508222B00000 Allicdata Electronics
Allicdata Part #:

508222B00000-ND

Manufacturer Part#:

508222B00000

Price: $ 1.37
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: BOARD LEVEL HEAT SINK
More Detail: Heat Sink TO-220 (Dual) Aluminum 9.0W @ 50°C Board...
DataSheet: 508222B00000 datasheet508222B00000 Datasheet/PDF
Quantity: 1000
4000 +: $ 1.22604
Stock 1000Can Ship Immediately
$ 1.37
Specifications
Series: --
Part Status: Active
Type: Board Level
Package Cooled: TO-220 (Dual)
Attachment Method: Bolt On
Shape: Rectangular, Fins
Length: 1.780" (45.21mm)
Width: 1.780" (45.21mm)
Diameter: --
Height Off Base (Height of Fin): 1.000" (25.40mm)
Power Dissipation @ Temperature Rise: 9.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 900 LFM
Thermal Resistance @ Natural: 7.40°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are an effective way to reduce heat loads, thus protecting the components of an electronic device from excessive heat damage. The 508222B00000 is a high quality, powerful thermal - heat sink that is available in a wide array of sizes and styles. It consists of a heat sink frame, a heat sink base, and a heat sink fan. The functionality of the 508222B00000 primarily lies in its ability to dissipate large amounts of heat from electronic components and devices.

Design

The 508222B00000 has been designed to deliver maximum thermal performance, even when handling extreme temperature ranges. It features a low profile design, consisting of a solid base and frame with integrated air channels to cover the entire component surface. This maximizes airflow to reduce thermal resistance and ensure uniform cooling. The fan blades operate in a counter-clockwise rotation and the system is designed for vertical mount installation. The 508222B00000 is also constructed of high quality aluminum alloy, making it an ideal choice for use in harsh operating environments.

Principles and Structure

The 508222B00000 operates on the principle of thermal conduction to transfer heat away from components. It is constructed with multiple layers of aluminum to effectively dissipate heat, operating on the same principle as natural convection. Heat is conducted away from the component surface and transferred through the multiple layers of aluminum. The heat is then dissipated into the surrounding environment.

Working Applications

The 508222B00000 is well suited for the thermal management of electronic components and assemblies in a wide range of applications. It can be used in the hermetic sealing of electronics in military and medical specifications. Additionally, it is designed to provide superior thermalperformance in applications that demand low profile thermal management such as space-constrained applications or where high power components are housed in an open or ventilated system.

Benefits

The 508222B00000 is an efficient and economical means of thermal management for a variety of devices and applications. It features a lightweight design, easy installation, and dissipates heat faster than other fans. The 508222B00000 also offers vibration-free operation, which ensures stability in demanding temperature environments. Additionally, its versatile design allows for the integration of other devices, such as LEDs, transistors, voltage regulators, and more.

Conclusion

The 508222B00000 is a highly efficient, versatile, and economical thermal management solution for a variety of electronics. It effectively dissipates heat and is available in numerous sizes and styles. It is designed for vertical mount installation and is constructed of high quality aluminum alloy, making it effective for extreme temperatures. Additionally, its lightweight design, easy installation, and vibration-free operation make the 508222B00000 an optimal choice for thermal management applications.

The specific data is subject to PDF, and the above content is for reference

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