3D3.5UM Allicdata Electronics
Allicdata Part #:

3D3.5UM-ND

Manufacturer Part#:

3D3.5UM

Price: $ 37.42
Product Category:

Uncategorized

Manufacturer: Altech Corporation
Short Description: 3D3.5UM 3.5A CIRCUIT BREAKER D C
More Detail: N/A
DataSheet: 3D3.5UM datasheet3D3.5UM Datasheet/PDF
Quantity: 1000
4 +: $ 34.02000
Stock 1000Can Ship Immediately
$ 37.42
Specifications
Series: *
Part Status: Active
Description

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3D 3.5UM technology, also known as 3D Field Emission Scanning Electron Microscopy (FESEM) or 3D ultra-high resolution imaging, is an advanced imaging technique used to create detailed 3D images of various materials. By using a low-energy electron source, this technology is able to provide images with resolutions surpassing the capabilities of standard SEM (Scanning Electron Microscopy) procedures. It is capable of producing images with resolutions as small as 3.5 nanometers, thus greatly aiding in the investigation of materials with complex structures.The 3D 3.5UM technology utilizes the same operation as traditional SEMs, but with a few distinct differences. While traditional SEM processes involve the use of a focused electron beam to scan a surface and data is collected from the returned electrons, with 3D 3.5UM the electron beam is split into multiple beams and each beam is tuned to a different energy level. The multiple beams simultaneously scan multiple points on a surface and the returned data is combined to provide a 3D image of the surface. This allows for the imaging of surfaces with high lateral resolution, making it useful for material science and micromachining research.The 3D 3.5UM technology operates on a few principles that are unique to its imaging process. The first of these principles is the field emission process, which is similar to the one used in the construction of cathode ray tubes (CRTs) used in television sets. This process involves the use of an electrical field to accelerate electrons towards a focused point, from which they are released in a very controlled and uniform manner. This yields a precise and uniform electron beam, as opposed to the broad, unfocused beam generated by a traditional SEM source.The second principle behind 3D 3.5UM is the electron beam\'s reflection control. This is achieved by using an optical system which consists of several components, including an objective lens, condenser aperture, and detector. The objective lens focuses the electrons onto the surface of the material, while the condenser aperture determines the breadth of the electrons as they hit the surface. Finally, the detector is responsible for scanning the surface, and providing the data for creating the 3D image.Finally, the 3D 3.5UM technology also utilizes an algorithm for creating the 3D image. This algorithm, called a volume estimator, takes the data collected from the detector and reconstructs it into a 3D image. It uses multiple parameters such as contrast, brightness, and resolution to do this.3D 3.5UM technology has a wide range of applications in the fields of material science, biotechnology, forensics, and engineering. It is used to investigate the structure of materials, measure their physical characteristics and mechanical properties, and to examine the surface topography of surfaces with great precision. Additionally, because of its high resolution capabilities, it is also used for precise micromachining processes, as well as for 3D imaging of biological materials.In conclusion, 3D 3.5UM technology is an advanced imaging technique that is able to provide images with resolutions far surpassing those of standard SEM processes. It is able to do this by using multiple electron beams and a precise control over the electron source. This technology also utilizes several principles and components that make it possible, such as field emission, beam reflection control, and an algorithm for creating the 3D image. Finally, 3D 3.5UM has a wide range of applications in different fields, from material science and engineering to forensics and biotechnology.

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