Increasing Market Demands Promote Innovation of Power Connector Technology

Last Update Time: 2018-12-29 11:39:12

The growing demand for telecommunications, data, industrial, instrumentation, and medical device performance is driving connector designs toward smaller spaces and more power signals. Maximizing linear current density means greater power, and the connector has a smaller footprint and advanced features. These characteristics are the result of rapid changes and growing demand for the overall design of the above market segments.

Smaller and More Portable Terminal Products

The shape of the device is constantly becoming more and more simple according to the established rules, and the terminal products are becoming more compact. Component manufacturers need to design a more compact package. However, as the number of processors, memories, and other integrated circuits continues to grow within the system, more heat is generated, making thermal management very important in system design. For power connector manufacturers, these factors present many unique challenges. Today, our goal is to provide a smaller package while meeting growing power requirements. Parts with smaller heights and widths not only provide more space for placing additional components, but also provide better airflow. For example, replacing rack-mounted servers in data centers with dense blade servers shows the industry's trend toward smaller sizes. Running these more compact systems requires higher power density and signal density.

HCI Connector

Power connector manufacturers need to focus on current density, profile height and width, and airflow, as the increased number of processors in a single system can result in a net increase in power consumption when the processor becomes more efficient and consumes less power. In addition, higher rack densities and higher wattage power supplies require connector solutions with higher power density.

High Current Application

Connector manufacturers install power connectors with high power density on standard, high-efficiency, low-cost stamped power contact bases. Stamping technology makes it possible to achieve high power density. In high current applications, this high-efficiency, low-cost technology can replace expensive screw machine contacts. The high conductivity copper alloy incorporation, optimized power contact design, and vented housing enhance device performance to meet and exceed current high current applications.

Backplane-to-card applications are another trend toward higher power density (eg, mid-plane to blade or control card interface). In high speed applications, it is very beneficial to combine power output performance with a signal connector. In the backplane and quadrature mid-plane application versions, a signal/power connector using unshielded technology (for enhanced signal density) is a product that uses this technology. In a single enclosure, this high speed/high power combination connector allows signal and power "integrated lead-frame assembly" (IMLA) to be mixed in the same connector, providing flexible pin-outs in 3D Maximum signal density and power density are obtained in space. This solution meets the system designer's requirements for thermal, mechanical, and high speed aspects of a single configurable product, eliminating the need for new tools or longer development cycles.

 

In some backplane-to-card applications, the proliferation of power requirements has resulted in the use of a single stand-alone power connector adjacent to the high-speed signal connector. For these applications, modularity will be used for high-speed plug-and-play connectors, signal connectors, power connectors, and other types of connectors. Connector manufacturers have designed a stacked component, the power connector, that is superimposed on the other backplane-to-card connector to support an end-to-end overlay solution. These products provide flexibility for high-speed modules and power modules to be stacked adjacent to each other along the edge of the board.

 

Allicdata Electronic specialize in the production of power connectors ,backplane connectors, card edge connectors,circular connectors,rectangular connectors, d-shaped connectors,ffc, fpc flat flexible connectors heavy duty connectors,etc.

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