Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The QB0505A25ESTD is an aluminum heatsink that is designed for optimized thermal performance and durability for the purposes of System-in-Package (SiP) configurations. Developed to be a reliable and cost effective solution, the QB0505A25ESTD provides efficient cooling efficiency in both industrial and consumer applications. The unit is designed with a base of 8.6mm and 15.2mm high, offering improved cooling performance compared to a conventional aluminum type. It has a unique fin design for low-pressure drop and a high surface area for better heat dissipation. It also has two high quality spring clips to ensure secure installation and is RoHS compliant for use in high-reliability products.The QB0505A25ESTD is an ideal solution for applications where temperatures can reach up to 125°C (257°F). Typical applications include transceivers, amplifiers, processors, motherboards, and storage drives. It is also a popular choice for embedded or industrial systems, such as medical electronics and automotive applications. The unit is designed for easy installation and offers thermal performance with low thermal resistance that enables efficient operation with less airflow.The working principle of the QB0505A25ESTD is based on the convection of heat, which is the natural transfer of heat between two bodies that are at different temperatures. This is done through a combination of natural convection, conduction, and radiation. The natural convection of air helps the thermal performance of the heatsink by transporting heat away from the device through air. The conductiontransfer of heat occurs between the heatsink and ambient air surrounding the device, while the radiation of heat takes place between the two bodies.The QB0505A25ESTD provides a high level of efficiency, which increases the performance of SiP packages by dissipating heat away from the components. This allows for higher heat dissipation, keeping the component temperatures regulated and preventing any potential system failures due to excessive temperatures. Additionally, the unit offers superior reliability given its robust build and the unique fin design which ensure long-lasting usage. The unit is also compact, so it can fit into tight spaces, making it ideal for various types of applications.
The specific data is subject to PDF, and the above content is for reference