50332-1162HLF Allicdata Electronics
Allicdata Part #:

50332-1162HLF-ND

Manufacturer Part#:

50332-1162HLF

Price: $ 11.29
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN RECEPT 3 ROW RA SOLDER
More Detail: N/A
DataSheet: 50332-1162HLF datasheet50332-1162HLF Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
72 +: $ 10.26020
Stock 1000Can Ship Immediately
$ 11.29
Specifications
Series: HPC™
Packaging: Tube 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Usage: --
Connector Type: Receptacle, Female Sockets
Connector Style: High Density (HDC, HDI, HPC)
Number of Positions: 162
Number of Positions Loaded: All
Pitch: 0.100" (2.54mm)
Number of Rows: 3
Number of Columns: 54
Mounting Type: Through Hole
Termination: Solder
Contact Layout, Typical: --
Features: Mating Guide
Contact Finish: Gold or Gold, GXT™
Contact Finish Thickness: 30.0µin (0.76µm)
Color: Black
Current Rating: --
Material Flammability Rating: UL94 V-0
Operating Temperature: --
Voltage Rating: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction:

The 50332-1162HLF is a specialized backplane connector that provides a reliable and robust interconnection in a range of applications. The design of this connector ensures optimal performance in a range of temperature and humidity environments, making it suitable for many types of industries. This article will discuss the application field and working principle of the 50332-1162HLF backplane connector.

Application Field:

The 50332-1162HLF is designed for a variety of applications including computers, internet equipment, telecommunication systems, and any other backplane environment. It is especially well suited for use in industrial applications, where it can provide reliable radio frequency interference (RFI) protection and environmental resistance. The connector offers good protection against corrosion and humidity, and is designed to operate in a wide range of temperatures.

The 50332-1162HLF connector has a high-density, multi-pin layout which makes it an excellent choice for use in a number of different types of electronics. The dense pins allow for an increased amount of signal transfers in a smaller physical space. This makes the connector ideal for applications such as the connection of the internal PCBs of a motherboard, and the connection between the backplane and the CPU, memory, and expansion cards.

Working Principle:

The 50332-1162HLF backplane connector uses a high-pressure clip-on method for device connection and disconnection. The clip-on mechanism consists of a male side with spring-loaded pins, and a female side with self-aligning pins. This method ensures that electrical contact is made without the need for manual alignment of the pins.

The connector also comes with a self-locking feature that helps to hold the connector together. A locking mechanism is triggered when the connector is inserted, which secures the connection for a reliable contact. This also allows for easy removal of the connector when the system is shut down or needs to be moved.

In order to ensure that the 50332-1162HLF backplane connector operates correctly and offers maximum compliance, it has been designed to adhere to the IEEE 802.3 standards. This means that the connector has a robust design that provides a high level of electrical performance and EMI/RFI protection.

Conclusion:

The 50332-1162HLF is a specialized backplane connector designed for high-density applications. It is capable of providing a reliable and robust interconnection in a wide range of temperatures and environments. The connector also has a self-locking mechanism and complies with the IEEE 802.3 standards, offering a high level of electrical performance and EMI/RFI protection. The 50332-1162HLF backplane connector is an ideal choice for industrial applications and electronic systems.

The specific data is subject to PDF, and the above content is for reference

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