XCZU19EG-3FFVB1517E Allicdata Electronics
Allicdata Part #:

XCZU19EG-3FFVB1517E-ND

Manufacturer Part#:

XCZU19EG-3FFVB1517E

Price: $ 4.85
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: IC FPGA 644 I/O 1517FCBGA
More Detail: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dua...
DataSheet: XCZU19EG-3FFVB1517E datasheetXCZU19EG-3FFVB1517E Datasheet/PDF
Quantity: 1000
1 +: $ 4.41000
Stock 1000Can Ship Immediately
$ 4.85
Specifications
Series: Zynq® UltraScale+™ MPSoC EG
Packaging: Tray 
Part Status: Active
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: --
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 667MHz, 1.5GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)
Number of I/O: 644
Description

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XCZU19EG-3FFVB1517E is a highly capable system-on-chip (SoC) developed by Xilinx. It is one of the first devices to offer major new improvements in terms of power efficiency and enhanced user experience. It is an integrated, highly capable processor that is suitable for many applications and offers improved performance, flexibility, and power efficiency; it is ideal for embedded applications in which stringent requirements exist.

The XCZU19EG-3FFVB1517E is a highly capable SoC embedded in a single-core, 16nm FinFET package that can reach up to 1.3GHz with up to 8GBytes of dedicated DDR4-2400 RAM. It is capable of performing multiple tasks and uses advanced technologies such as multi-core scalability, virtualization, embedded system diagnostics, and hardware-accelerated encryption. The integrated multi-core ARM Cortex-A53 processor, together with the GPU, provide perfect solutions for multimedia, gaming, and other high-end applications.

In terms of application field, the XCZU19EG-3FFVB1517E is widely used in embedded systems such as industrial automation, home automation, robotics, healthcare, and home appliances. It can also be used for automotive, digital signage, debuggers, network optimization, security systems, and medical imaging applications. With its rich feature set and flexible memory architecture, the XCZU19EG-3FFVB1517E is well suited for low-cost and power-sensitive embedded systems.

As for the working principle of the XCZU19EG-3FFVB1517E, it is based on a system-on-chip (SoC) architecture. This type of microcontroller is extremely efficient and offers maximum performance with minimum power consumption. The SoC architecture combines a microcontroller with various peripheral components such as the memory controllers, processor cores, and peripherals on one chip. This allows designers to create complex solutions quickly and easily without having to spend time and resources on multiple components or systems.

The XCZU19EG-3FFVB1517E is protected by enhanced security measures, making it highly secure. It includes secure boot, secure storage, trusted execution environment, and secure debug. These secure technologies ensure that sensitive applications and data are protected against malicious attacks and unauthorized access.

In conclusion, the XCZU19EG-3FFVB1517E is an ideal system-on-chip (SoC) for embedded applications. It offers advanced features and powerful performance in a single-core, 16nm FinFET package. Its wide array of applications and secure measures make it a great choice for both industrial and home applications. Its efficient and low-power design makes it suitable for both power-sensitive and cost-sensitive settings.

The specific data is subject to PDF, and the above content is for reference

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