Allicdata Part #: | 3C1UL-ND |
Manufacturer Part#: |
3C1UL |
Price: | $ 54.05 |
Product Category: | Uncategorized |
Manufacturer: | Altech Corporation |
Short Description: | 3C1UL 1A CIRCUIT BREAKER C CHAR3 |
More Detail: | N/A |
DataSheet: | 3C1UL Datasheet/PDF |
Quantity: | 1000 |
4 +: | $ 49.14000 |
Series: | * |
Part Status: | Active |
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3C1UL Application Field and Working Principle
Applied field of 3C1UL refers to materials of high thermal conductivity, low thermal expansion coefficient, high chemical stability and mechanical strength, and low prices; as well as metal materials with a wide range of uses such as aluminum, copper, magnesium, iron, and titanium. In particular, aluminum is the most widely used material in this field, especially for automobiles, electronics, and machinery applications. It is known for its excellent heat dissipation and shock absorption capability, and can also be used in the manufacture of heat sinks, engine blocks, and other related components.
The working principle of 3C1UL is based on the thermal conductivity and thermal expansion coefficient of the material. Thermal conductivity refers to how much heat a material can absorb or dissipate. Thermal expansion coefficient is the expansion that occurs when a material is heated or cooled. The lower the thermal conductivity and thermal expansion coefficient of the material, the better it is for making products with a high level of heat resistance. The higher the thermal conductivity and thermal expansion coefficient of the material, the better it is for making products with superior thermal performance.
When the material is heated, its thermal expansion coefficient increases, resulting in expansion of the material. This expansion causes a reduction in the surface area of the material, which in turn causes a decrease in the amount of heat that is dissipated into the surrounding environment. When the material is cooled, its thermal expansion coefficient decreases, resulting in contraction of the material. This contraction causes an increase in the surface area of the material, which in turn increases the amount of heat that is dissipated into the surrounding environment.
The 3C1UL material can also be used in the manufacture of temperature-sensitive products such as semiconductors and circuit boards. By using this material, the heating and cooling rate of the product can be effectively controlled, allowing for a more efficient and accurate transfer of heat. In addition, the 3C1UL material can be used in die-casting processes and is ideal for making products with excellent heat transfer characteristics.
In summary, 3C1UL is an ideal material for making products with excellent heat resistance, thermal performance, and shock absorption capabilities. It has been widely used in application fields such as automobiles, electronics, and machinery, and is also ideal for making products with temperature-sensitive components, such as semiconductors and circuit boards. With its excellent thermal conductivity and thermal expansion coefficient, 3C1UL can effectively control the heating and cooling rate of the product, allowing for a more efficient and accurate transfer of heat.
The specific data is subject to PDF, and the above content is for reference
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