Allicdata Part #: | 2263R-ND |
Manufacturer Part#: |
2263R |
Price: | $ 3.12 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
Short Description: | BOARD LEVEL HEAT SINK |
More Detail: | Heat Sink TO-5 Aluminum 1.6W @ 60°C Top Mount |
DataSheet: | 2263R Datasheet/PDF |
Quantity: | 1000 |
1000 +: | $ 2.80335 |
Specifications
Series: | -- |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | TO-5 |
Attachment Method: | Bolt On |
Shape: | Cylindrical |
Length: | -- |
Width: | -- |
Diameter: | 0.318" (8.07mm) ID, 0.750" (19.05mm) OD |
Height Off Base (Height of Fin): | 0.437" (11.10mm) |
Power Dissipation @ Temperature Rise: | 1.6W @ 60°C |
Thermal Resistance @ Forced Air Flow: | 10.00°C/W @ 600 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Red Anodized |
Description
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks2263R application field and working principleHeat sinks are an important part of any electronic system. They serve the purpose of dissipating heat from components and keeping them cool. In some applications, the effectiveness of heat transfer from the component to the heat sink can be limited. In these cases it is necessary to add additional cooling surfaces to increase the surface area of contact. The 2263R heat sink was designed specifically for these types of applications.The 2263R is an extruded aluminum heat sink designed for high performance applications. The heat sink features an optimized fin structure which maximizes the heat transfer from the components to the heat sink. The fin structure consists of a series of closely spaced, deep fins interconnected by channels. This design creates a large surface area that is exposed to ambient air. The air passing through the fins helps to dissipate the heat more effectively to the surrounding air.The efficiency of heat transfer is improved by the use of a special heat conducting paste which is applied to the base of the heat sink. This paste helps to spread the heat more evenly across the base and also helps to reduce the thermal resistance of the interface between the components and the heat sink.The 2263R is designed for use in a variety of applications including computers, telecommunication systems, medical equipment and other electronic devices. The high performance and high efficiency of the heat sink make it especially suited forthermal management of high power components in these applications.The construction of the 2263R is also very robust. The extruded aluminum construction ensures excellent mechanical strength and rigidity. This makes it very resistant to shock and vibration, making it an ideal choice for applications where long-term reliable operation is required.The 2263R is a highly efficient and reliable heat sink for a wide range of applications. Its design combines performance, heat transfer efficiency and robust construction to ensure that it will provide the highest level of thermal management for high power components.The specific data is subject to PDF, and the above content is for reference
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