFC4C6U23C7N -ND	5CSXFC4C6U23C7N	Intel FPGAs/Altera	View more Series: Cyclone V SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 40K Logic Elements Operating Temperature: 0C ~ 85C (TJ) Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23) Number of I/O: MCU - 181, FPGA - 145	1000 Order	--
10AS066H1F34I1H G-ND	10AS066H1F34I1H G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 660K Logic Elements Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35) Number of I/O: 492	1000 Order	3+: $2.52
XC7Z030-L2SBG48 5I-ND	XC7Z030-L2SBG48 5I	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex-7 FPGA, 125K Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-FBGA Supplier Device Package: 485-FBGA (19x19) Number of I/O: 130	1000 Order	1+: $240.786
XCZU11EG-L2FFVB 1517E-ND	XCZU11EG-L2FFVB 1517E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 653K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40) Number of I/O: 488	1000 Order	1+: $2.52
10AS032E2F29I1H G-ND	10AS032E2F29I1H G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 320K Logic Elements Operating Temperature: -40C ~ 100C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29) Number of I/O: 360	1000 Order	3+: $0.63
10AS066N2F40I2L G-ND	10AS066N2F40I2L G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 660K Logic Elements Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40) Number of I/O: 588	1000 Order	3+: $3.15
10AS032H1F35E1S G-ND	10AS032H1F35E1S G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 320K Logic Elements Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35) Number of I/O: 384	1000 Order	1+: $0
122-1905-ND	XC7Z015-1CLG485 C	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Artix-7 FPGA, 74K Logic Cells Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-LFBGA, CSPBGA Supplier Device Package: 485-CSBGA (19x19) Number of I/O: 130	150 Order	1+: $49.25
122-1888-ND	XC7Z030-2FFG676 I	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex-7 FPGA, 125K Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27) Number of I/O: 130 Base Part Number: XC7Z030	139 Order	--

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