QB0505B25ESTD Allicdata Electronics
Allicdata Part #:

QB0505B25ESTD-ND

Manufacturer Part#:

QB0505B25ESTD

Price: $ 1.57
Product Category:

Fans, Thermal Management

Manufacturer: American Technical Ceramics
Short Description: THERMAL CONDUCTOR Q-BRIDGE
More Detail: Heat Director/Transfer For 0505 Package
DataSheet: QB0505B25ESTD datasheetQB0505B25ESTD Datasheet/PDF
Quantity: 1000
1000 +: $ 1.41120
Stock 1000Can Ship Immediately
$ 1.57
Specifications
Accessory Type: Heat Director/Transfer
For Use With/Related Products: 0505 Package
Series: Q-Bridge
Part Status: Active
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are devices that are used to dissipate excess heat from the interior of an electrical device. The QB0505B25ESTD is a type of heat sink specifically designed for use with high-power computer processors and power electronics. It is capable of cooling these components with higher levels of efficiency than many other available solutions.

This heat sink consists of an aluminum body with an array of heatpipe elements, a fan on top, and a metallic base. Its fans can be adjusted to provide different levels of cooling power, depending on the needs of the user. The fins on the heat sink are designed to provide maximum thermal energy transfer, dispersing heat quickly away from the heat source.

The body of the heat sink is made of aluminum, providing a lightweight option for cooling large components. The aluminum construction also allows it to provide efficient heat transfer, since aluminum is an excellent conductor of thermal energy. Additionally, the aluminum can be painted or coated to further enhance its performance.

The metal base on the QB0505B25ESTD is designed to facilitate the mounting and removal of the heat sink. This base has several holes and tapped holes, allowing the user to affix the heat sink to a variety of surfaces, such as circuit boards and other metal surfaces. Additionally, the base helps to ensure proper thermal contact between the heat sink and other components.

The QB0505B25ESTD’s most significant feature is its heatpipe elements. These elements are made of copper, copper or aluminum, depending on the requirements of the project. The pipes help to rapidly move heat away from the source, optimally cooling the heat source. The heatpipe elements are also maximized for an optimal level of thermal transfer, with each pipe having its own layer of thermal grease for efficient heat transfer.

The fan on top of the QB0505B25ESTD is designed to provide a good balance of airflow and noise levels. This fan helps to supplement the heatpipe elements, providing additional cooling power when needed. Additionally, the fan’s speed can be adjusted to provide the most efficient cooling performance for any given situation.

The QB0505B25ESTD is a highly efficient heat sink, capable of cooling computer processors, power electronics and other components with great efficacy. Its design is optimized to provide multiple levels of cooling power, and its aluminum body makes it lightweight and durable. The base and heatpipe elements provide efficient thermal transfer, and the fan helps to supplement the cooling power when needed. As such, it is an ideal solution for cooling a variety of different components.

The specific data is subject to PDF, and the above content is for reference

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