QB0505B25ESS3

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Thermal-heat sinks are used in a variety of electronic devices and applications to dissipate and manage temperature. The QB0505B25ESS3 thermal-heat sink is designed to provide exceptional thermal-management and reliability in demanding conditions.

The QB0505B25ESS3 is a medium-sized thermal-heat sink which provides excellent performance for applications such as LED lighting, ICs, transistors, and other microelectronics. It has a profile height of 5mm and is made from aluminum alloy which provides excellent thermal conduction. It has numerous slots on its surface which improve the efficiency for air flow to the heat sink, and its 25mm x 25mm baseplate ensures a secure mounting to the device or system board. Additionally, the QB0505B25ESS3 features a copper alloy base-plate to improve the thermal performance of the device, allowing for efficient thermal dissipation and improved system reliability.

The working principle for the QB0505B25ESS3 thermal-heat sink is based on heat dissipation. Heat is produced by the heated electronic components and is dissi- pated through the heat sink. This is achieved by transferring the heat away from the component and dissipating it through the aluminum alloy and copper alloybase plates and design of the heat sink which can efficiently transfer it away from the component with minimal heat.

The QB0505B25ESS3 is designed for applications which require efficient cooling and thermal-management. In these application items such as LED fixtures, ICs, transistors, motor controllers and other microelectronics require reliable and efficient cooling to maximize their performance and reliability. In addition, the QB0505B25ESS3 is designed with silver anodized surfaces which can maximize the heat dissipation and ensure the surface of the heat sink remains cool.

In summary, the QB0505B25ESS3 thermal-heat sink is a highly efficient and reliable device for dissipating and managing heat in a variety of electronic applications and devices. Its 25mm x 25mm baseplate and 5mm height profile ensure a secure installation into several applications and its robust aluminum and copper alloy construction ensure reliable performance and efficient thermal-management.

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