The surface components welding points

Last Update Time: 2019-01-15 13:25:53

1. Requirements

 

1)strict control of the heating temperature and time;

 

2)Do not overexert when welding;

 

3)Suction to remove the solder on the solder joint.

 

2. Intermittent heating and welding

( 1 ) Disassembly of small components

 

1)will be fixed line, carefully observe the location of the small components to be removed.

 

2)clean the impurities around the small components, add a little rosin water.

 

3)adjust the hot air gun temperature 270, wind speed in 1 ~ 2 block.

 

4)distance small components 2 ~ 3 cm, even heating the small components.

 

5)When the solder around the small component is melted, the small element is removed with a finger clamp.

 

( 2 ) Disassembly of SMD IC

1)Fixes the circuit board, carefully observes the position and orientation of the integrated circuit to be disassembled, and makes a record, in order to recover when welding.

 

2)Clean the impurities around the IC with a small brush, and add a little rosin water to the periphery of the SMD IC.

 

3)Adjust the temperature and wind speed of the hot air gun, the temperature switch is generally to 300 ~ 350. The nozzle and the integrated circuit are kept vertical, and the pins around the integrated circuit are rotated slowly, uniformly heating, and the pin solder of the integrated circuit is completely melted after that, the integrated circuit is lifted or tweeted with a small pin or a finger clamp, and can not be forced, otherwise, the tin foil of the integrated circuit can be easily damaged.

 

( 3 ) Safety Note

 

1)The temperature should not exceed 300.

 

2)Do not play with electric iron during the operation.

 

3)Do not dump the tin on the iron head, to prevent injury to others.

 

This article is from Allicdata Electronics Limited