What are MEMS semiconductor components?
MEMS is developed with the development of semiconductor integrated circuit micro-processing technology and ultra-precision machining technology. At present, MEMS processing technology is also widely used in fields such as microfluidic chips and synthetic biology, so as to conduct biochemistry and other laboratories. Chip integration of technical processes. MEMS components can be divided into the following:
1. Micro-machined high-Q inductor
body micro-machining reduces the parasitic effects of traditional on-chip planar inductors, which usually reduce the quality factor (Q) of the inductor.
The figure shows an example of a bulk micromechanical sensor, in which the substrate has been removed from below the spiral track. At frequencies of 6 to 18 GHz, the measured Qs range from 6 to 28. A typical inductor diagram shows an example of using a machine to manufacture a solenoid inductor.
Similarly, machining is also used to produce solenoid-like inductors on the substrate. Figure 5 shows an example of this method. When the quality factor is 2.8 GHz, an inductance with a quality factor of 2.8 GHz is obtained.
There are mainly two types of MEMS-based varactor diodes: parallel plate and interdigital capacitor. Some variants of the above types have also been proven.
In the parallel (two or three) plate method, the top plate is kept at a certain distance from the bottom plate by a suspension spring, and the distance varies with the electrostatic force between the plates caused by the applied voltage
In the interdigital method, the effective area of the capacitor is changed by changing the degree of engagement of the fingers of the comb plate. Comb-drive type actuators use this method.
3. MEMS switch
MEMS switch has low insertion loss, high isolation and high linearity. Many switches, based on some driving mechanisms and topologies, have been proven. These include electrostatic, piezoelectric, thermal, magnetic, bimetal (shape memory alloy).
Using MEMS can approach the performance level of macroscopic waveguide resonators. As an example, a micromachined cavity resonator used in the X-band has an unloaded Q of 506 for a cavity with a size of 16×32×0.465 mm. This is only 3.8% lower than the no-load Q value obtained from a rectangular cavity of the same size
5. Micromechanical resonator
The mechanical resonator can display Q in the range of 10000-25000. Micromechanical resonators can also use vertical displacement resonators to achieve this. In vertical displacement resonators, the cantilever beam is set up as a diving board-like vertical vibration in response to electrostatic excitation; while the lateral displacement resonator moves through Excite the comb structure to excite. For higher frequencies, a film bulk acoustic resonator (FBAR) can be used, which consists of a layer of piezoelectric material.
6. Micro mechanical gear
The figure shows that the output gear of the electrostatic micro engine is coupled to a two-stage gear transmission system to drive the rack and pinion slider. This is manufactured using Sandia's superplanar multilayer MEMS technology (SUMMiT).
7. MEMS rotating electric machine
Using a multi-user MEMS process, an electrostatic rotating motor was made.
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