| Allicdata Part #: | XCZU11EG-1FFVC1760I-ND |
| Manufacturer Part#: |
XCZU11EG-1FFVC1760I |
| Price: | $ 0.00 |
| Product Category: | Integrated Circuits (ICs) |
| Manufacturer: | Xilinx Inc. |
| Short Description: | IC FPGA 512 I/O 1760FCBGA |
| More Detail: | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dua... |
| DataSheet: |  XCZU11EG-1FFVC1760I Datasheet/PDF |
| Quantity: | 1000 |
| Series: | Zynq® UltraScale+™ MPSoC EG |
| Packaging: | Tray |
| Part Status: | Active |
| Architecture: | MCU, FPGA |
| Core Processor: | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size: | -- |
| RAM Size: | 256KB |
| Peripherals: | DMA, WDT |
| Connectivity: | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed: | 500MHz, 600MHz, 1.2GHz |
| Primary Attributes: | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells |
| Operating Temperature: | -40°C ~ 100°C (TJ) |
| Package / Case: | 1760-BBGA, FCBGA |
| Supplier Device Package: | 1760-FCBGA (42.5x42.5) |
| Number of I/O: | 512 |
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XCZU11EG-1FFVC1760I is an advanced system-on-chip (SoC) developed by Xilinx for demanding embedded applications such as smart appliances, security systems, robotics, automotive and industrial automation. The XCZU11EG-1FFVC1760I is based on Xilinx Ultrascale+ technology, which is designed to deliver the ultimate performance and scalability for embedded applications.
The XCZU11EG-1FFVC1760I offers a powerful combination of high-performance processors and architecture, including: dual-core ARM Cortex-A53 application processors, powerful floating point / vector unit, programmable logic, FPGA-based architectures, and more. The XCZU11EG-1FFVC1760I also integrates a rich set of peripherals, including Ethernet, USB, UART, GPIO and other communication interfaces for connection to external devices.
The XCZU11EG-1FFVC1760I is designed to provide embedded systems with highly integrated and low-power solutions. The XCZU11EG-1FFVC1760I is suitable for embedded applications with AI, machine learning, image processing and control applications, which require high computation resources and low power consumption.
The XCZU11EG-1FFVC1760I is designed to achieve performance and scalability by integrating a range of features such as advanced low-power consumption, high-performance processing, programmability and scalability, multi-processor support, multiple memories, and a wide range of communication interfaces. Plus, the XCZU11EG-1FFVC1760I is designed to provide the highest levels of performance, scalability and flexibility, enabling developers to quickly and easily develop embedded systems with the latest technology.
The XCZU11EG-1FFVC1760I\'s working principle is to enable a wide range of applications by combining the advantages of both hardware and software. The hardware portion of the chip contains a myriad of transistors, interconnects and memories, as well as analog, digital, and storage elements. The software element is formed of embedded programs, which are carefully designed to manipulate the hardware elements for optimal performance. The combination of hardware and software allows developers to create highly-customized applications that take advantage of each component\'s unique features.
In the embedded platform, the XCZU11EG-1FFVC1760I\'s application field ranges from consumer applications such as home automation, security systems, robotics to industrial and automotive applications, such as factory automation, driver assistance and process control. The XCZU11EG-1FFVC1760I\'s integrated functions and features allow developers to create highly specialized applications that can meet the demanding requirements of such applications.
The XCZU11EG-1FFVC1760I is a perfect solution for customers looking for ultra-high performance, low-power, scalability and flexibility. It offers the most advanced technologies and solutions for embedded systems, from consumer to industrial applications. It is designed specifically to meet the needs of the embedded market and its highly integrated features allow developers to quickly and easily build embedded applications with the latest technologies.
The specific data is subject to PDF, and the above content is for reference
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