Wave soldering technology
Manual dip welding is carried out by professional operators holding clamps,clamping the printed circuit boards which have been plugged into components,and immersing them in the solder bath at a certain angle to complete the welding process,it can complete the welding of many welding points of the printed circuit board at one time automatic dip welding machine.
When the printed circuit board of the automatic dip welding machine has been inserted with components,the solder slot rises automatically when the printed circuit board is sent to the station by the conveyor belt,and the components on the board are printed the circuit board pad is completely immersed in the solder bath,and after sufficient time is maintained,the solder tank drops, disengages from the solder,and cools to form the solder joint,finish welding. Due to the continuous transmission of printed circuit boards,the relative movement of the pads and the solder is beneficial to the exclusion of the solder bath while dragging for a period of time and distance in addition to the air and flux volatile gas,increase the mixing effect.
Wave soldering technology
The basic principles of wave soldering,as shown in Figure 2-1-23 and Figure 2-1, 24, by the peak welding machine with the help of the role of the leaf pump,the molten liquid solder forms a specific shape of solder wave at the liquid level of the solder bath,and the printed circuit board with electronic components is arranged on the transmission chain in advance,through a certain angle and the depth of the investor through the solder peak,so as to realize the soft mechanical and electrical connection between the components pin and the printed circuit board pad lead welding.
The solder joint molding is shown in Figure 2-1-26,when the printed circuit board enters the front end of the solder wave peak A,the circuit board and the component pins are heated,and before leaving the peak surface B,the entire printed circuit board is immersed in the solder,that is,the solder bridge is connected,but at the moment of leaving B1-B2 at the end of the wave crest,a small amount of solder is adhered to the pad due to the wetting force,and due to the surface tension,shrinks to the minimum state at the center of the device pin at this time,the wetting force between the solder and the pad is greater than the cohesion of the solder between the two pads.Therefore,a full and round solder joint will be formed,and the excess solder between the pads of the printed circuit board will be printed away from the tail of the wave peak,due to the effect of gravity,down to the tin pan.